IP Library › Granted Patent US 12,320,852
Granted Patent B2
US 12,320,852 · App. 18/330,222 · Granted Jun 3, 2025

Passive carrier-based device delivery for slot-based high-volume semiconductor test system

Inventors: Karthik Ranganathan (Foothill Ranch, CA); Gregory Cruzan (San Jose, CA); Samer Kabbani (San Jose, CA); Gilberto Oseguera (Corona, CA); Ira Leventhal (San Jose, CA); Hiroki Ikeda (Kukishi Saitama, JP); Toshiyuki Kiyokawa (Kukishi Saitama, JP)
Assignee: Advantest Test Solutions, Inc.
G01R31/31905G01R31/31907
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 12,320,852
App. No.
18/330,222
Granted
Jun 3, 2025
Kind
B2
Abstract

A testing apparatus comprises a tester comprising a plurality of racks, wherein each rack comprises a plurality of slots, wherein each slot comprises: (a) an interface board affixed in a slot of a rack, wherein the interface board comprises test circuitry and a plurality of sockets, each socket operable to receive a device under test (DUT); and (b) a carrier comprising an array of DUTs, wherein the carrier is operable to displace into the slot of the rack, and wherein each DUT in the array of DUTs aligns with a respective socket of the plurality of sockets on the interface board. The testing apparatus further comprises a pick-and-place mechanism for loading the array of DUTs into the carrier and an elevator for transporting the carrier to the slot of the rack.

Claims (34)

1. A testing apparatus comprising:

a plurality of test slots vertically arranged, wherein each test slot comprises circuitry to test a device under test (DUT) and at least one socket; and

a carrier comprising at least one membrane pocket operable to hold the DUT; where the carrier is operable to be inserted in a test slot of the test slots vertically arranged to facilitate a testing arrangement, wherein the testing arrangement comprises the DUT pushed through the at least one membrane pocket to make electrical and physical contact with the least one socket of the test slot.

2. The testing apparatus of claim 1 , wherein each test slot further comprises at least one actuator aligned at a vertical spacing relative to the at least one socket.

3. The testing apparatus of claim 2 , wherein each test slot further comprises at least one socket cover positioned below the at least one actuator.

4. The testing apparatus of claim 3 , wherein the least one actuator is operable to press the at least one socket cover on a top of the DUT to push through the at least one membrane pocket to make electrical and physical contact with the least one socket.

5. The testing apparatus of claim 4 , wherein the least one socket, the carrier, and the at least one socket cover together form an RF shield around the DUT.

6. The testing apparatus of claim 2 , wherein each test slot further comprises at least one package-on-package (POP) structure positioned below the at least one actuator.

7. The testing apparatus of claim 6 , wherein the least one actuator is operable to press the at least one POP structure to electrically connect with a top of the DUT to push through the at least one membrane pocket to make electrical and physical contact with the least one socket.

8. A testing apparatus comprising:

a plurality of test slots vertically arranged, wherein each test slot comprises:

circuitry to test a device under test (DUT),

at least one socket, and

a moveable carrier operable to facilitate a testing arrangement and comprising at least one membrane pocket operable to hold the DUT;

wherein the testing arrangement comprises the DUT pushed through the at least one membrane pocket to make electrical and physical contact with the least one socket of each test slot.

9. The testing apparatus of claim 8 , wherein each test slot further comprises at least one actuator aligned at a vertical spacing relative to the at least one socket.

10. The testing apparatus of claim 9 , wherein each test slot further comprises at least one socket cover positioned below the at least one actuator.

11. The testing apparatus of claim 10 , wherein the least one actuator is operable to press the at least one socket cover on a top of the DUT to push through the at least one membrane pocket to make electrical and physical contact with the least one socket.

12. The testing apparatus of claim 11 , wherein the least one socket, the moveable carrier, and the at least one socket cover together form an RF shield around the DUT.

13. The testing apparatus of claim 9 , wherein each test slot further comprises at least one package-on-package (POP) structure positioned below the at least one actuator.

14. The testing apparatus of claim 13 , wherein the least one actuator is operable to press the at least one POP structure to electrically connect with a top of the DUT to push through the at least one membrane pocket to make electrical and physical contact with the least one socket.

