IP Library Granted Patent US 11,778,738
Granted Patent B2
US 11,778,738 · App. 17/277,569 · Granted Oct 3, 2023

Printed circuit board assembly

Inventor: Hoon Hwangbo (Suwon-si, KR)
Assignee: SAMSUNG ELECTRONICS CO., LTD.
H05K1/0296H05K1/142
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Quick Facts
Patent No.
US 11,778,738
App. No.
17/277,569
Granted
Oct 3, 2023
Kind
B2
Abstract

A printed circuit board assembly includes a main printed circuit board including a first main signal line and a first dielectric having a first permittivity; a sub printed circuit board including a first sub signal line and a second dielectric having a second permittivity smaller than the first permittivity; and a first connection block configured to connect the first main signal line of the main printed circuit board and the first sub signal line of the sub printed circuit board.

Claims (44)

1. A printed circuit board assembly comprising:

a main printed circuit board including a first main signal line and a first dielectric having a first permittivity;

a sub printed circuit board including a first sub signal line and a second dielectric having a second permittivity smaller than the first permittivity; and

a first connection block configured to connect the first main signal line of the main printed circuit board and the first sub signal line of the sub printed circuit board,

wherein the main printed circuit board further comprises a main power line and a main ground line,

wherein the sub printed circuit board further comprises a sub power line and a sub ground line, and

wherein the printed circuit board assembly further comprises:

a second connection block configured to connect the main power line and the sub power line; and

a third connection block configured to connect the main ground line and the sub ground line.

2. The printed circuit board assembly according to claim 1 , wherein the first connection block further comprises a first connection portion configured to electrically connect the first main signal line and the first sub signal line.

3. The printed circuit board assembly according to claim 1 , wherein:

the second connection block further comprises a second connection portion configured to electrically connect the main power line and the sub power line; and

the third connection block further comprises a third connection portion configured to electrically connect the main ground line and the sub ground line.

4. The printed circuit board assembly according to claim 3 , wherein the first connection block, the second connection block, and the third connection block comprise a printed circuit board.

5. The printed circuit board assembly according to claim 4 , wherein the first connection block, the second connection block, and the third connection block are mounted on surfaces of the main printed circuit board and the sub printed circuit board by surface mount technology (SMT).

6. The printed circuit board assembly according to claim 1 , wherein a communication speed of the first sub signal line is faster than a communication speed of the first main signal line.

7. The printed circuit board assembly according to claim 1 , wherein:

the first connection block comprises at least one pin fixed to the main printed circuit board and at least one pin fixed to the sub printed circuit board;

the main printed circuit board comprises at least one groove to which the at least one pin of the first connection block is fixed; and

the sub printed circuit board comprises at least one groove to which the at least one pin of the first connection block is fixed.

8. The printed circuit board assembly according to claim 7 , wherein the at least one pin of the first connection block is physically fixed and coupled to the at least one groove of the main printed circuit board and the at least one groove of the sub printed circuit board, respectively.

9. A printed circuit board assembly comprising:

a main printed circuit board having a first main signal line and a first communication speed;

a sub printed circuit board having a first sub signal line and a second communication speed faster than the first communication speed; and

a first connection block configured to connect the first main signal line of the main printed circuit board and the first sub signal line of the sub printed circuit board,

wherein the main printed circuit board further comprises a main power line and a main ground line,

wherein the sub printed circuit board further comprises a sub power line and a sub ground line, and

wherein the printed circuit board assembly further comprises:

a second connection block configured to connect the main power line and the sub power line; and

a third connection block configured to connect the main ground line and the sub ground line.

10. The printed circuit board assembly according to claim 9 , wherein the first connection block further comprises a first connection portion configured to electrically connect the first main signal line and the first sub signal line.

11. The printed circuit board assembly according to claim 9 , wherein:

the second connection block further comprises a second connection portion configured to electrically connect the main power line and the sub power line; and

the third connection block further comprises a third connection portion configured to electrically connect the main ground line and the sub ground line.

12. The printed circuit board assembly according to claim 11 , wherein the first connection block, the second connection block, and the third connection block comprise a printed circuit board.

13. The printed circuit board assembly according to claim 12 , wherein the first connection block, the second connection block, and the third connection block are mounted on surfaces of the main printed circuit board and the sub printed circuit board by surface mount technology (SMT).

14. The printed circuit board assembly according to claim 9 , wherein

the main printed circuit board further comprises a first dielectric having a first dielectric constant; and

the sub printed circuit board further comprises a second dielectric having a second dielectric constant lower than the first dielectric constant.

15. The printed circuit board assembly according to claim 9 , wherein:

the first connection block comprises at least one pin fixed to the main printed circuit board and at least one pin fixed to the sub printed circuit board;

the main printed circuit board comprises at least one groove to which the at least one pin of the first connection block is fixed; and

the sub printed circuit board comprises at least one groove to which the at least one pin of the first connection block is fixed.

16. The printed circuit board assembly according to claim 15 , wherein the at least one pin of the first connection block is physically fixed and coupled to the at least one groove of the main printed circuit board and the at least one groove of the sub printed circuit board, respectively.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 18, 2021
From: HWANGBO, HOON
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 055648/0833 →
Priority Claims (1)
KR 10-2018-0113601 · Sep 21, 2018 · national
Continuity (1)
Related Publication 20210289622A1 · Sep 16, 2021
Cited By (1)
US 12,266,665