Micro device integration into system substrate
This disclosure is related to post processing steps for integrating of micro devices into system (receiver) substrate or improving the performance of the micro devices after transfer. Post processing steps for additional structure such as reflective layers, fillers, black matrix or other layers may be used to improve the out coupling or confining of the generated LED light. In another example, dielectric and metallic layers may be used to integrate an electro-optical thin film device into the system substrate with the transferred micro devices. In another example, color conversion layers are integrated into the system substrate to create different output from the micro devices.
1. An integrated optical system comprising a plurality of pixels, each pixel comprising:
a receiver substrate;
a light emitting micro device integrated on the receiver substrate, the light emitting micro device including:
a lower electrode on the receiver substrate;
a light emitting portion; and
an upper electrode on the light emitting portion, the upper electrode being transparent to light from the light emitting portion;
a planarization or bank region surrounding the light emitting micro device; and
a thin-film light emitting electro-optical device, at least a portion of which is mounted on the planarization or bank region, the thin-film light emitting electro-optical device having:
a bottom electrode on the planarization or bank region, the bottom electrode including:
a bonding pad on the receiver substrate;
a first portion extending parallel to the receiver substrate; and
a second portion extending from the bonding pad through the planarization or bank region to the first portion including a first reflective material for preventing light from entering adjacent pixels;
a thin-film light emitting layer; and
a top electrode on the thin-film light emitting layer,
wherein the lower electrode has a second reflective material for directing light from the light emitting micro device and the thin-film light emitting electro-optical device in a same direction through the upper electrode.
2. The system according to claim 1 , wherein the top electrode includes a third reflective material for directing light from the light emitting micro device and the thin-film light emitting electro-optical device in a same direction through the receiver substrate.
3. The system according to claim 1 , wherein the thin-film light emitting layer includes a third reflective material for directing light from the light emitting micro device and the thin-film light emitting electro-optical device in a same direction through the receiver substrate.
4. The system according to claim 1 , wherein the planarization or bank region includes a concave reflective structure for reflecting light from the micro device in a desired direction.
5. The system according to claim 1 , wherein the light emitting micro device further includes a bank layer over the upper electrode for insulating the upper electrode from the thin-film light emitting electro optical device.
6. The system according to claim 5 , wherein the bank layer includes an opening therethrough to enable light to travel through to the top electrode.
7. The system according to claim 1 ,
wherein the top electrode extends through an opening in the thin-film light emitting layer into contact with the light emitting portion.
8. The system according to claim 1 , wherein the bottom electrode, the thin-film light emitting layer, and the top electrode extend over the light emitting micro device; and
wherein at least one of the bottom electrode, the thin-film light emitting layer, and the top electrode includes an opening therethrough to enable light to travel through the top electrode.
9. The system according to claim 1 , further comprising a color filter mounted on the receiver substrate for receiving light from the thin-film light emitting electro-optical device.
10. The system according to claim 1 , wherein the light emitting micro device and the thin-film light emitting electro-optical device are mounted side by side on the receiver substrate.
11. The system according to claim 10 , wherein the light emitting portion is surrounded by the planarization or bank region;
wherein the bottom electrode is mounted on the receiver substrate, and the thin-film light emitting layer is surrounded by the planarization or bank region; and
wherein a common top electrode extends across both the light emitting portion and the thin-film emitting layer.
12. The system according to claim 11 , wherein the planarization or bank region includes a concave structure for directing the light from the micro device in a desired direction.
13. The system according to claim 10 , wherein the lower electrode is mounted on the receiver substrate, and the light emitting portion is surrounded by the planarization or bank region;
wherein the bottom electrode is mounted on the receiver substrate, the thin-film light emitting layer is surrounded by the planarization or bank region, and the top electrode extends across the light emitting portion and the thin-film light emitting layer; and
wherein the top electrode is insulated from the light emitting portion and includes a concave structure for directing the light from the micro device in a desired direction.
14. The system according to claim 1 , wherein the planarization or bank region comprises a dielectric for electrically isolating at least a portion of the light emitting micro device from the thin-film light emitting electro-optical device.