15. A method comprising:

inserting a carrier into a test slot of a plurality of test slots vertically arranged, wherein the carrier comprises at least one membrane pocket operable to hold a device under test (DUT); and

creating a testing arrangement comprising the DUT pushed through the at least one membrane pocket to make electrical and physical contact with a socket of the test slot of the test slots vertically arranged.

16. The method of claim 15 , wherein the creating comprises:

actuating a socket cover positioned above the socket to press a top of the DUT to push through the at least one membrane pocket to make electrical and physical contact with the socket.

17. The method of claim 16 , wherein the socket, the carrier, and the socket cover together form an RF shield around the DUT.

18. The method of claim 15 , wherein the creating comprises:

actuating a package-on-package (POP) structure positioned above the socket to press and to electrically connect with a top of the DUT to push through the at least one membrane pocket to make electrical and physical contact with the socket.

19. The method of claim 18 , further comprising:

testing the DUT and the POP structure together.

20. The method of claim 15 , further comprising:

removing the carrier from the test slot of the test slots vertically arranged if the DUT is completed with testing; and

re-inserting the carrier into the test slot of the test slots vertically arranged with an untested DUT.

Continuity (3)
Continuation 17479808 · Sep 20, 2021
Provisional Application 63108792 · Nov 2, 2020
Related Publication 20230314512A1 · Oct 5, 2023
References Cited (164)
US 5126656A · Jones · 1992 [cited by applicant]
US 5164661A · Jones · 1992 [cited by applicant]
US 5239093A · Cheng · 1993 [cited by applicant]
US 5315240A · Jones · 1994 [cited by applicant]
US 5329093A · Okano · 1994 [cited by applicant]
US 5420521A · Jones · 1995 [cited by applicant]
US 5722514A · Kiyokawa · 1998 [cited by examiner]
US 5738531A · Beaman et al. · 1998 [cited by applicant]
US 5821505A · Tustaniwskyj et al. · 1998 [cited by applicant]
US 5909657A · Onishi et al. · 1999 [cited by applicant]
US 6184504B1 · Cardella · 2001 [cited by applicant]
US 6359264B1 · Schaper et al. · 2002 [cited by applicant]
US 6389225B1 · Malinoski et al. · 2002 [cited by applicant]
US 6452113B2 · Dibene et al. · 2002 [cited by applicant]
US 6498899B2 · Malinoski et al. · 2002 [cited by applicant]
US 6507205B1 · Dibish et al. · 2003 [cited by applicant]
US 6515470B2 · Suzuki et al. · 2003 [cited by applicant]
US 6668570B2 · Wall et al. · 2003 [cited by applicant]
US 6711904B1 · Law et al. · 2004 [cited by applicant]
US 6825681B2 · Feder et al. · 2004 [cited by applicant]
US 6862405B2 · Malinoski et al. · 2005 [cited by applicant]
US 6985000B2 · Feder et al. · 2006 [cited by applicant]
US 7042240B2 · Lopez et al. · 2006 [cited by applicant]
US 7126217B2 · Chiu et al. · 2006 [cited by applicant]
US 7138811B1 · Mahoney et al. · 2006 [cited by applicant]
US 7151388B2 · Gopal et al. · 2006 [cited by applicant]
US 7311782B2 · Strang et al. · 2007 [cited by applicant]
US 7355428B2 · Kabbani et al. · 2008 [cited by applicant]
US 7411792B2 · Richards et al. · 2008 [cited by applicant]
US 7436059B1 · Ouyang · 2008 [cited by applicant]
US 7519880B1 · Johnson et al. · 2009 [cited by applicant]
US 7626407B2 · Kabbani · 2009 [cited by applicant]
US 7646596B2 · Ng · 2010 [cited by applicant]
US 7659738B2 · Hong · 2010 [cited by applicant]
US 7726145B2 · Nakamura · 2010 [cited by applicant]
