Cluster processing system for forming a transition metal material
Methods for forming a transition metal material on a substrate and thermal processing such metal containing material in a cluster processing system are provided. In one embodiment, a method for a device structure for semiconductor devices includes forming a two-dimensional transition metal dichalcogenide layer on a substrate in a first processing chamber disposed in a cluster processing system, thermally treating the two-dimensional transition metal dichalcogenide layer to form a treated metal layer in a second processing chamber disposed in the cluster processing system, and forming a capping layer on the treated metal layer in a third processing chamber disposed in the cluster processing system.
1. A method for a device structure for semiconductor devices, comprising:
forming a film from a two-dimensional transition metal dichalcogenide and a process gas from a group consisting of 1,2-ethanedithiol, dimethyldisulfide, diethyldisulfide, and diethylsulfide, wherein the film is formed on a substrate in a first processing chamber disposed in a cluster processing system;
thermally treating the film to form a treated metal layer in a second processing chamber disposed in the cluster processing system, wherein the thermal treatment removes carbon from the film leaving only sulfur from the process gas and metal from a metal precursor to form a MX 2 compound, wherein M comprises molybdenum (Mo) or tungsten (W) and X comprises sulfur (S); and
forming a capping layer on the MX 2 compound in a third processing chamber disposed in the cluster processing system.
2. The method of claim 1 , wherein the two-dimensional transition metal dichalcogenide is at least one of MoS 2 , and WS 2 .
3. The method of claim 1 , wherein the two-dimensional transition metal dichalcogenide is formed from an atomic layer deposition process.
4. The method of claim 1 , wherein the capping layer is formed from a chemical vapor deposition process.
5. The method of claim 1 , wherein the capping layer is at least one of SiN, SiO 2 , SiON, SiC, SiOC, HfO 2 , ZrO 2 and Al 2 O 3 .
6. The method of claim 1 , wherein thermally treating the film further comprises:
maintaining a substrate temperature between about 600 degrees Celsius and about 1500 degree Celsius.
7. The method of claim 1 , wherein forming the film further comprises:
supplying a deposition gas mixture including a metal containing precursor and a reacting gas, wherein the metal containing precursor is selected from a group consisting of Mo(NMe 2 ) 4 , MoCl 5 , MoF 6 , tetramethylheptane-3,5-dionato (Mo(thd) 3 ), Mo(CO) 6 , WF 6 and W 2 (NMe 2 ) 6 .
8. The method of claim 7 , wherein the deposition gas mixture includes Mo(CO) 6 and H 2 S or diethylsulfide.
9. The method of claim 1 , wherein thermally treating the film further comprises:
converting the two-dimensional transition metal dichalcogenide to a crystalline state.
10. The method of claim 1 , further comprising:
pre-cleaning the substrate in a pre-cleaning chamber incorporated in the cluster processing system prior to forming the organic film.
11. The method of claim 10 , wherein the substrate is pre-cleaned by a remote plasma source generated from a hydrogen containing gas mixture in the pre-cleaning chamber.
12. The method of claim 1 , wherein the treated metal layer and the capping layer are formed in the cluster processing chamber without breaking vacuum.
13. The method of claim 1 , wherein the capping layer is at least one of SiN, SiO 2 and HfO 2 .