Spacer-containing tape
A conductive tape comprising a conductive particle-containing layer containing at least a binder resin layer and a plurality of conductive particles, In this conductive tape, the plurality of conductive particles are distributedly disposed independently from each other on one surface of the binder resin layer, a surface of the binder resin layer in a vicinity of each of the conductive particles has an inclination or an undulation with respect to a tangent plane of the binder resin layer in a center portion between adjacent conductive particles, in the inclination, the surface of the binder resin layer around the conductive particle is lacked with respect to the tangent plane, and in the undulation, a resin amount of the binder resin layer right above the conductive particle is smaller than that when the surface of the binder resin layer right above the conductive particle is flush with the tangent plane.
1. A conductive tape comprising a conductive particle-containing layer containing at least a binder resin layer and a plurality of conductive particles, wherein
the plurality of conductive particles are distributedly disposed independently from each other on one surface of the binder resin layer, each of the conductive particles being at least partially embedded in the binder resin layer,
a surface of the binder resin layer in a vicinity of each of the conductive particles has an inclination or an undulation with respect to a tangent plane of the binder resin layer in a centermost portion between adjacent conductive particles,
in the inclination, the surface of the binder resin layer directly adjacent to and contacting the conductive particle is indented below the tangent plane, and
in the undulation, a resin amount of the binder resin layer right above the conductive particle is smaller than that when the surface of the binder resin layer right above the conductive particle is flush with the tangent plane.
2. The conductive tape according to claim 1 , wherein the conductive particles are distributedly disposed regularly on the one surface of the binder resin layer.
3. The conductive tape according to claim 1 , wherein an area occupancy ratio of the conductive particles calculated by the following formula is 35% or less:
Area occupancy ratio of conductive particles (%)=[number density of conductive particles in plan view]×[average of plan view area per conductive particle]×100.
4. The conductive tape according to claim 1 , wherein a ratio (Lb/D) between a distance Lb of a deepest portion of the conductive particle from the tangent plane and a particle diameter D of the conductive particles is 30% or more.
5. The conductive tape according to claim 1 , wherein a ratio (La/D) between a layer thickness La of the binder resin layer and a particle diameter D of the conductive particles is 0.6 or more.
6. The conductive tape according to claim 1 , wherein the conductive particles are disposed on one surface of the conductive particle-containing layer.
7. The conductive tape according to claim 1 , wherein the conductive particles are disposed on both surfaces of the conductive particle-containing layer.
8. The conductive tape according to claim 1 , wherein a resin layer containing no conductive particle is laminated on at least one surface of the conductive particle-containing layer.
9. The conductive tape according to claim 1 , wherein the conductive tape enables conduction between front and back surfaces of a tape.
10. A bonded structure in which a first component and a second component are bonded and conducted with the conductive tape according to claim 1 interposed therebetween.
11. A method for producing a bonded structure comprising bonding and conducting a first component and a second component with the conductive tape according to claim 1 interposed therebetween.
12. The conductive tape according to claim 1 , wherein the tangent plane intersects the conductive particles.