Temperature adjustment method for mounting base, inspection device, and mounting base
A method for performing temperature control of a mounting base on which a substrate is to be mounted. A substrate mounting surface of the mounting base is divided in the radial direction into a plurality of regions, and a heater is provided to each of the plurality of regions. The method includes: a step for performing feedback control that adjusts the operation amount of the heater in the centermost region of the plurality of regions of the substrate mounting surface such that the centermost region is at a set temperature; and a step for performing feedback control that adjusts the operation amount of the heater in an outside region that is further to the outside than the centermost region of the plurality of regions of the substrate mounting surface such that the temperature difference between the outside region and the region that is adjacent to the outside region on the inside in the radial direction is a preset value.
1. A method of performing temperature control on a mounting base on which a substrate is to be mounted, the method comprising:
dividing a substrate mounting surface of the mounting base into a plurality of regions in a diametral direction and providing a heater for each of the plurality of regions;
performing feedback control to adjust an operation amount of the heater in a centermost region among the plurality of regions of the substrate mounting surface so as to make a temperature of the centermost region to reach a set temperature; and
performing feedback control to adjust the operation amount of the heater in an outer side region outside the centermost region among the plurality of regions of the substrate mounting surface so as to make a temperature difference between the outer side region and a region that is adjacent to the outer side region inward in the diametral direction to be a preset value.
2. The method of claim 1 , comprising cooling the substrate mounting surface of the mounting base by using a cooling unit and, at the same time, heating the substrate mounting surface by using the heater disposed at a position closer to the substrate mounting surface than the cooling unit.
3. The method of claim 1 , comprising measuring an electric resistance of a heating element included in the heater and acquiring a temperature of the region of the substrate mounting surface in which the heater is provided based on a measurement result of the electric resistance.
4. A test device for testing a substrate to be tested, the test device comprising:
a mounting base on which the substrate to be tested is mounted; and
a control unit,
wherein a substrate mounting surface of the mounting base is divided into a plurality of regions in a diametral direction and a heater is provided for each of the plurality of regions, and
the control unit performs feedback control that adjusts an operation amount of the heater in a centermost region among the plurality of regions of the substrate mounting surface so as to make a temperature of the centermost region to reach a set temperature, and
performs feedback control that adjusts the operation amount of the heater in an outer side region outside the centermost region among the plurality of regions of the substrate mounting surface so as to make a temperature difference between the outer side region and a region that is adjacent to the outer side region inward in the diametral direction to be a preset value.
5. The test device of claim 4 , wherein the mounting base includes a cooling unit configured to cool the substrate mounting surface, and
wherein the heater is provided at a position closer to the substrate mounting surface than the cooling unit.
6. The test device of claim 4 , wherein the control unit acquires a temperature of the region of the substrate mounting surface in which the heater is provided based on a measurement result of an electric resistance of a heating element included in the heater.