Cooling systems, cooling structures and electronic devices and methods for manufacturing or operating cooling systems, cooling structures and electronic devices
An electronic device comprises a heat source and a heat distribution structure coupled to the heat source to distribute heat generated by the heat source during operation of the electronic device.
1. A cooling system for an electronic device, comprising:
vapor chamber coupled to a heat source to distribute heat generated by the heat source;
at least one fan comprising a main blow direction, wherein the at least one fan is arranged so that the main blow direction is directed towards the vapor chamber, and
a guiding structure comprising a plurality of channel walls extending into a gap between the vapor chamber and an enclosure of the electronic device or a backside of a screen of the electronic device.
2. The cooling system of claim 1 , wherein the guiding structure is arranged on at least one of the surface of the vapor chamber, the enclosure of the electronic device, or a backside of a screen of the electronic device.
3. The cooling system of claim 1 , wherein at least 50% of an air flow caused by the at least one fan flows along the surface of the vapor chamber.
4. The cooling system of claim 1 , wherein the guiding structure is attached to or integrally formed on the enclosure of the electronic device or the backside of a screen of the electronic device.
5. The cooling system of claim 1 , wherein the fan is configured to blow air into the gap.
6. The cooling system of claim 1 , further comprising a circuit board configured to carry the heat source, wherein the fan is configured to blow air into a gap extending from the circuit board to the enclosure of the electronic device or the backside of a screen of the electronic device.
7. The cooling system of claim 1 , wherein the guiding structure is configured to guide an air flow caused by the fan along the surface of the vapor chamber through one or more channels formed by the plurality of channel walls.
8. The cooling system of claim 1 , wherein the guiding structure comprises gasket material.
9. The cooling system of claim 1 , wherein the guiding structure completely encloses the vapor chamber at an edge of the vapor chamber except for one or more air inlet openings of the guiding structure and one or more air outlet openings of the guiding structure.
10. The cooling system of claim 1 , wherein the main blow direction of the fan is substantially perpendicular to the rotation axis of the fan.
11. The cooling system of claim 1 , wherein a main air inlet direction of the fan is substantially in parallel to the rotation axis of the fan.
12. The cooling system of claim 1 , wherein no heat sink is located adjacent to the fan.
13. The cooling system of claim 1 , wherein the fan comprises a maximal dimension with respect to height, length and width of at most 50 mm.
14. The cooling system of claim 1 , wherein a vertical extension of the fan overlaps a vertical extension of the vapor chamber.
15. A cooling system for an electronic device, comprising:
a heat distribution structure configured to be coupled to a heat source of an electronic device, wherein the heat distribution structure comprises at least one of a vapor chamber or a heat pipe;
a blower configured to cause an air flow along a surface of the heat distribution structure, wherein the blower comprises at least one of:
a maximal length and maximal width of at most 20 mm; or
a maximal thickness of at most 3 mm, and
a guiding structure comprising a plurality of channel walls extending into a gap between the heat distribution structure and an enclosure of the electronic device.
16. The cooling system of claim 15 , wherein at least 50% of the air flow caused by the blower flows along the surface of the heat distribution structure.
17. A cooling system for a computing device, the cooling system comprising:
a heat conduction element, the heat conduction element being suitable for cooling a processing unit of the computing device;
at least one blower fan for blowing air across a portion of the heat conduction element;
a guiding structure comprising a plurality of channel walls extending into a gap between the heat conduction element and a backside of a screen of the electronic device; and
control circuitry configured to activate or deactivate the at least one blower fan based on a heat load of a processing unit of the computing device.
18. The cooling system of claim 17 , wherein the heat conduction element comprises a vapor chamber.
19. A cooling system, comprising:
a first heat distribution structure coupled to a heat source to distribute heat generated by the heat source;
a thermal electric cooler;
a second heat distribution structure, wherein a first surface of the thermal electric cooler is thermally coupled to the first heat distribution structure and a second surface of the thermal electric cooler is thermally coupled to the second heat distribution structure, wherein the first surface is opposite the second surface; and
a heat pipe arranged adjacent to the thermal electric cooler on the first heat distribution structure.
20. The cooling system of claim 19 , wherein the thermal electric cooler is located at least in one direction closer to an edge of the first heat distribution structure than the heat pipe.
21. The cooling system of claim 19 , wherein a first surface of the heat pipe is thermally coupled to the first heat distribution structure and a second surface of the heat pipe is thermally coupled to the second heat distribution structure.