IP Library Granted Patent US 11,775,034
Granted Patent B2
US 11,775,034 · App. 17/572,634 · Granted Oct 3, 2023

Heat dissipation system of portable electronic device

Inventors: Tsung-Ting Chen (New Taipei, TW); Wen-Neng Liao (New Taipei, TW); Cheng-Wen Hsieh (New Taipei, TW); Yu-Ming Lin (New Taipei, TW); Wei-Chin Chen (New Taipei, TW); Kuang-Hua Lin (New Taipei, TW); Chun-Chieh Wang (New Taipei, TW); Shu-Hao Kuo (New Taipei, TW)
Assignee: Acer Incorporated
G06F1/203H05K7/20145H05K7/20163
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Quick Facts
Patent No.
US 11,775,034
App. No.
17/572,634
Granted
Oct 3, 2023
Kind
B2
Abstract

A heat dissipation system of a portable electronic device is provided. The heat dissipation system includes a body and at least one fan. A heat source of the portable electronic device is disposed in the body. The fan is a centrifugal fan disposed in the body. The fan has at least one flow inlet, at least one flow outlet, and at least one spacing portion. The flow outlet faces toward the heat source, and the spacing portion surrounds the flow inlet and abuts against the body, so as to isolate the flow inlet and the heat source in two spaces independent of each other in the body.

Claims (14)

1. A heat dissipation system of a portable electronic device, comprising:

a body, wherein at least one heat source of the portable electronic device is disposed in the body; and

two fans, respectively being a centrifugal fan and disposed on two opposite sides of the heat source in the body, wherein each of the fans has at least one flow inlet, a first flow outlet and a second flow outlet, and at least one spacing portion, the first flow outlets face each other and all face toward the heat source, the second flow outlets face away from each other and all face toward an outside of the body, the spacing portion surrounds the flow inlet and abuts against the body, so as to isolate the flow inlet and the heat source in two spaces independent of each other in the body,

wherein the heat dissipation system of the portable electronic device further comprises at least one barrier abutting between the spacing portions of the two fans, wherein the heat source is located in a space surrounded and formed by the barrier, the spacing portions, and a part of the body.

2. The heat dissipation system of the portable electronic device according to claim 1 , wherein the body comprises an upper casing and a lower casing, and at least one of the upper casing and the lower casing comprises an opening corresponding to the flow inlet, and air of an external environment of the body flows into the fan through the opening and the flow inlet.

3. The heat dissipation system of the portable electronic device according to claim 1 , wherein the body has at least one opening, and an airflow generated by the fan flows out from the flow outlet, and passes through the heat source and then flows out of the body from the opening.

4. The heat dissipation system of the portable electronic device according to claim 3 , wherein the body has a plurality of openings, and the heat dissipation system of the portable electronic device further has a heat conducting component and a heat dissipating component, the heat conducting component is in thermal contact between the heat source and the heat dissipating component, so as to transfer heat generated by the heat source to the heat dissipating component, the fan comprises a first flow outlet and a second flow outlet, the airflow generated by the fan flows out from the first flow outlet and the second flow outlet, and the heat dissipating component is located between the second flow outlet and a part of the plurality of openings, wherein the airflow flowing out from the second flow outlet passes through the heat dissipating component and flows out of the body from the part of the plurality of openings, and the airflow flowing out from the first flow outlet passes through the heat source and then flows out of the body from another part of the plurality of openings.

5. The heat dissipation system of the portable electronic device according to claim 1 , wherein the spacing portion is a buffer material disposed along a periphery of the flow inlet and forms a closed contour.

6. The heat dissipation system of the portable electronic device according to claim 1 , wherein the spacing portion is a buffer material disposed along a periphery of a structure of the fan and forms a closed contour.

7. The heat dissipation system of the portable electronic device according to claim 1 , wherein the spacing portion is a buffer material forming a closed contour and located between the flow inlet and a periphery of a structure of the fan.

8. The heat dissipation system of the portable electronic device according to claim 1 , wherein the body comprises an upper casing and a lower casing, and the fan comprises two flow inlets and two spacing portions that are coaxially and correspondingly disposed, and the two spacing portions are buffer materials respectively abutting against the upper casing and the lower casing.

9. The heat dissipation system of the portable electronic device according to claim 1 , wherein the spacing portion protrudes from a fan body of the fan.

10. The heat dissipation system of the portable electronic device according to claim 1 , wherein the spacing portion is a fan body of the fan.

11. The heat dissipation system of the portable electronic device according to claim 1 , wherein the portable electronic device further comprises a circuit board and a battery, the heat source and the barrier are disposed on the circuit board, and the heat source and the battery are isolated in two spaces independent of each other by the barrier.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 11, 2022
From: CHEN, TSUNG-TING; LIAO, WEN-NENG; HSIEH, CHENG-WEN; LIN, YU-MING; CHEN, WEI-CHIN; LIN, KUANG-HUA; WANG, CHUN-CHIEH; KUO, SHU-HAO
To: ACER INCORPORATED
Reel/Frame 058613/0248 →
Priority Claims (1)
TW 110101547 · Jan 15, 2021 · national
Continuity (1)
Related Publication 20220229477A1 · Jul 21, 2022
Cited By (2)
US 12,213,277 US 12,284,793