DUT placement and handling for active thermal interposer device

1. A method of placing a system-in-package device under test (DUT) in a socket using an automated handler system, said method comprising:

using a handler, automatically picking up said DUT from a tray and automatically placing said DUT into a socket, wherein said DUT is secured within said socket via first retention features disposed within said socket; and

using said handler, automatically picking up an active thermal interposer device and automatically placing said active thermal interposer device on top of said DUT within said socket, wherein said active thermal interposer device is secured within said socket via second retention features disposed within said socket and wherein further if said active thermal interposer device is placed within said socket by said handler and said DUT is not within said socket, then said first and second retention features are operable to prevent said active thermal interposer device from contacting pins of said socket.

2. The method of claim 1 wherein said active thermal interposer device comprises:

a body layer;

a first surface; and

a second surface, wherein said first surface is operable to be disposed adjacent to a cold plate.

3. The method of claim 2 wherein said active thermal interposer device comprises a plurality of heating zones defined across the second surface of said body layer, said plurality of heating zones operable to be controlled by a thermal controller to selectively heat and maintain respective temperatures thereof, said plurality of heating zones operable to heat a plurality of areas of the DUT when said second surface of said body layer is disposed adjacent to an interface surface of said DUT during testing of said DUT.

4. The method of claim 3 wherein each heating zone of said plurality of heating zones comprises resistive traces for providing heat responsive to a voltage/current signal applied thereto as controlled by said thermal controller.

5. The method of claim 3 wherein said body layer further comprises a plurality of pogo pin mechanical/electrical interfaces for mating with a thermal array, said plurality of pogo pin mechanical/electrical interfaces operable to input voltage/current signals from said thermal array for supply to said plurality of heating zones and also operable to output temperature sensor data corresponding to said plurality of heating zones.

6. The method of claim 3 wherein said active thermal interposer device further comprises a grounded shield layer disposed on top of said second surface of said body layer and on top of said plurality of heating zones, said grounded shield layer operable to isolate said BUT from electro-magnetic interference radiation resultant from energizing heating zones of said plurality of heating zones.

7. The method of claim 3 wherein said active thermal interposer device further comprises alignment features disposed on said first surface, said alignment features for providing alignment between power pins of said active thermal interposer device and pads of a thermal head of said tester system, and wherein said thermal head comprises said cold plate.

8. The method of claim 7 wherein said alignment features comprise micro-alignment bushings.

9. The method of claim 1 wherein said active thermal interposer device comprises a two dimensional identification code viewable thereon and wherein said two dimensional identification code is operable to be machine read and comprises one of:

identification information for identifying the active thermal interposer device; and

security information for authenticating the active thermal interposer device.

10. A method of handling an integrated circuit device under test (DUT) using an automated handler system, said method comprising:

using said handler system, automatically picking up a DUT from a tray;

using said handler system, automatically placing said DUT into a socket, wherein said DUT is secured therein via first retention features;

using said handler system, automatically picking up an active thermal interposer device; and

using said handler system, automatically placing said active thermal interposer device on top of said DUT within said socket, wherein said active thermal interposer device is secured via second retention features and wherein further, said first and second retention features are operable to prevent said active thermal interposer device from contacting; pins of said socket for cases in which said DUT is not positioned within said socket.

11. The method of claim 10 wherein said active thermal interposer device comprises:

a body layer;

a first surface; and

a second surface, wherein said first surface is operable to be disposed adjacent to a cold plate.

12. The method of claim 11 wherein said active thermal interposer device further comprises a plurality of heating zones defined across said second surface of said body layer and further comprising controlling said plurality of heating zones by a thermal controller to selectively heat and maintain respective temperatures thereof; wherein said plurality of heating zones are operable to heat a plurality of areas of the DUT when said second surface of said body layer is disposed adjacent to an interface surface of said DUT during said testing thereof.

13. The method of claim 12 wherein each heating zone of said plurality of heating zones comprises resistive traces for heating responsive to an electronic signal applied thereto as controlled by said thermal controller.

14. The method of claim 12 wherein said body layer further comprises a plurality of pogo pin mechanical/electrical interfaces for mating with a thermal array, said plurality of pogo pin mechanical/electrical interfaces operable to input electronic signals from said thermal array for supply to said plurality of heating zones and also operable to output temperature sensor data corresponding to said plurality of heating zones.

15. The method of claim 12 wherein said active thermal interposer device further comprises a grounded shield layer disposed on top of said second surface of said body layer and on top of said plurality of heating zones, said grounded shield layer operable to isolate said DUT from electro-magnetic interference radiation resultant from energizing heating zones of said plurality of heating zones.

16. The method of claim 12 wherein said active thermal interposer device further comprises alignment features disposed on said first surface and operable for providing alignment between power pins of said active thermal interposer device and pads of a thermal head of said tester system, and wherein said thermal head comprises said cold plate.

17. The method of claim 16 wherein said alignment features comprise micro-alignment bushings.

18. The method of claim 10 wherein said active thermal interposer device comprises a two dimensional identification code viewable thereon and operable to be machine read and comprises one of:

identification information for identifying the active thermal interposer device; and

security information for authenticating the active thermal interposer device.

19. A method of testing an integrated circuit device under test (DUT) performed by an automated handler system and a tester system, said method comprising:

automatically picking up a DUT from a tray;

automatically placing said DUT into a socket, wherein said DUT is secured therein via first retention features;

automatically picking up an active thermal poser device; and

automatically placing said active thermal interposer device on top of said DUT within said socket; wherein said active thermal interposer device is secured via second retention features and wherein further;

said first and second retention features preventing said active thermal interposer device from contacting pins of said socket for cases in which said DUT is not positioned within said socket; and

using said tester system, testing said DUT secured within said socket and contemporaneously controlling temperatures of said active thermal interposer device.

20. The method of claim 19 wherein said active thermal interposer device comprises:

a body layer;

a first surface; and

a second surface, wherein said first surface is operable to be disposed adjacent to a cold plate.

21. The method of claim 20 wherein said active thermal interposer device further comprises a plurality of heating zones defined across said second surface of said body layer and further comprising controlling said plurality of heating zones by a thermal controller to selectively heat and maintain respective temperatures thereof, wherein said plurality of heating zones are operable to heat a plurality of areas of the DUT when said second surface of said body layer is disposed adjacent to an interface surface of said DUT during said testing thereof.

22. The method of claim 21 wherein said body layer further comprises a plurality of pogo pin mechanical/electrical interfaces for mating with a thermal array, said plurality of pogo pin mechanical/electrical interfaces operable to input electronic signals from said thermal array for supply to said plurality of heating zones and also operable to output temperature sensor data corresponding to said plurality of heating zones.

23. The method of claim 21 wherein said active thermal interposer device further comprises a grounded shield layer disposed on top of said second surface of said body layer and on top of said plurality of heating zones, said grounded shield layer operable to isolate said DUT from electro-magnetic interference radiation resultant from energizing heating zones of said plurality of heating zones.

24. The method of claim 21 wherein said active thermal interposer device further comprises a two dimensional identification code viewable thereon and operable to be machine read and comprises one of:

identification information for identifying the active thermal interposer device; and

security information for authenticating the active thermal interposer device.