US 7755899B2 · Stenmark · 2010 [cited by applicant]
US 7781883B2 · Sri-Jayantha et al. · 2010 [cited by applicant]
US 7830164B2 · Earle et al. · 2010 [cited by applicant]
US 7848106B2 · Merrow · 2010 [cited by applicant]
US 7929303B1 · Merrow · 2011 [cited by applicant]
US 8343280B2 · Iimuro · 2013 [cited by applicant]
US 8558540B2 · Wu et al. · 2013 [cited by applicant]
US 8653843B2 · Ando et al. · 2014 [cited by applicant]
US 8772682B2 · Ambal et al. · 2014 [cited by applicant]
US 8927907B2 · Fink et al. · 2015 [cited by applicant]
US 8970244B2 · Di Stefano et al. · 2015 [cited by applicant]
US 9080820B2 · Bolton · 2015 [cited by applicant]
US 9291667B2 · Armstrong et al. · 2016 [cited by applicant]
US 9307578B2 · Pease · 2016 [cited by applicant]
US 9310145B2 · Colongo et al. · 2016 [cited by applicant]
US 9354272B2 · Teoh · 2016 [cited by examiner]
US 9414526B2 · Mann et al. · 2016 [cited by applicant]
US 9494353B2 · Yu et al. · 2016 [cited by applicant]
US 9594113B2 · Davis · 2017 [cited by examiner]
US 9709622B2 · Lopez et al. · 2017 [cited by applicant]
US 9766287B2 · Narasaki et al. · 2017 [cited by applicant]
US 9841772B2 · Bucher · 2017 [cited by applicant]
US 10056225B2 · Gaff et al. · 2018 [cited by applicant]
US 10126356B2 · Barabi et al. · 2018 [cited by applicant]
US 10163668B2 · Steinhauser · 2018 [cited by applicant]
US 10354785B2 · Yamaguchi et al. · 2019 [cited by applicant]
US 10656200B2 · Cruzan · 2020 [cited by examiner]
US 10775408B2 · Carvalho et al. · 2020 [cited by applicant]
US 10908207B2 · Barabi et al. · 2021 [cited by applicant]
US 10955466B2 · Tsai et al. · 2021 [cited by applicant]
US 10983145B2 · Akers et al. · 2021 [cited by applicant]
US 11143697B2 · Wolff · 2021 [cited by examiner]
US 11493551B2 · Ranganathan · 2022 [cited by examiner]
US 11587640B2 · Ranganathan · 2023 [cited by examiner]
US 11742055B2 · Ranganathan · 2023 [cited by examiner]
US 11754620B2 · Kabbani · 2023 [cited by examiner]
US 11821913B2 · Ranganathan · 2023 [cited by examiner]
US 12174248B2 · Ranganathan · 2024 [cited by examiner]
US 20020026258A1 · Suzuki et al. · 2002 [cited by applicant]
US 20020118032A1 · Norris et al. · 2002 [cited by applicant]
US 20030155939A1 · Lutz et al. · 2003 [cited by applicant]
US 20040017185A1 · Song et al. · 2004 [cited by applicant]
US 20050026476A1 · Mok et al. · 2005 [cited by applicant]
US 20050086948A1 · Milke-Rojo et al. · 2005 [cited by applicant]
US 20050103034A1 · Hamilton et al. · 2005 [cited by applicant]
US 20050151553A1 · Kabbani et al. · 2005 [cited by applicant]
US 20050169733A1 · Drynkin et al. · 2005 [cited by applicant]
US 20060158207A1 · Reitinger · 2006 [cited by applicant]
US 20060290370A1 · Lopez · 2006 [cited by applicant]
US 20090160472A1 · Segawa et al. · 2009 [cited by applicant]
US 20090218087A1 · Oshima · 2009 [cited by applicant]
US 20100042355A1 · Aube et al. · 2010 [cited by applicant]
US 20100052708A1 · Ribeiro et al. · 2010 [cited by applicant]
US 20110050268A1 · Co et al. · 2011 [cited by applicant]
US 20110074080A1 · DiStefano et al. · 2011 [cited by applicant]
US 20130181576A1 · Shiozawa et al. · 2013 [cited by applicant]
US 20130285686A1 · Malik et al. · 2013 [cited by applicant]
US 20140035715A1 · Takahashi et al. · 2014 [cited by applicant]
US 20140251214A1 · Cuvalc et al. · 2014 [cited by applicant]
US 20150028908A1 · Kushnick et al. · 2015 [cited by applicant]
US 20150028912A1 · Cho et al. · 2015 [cited by applicant]
US 20150137842A1 · Murakami et al. · 2015 [cited by applicant]
US 20150168450A1 · Wooden et al. · 2015 [cited by applicant]
US 20150226794A1 · Chen · 2015 [cited by applicant]
US 20160084880A1 · LoCicero et al. · 2016 [cited by applicant]
US 20160247552A1 · Kim et al. · 2016 [cited by applicant]
US 20160351526A1 · Boyd et al. · 2016 [cited by applicant]
US 20170059635A1 · Orchanian et al. · 2017 [cited by applicant]
US 20170102409A1 · Sarhad et al. · 2017 [cited by applicant]
US 20180024188A1 · Cruzan et al. · 2018 [cited by applicant]
US 20180189159A1 · Carmichael et al. · 2018 [cited by applicant]
US 20180218926A1 · Stuckey et al. · 2018 [cited by applicant]
US 20190064254A1 · Bowyer et al. · 2019 [cited by applicant]
US 20190064261A1 · Bowyer et al. · 2019 [cited by applicant]
US 20190162777A1 · Chiang et al. · 2019 [cited by applicant]
US 20190271719A1 · Sterzbach · 2019 [cited by applicant]
US 20190310314A1 · Liu et al. · 2019 [cited by applicant]
US 20190346482A1 · Kiyokawa et al. · 2019 [cited by applicant]
US 20200041564A1 · Cojocneanu et al. · 2020 [cited by applicant]
US 20200174053A1 · Gondi et al. · 2020 [cited by applicant]
US 20200363104A1 · MacDonald et al. · 2020 [cited by applicant]
US 20200371155A1 · Walczyk et al. · 2020 [cited by applicant]
US 20210071917A1 · Pei et al. · 2021 [cited by applicant]
US 20210183668A1 · Cagle et al. · 2021 [cited by applicant]
US 20210293495A1 · Barako et al. · 2021 [cited by applicant]
US 20210366771A1 · Sreenivasan et al. · 2021 [cited by applicant]
US 20210396801A1 · Ranganathan et al. · 2021 [cited by applicant]
US 20220044084A1 · Cardy · 2022 [cited by applicant]
US 20220082587A1 · Gopal et al. · 2022 [cited by applicant]
US 20220128597A1 · McKenna et al. · 2022 [cited by applicant]
US 20220128599A1 · Campbell et al. · 2022 [cited by applicant]
US 20220137092A1 · Ranganathan et al. · 2022 [cited by applicant]
US 20220137129A1 · Ranganathan et al. · 2022 [cited by applicant]
US 20220206061A1 · Ranganathan et al. · 2022 [cited by applicant]
US 20220284982A1 · Ranganathan et al. · 2022 [cited by applicant]
CN 101073016 · 2007 [cited by applicant]
CN 102109537 · 2011 [cited by applicant]
CN 103038751 · 2013 [cited by applicant]
CN 105144114 · 2015 [cited by applicant]
CN 109716513 · 2019 [cited by applicant]
CN 110214270 · 2019 [cited by applicant]
CN 110618903 · 2019 [cited by applicant]
EP 3270261A1 · 2018 [cited by applicant]
JP 2005156172A · 2005 [cited by applicant]
JP 2008275512A · 2008 [cited by applicant]
TW 446682 · 2001 [cited by applicant]
TW 200535440 · 2005 [cited by applicant]
TW 200620596 · 2006 [cited by applicant]
TW 200628818 · 2006 [cited by applicant]
TW 201226579 · 2012 [cited by applicant]
TW 201229535 · 2012 [cited by applicant]
TW 201323883A · 2013 [cited by applicant]
TW 201333497 · 2013 [cited by applicant]
TW 201447325 · 2014 [cited by applicant]
TW 201504647A · 2015 [cited by applicant]
TW 201608254A · 2016 [cited by applicant]
TW 201636618A · 2016 [cited by applicant]
TW 201712459 · 2017 [cited by applicant]
TW 201834134 · 2018 [cited by applicant]
TW 201840996 · 2018 [cited by applicant]
TW I651540 · 2019 [cited by applicant]
TW 202004980 · 2020 [cited by applicant]
TW 202043787 · 2020 [cited by applicant]
WO 2016122039A1 · 2016 [cited by applicant]
WO 2017015052 · 2017 [cited by applicant]
WO 2017039936 · 2017 [cited by applicant]
WO 2017112076A1 · 2017 [cited by applicant]
WO 2020159954 · 2020 [cited by applicant]
Ranganathan et al., “D517: Shielded Socket and Carrier for High-Volume Test of Semiconductor Devices,” Sep. 30, 2021, pp. 1-12. [cited by applicant]