Three-dimensional features formed in molded panel
Examples include a device comprising integrated circuit dies molded into a molded panel. The molded panel has three-dimensional features formed therein, where the three-dimensional features are associated with the integrated circuit dies. To form the three-dimensional features, a feature formation material is deposited, the molded panel is formed, and the feature formation material is removed.
1. An apparatus comprising:
a molded panel having three-dimensional features formed therein, the molded panel including a first surface;
at least one integrated circuit die molded into the first surface of the molded panel and associated with the three-dimensional features of the molded panel;
at least one conductive trace electrically connected to the integrated circuit die and disposed in the molded panel; and
a connection point electrically connected to a controller, the connection point disposed onto the first surface of the molded panel.
2. The apparatus of claim 1 , wherein the three-dimensional features are formed in the molded panel by removal of a three-dimensional feature formation material deposited in the molded panel.
3. The apparatus of claim 1 , wherein the at least one integrated circuit die comprises a plurality of integrated circuit dies.
4. The apparatus of claim 3 , wherein the plurality of integrated circuit dies are fluid ejection dies.
5. The apparatus of claim 4 , wherein the three-dimensional features formed in the molded panel are fluid communication channels that are in fluid communication with the fluid ejection dies to convey printing material.
6. The apparatus of claim 5 , wherein each fluid ejection die comprises a plurality of nozzles to eject printing material.
7. The apparatus of claim 3 , wherein, the three-dimensional features formed in the molded panel are fluid communication channels that are in fluid communication with the integrated circuit dies, and
wherein the at least one integrated circuit die comprises at least one of a chemical sensor, a fluidic pump, a fluidic processing integrated circuit, a fluidic reaction integrated circuit, a fluid ejection die, or any combination thereof.
8. An apparatus comprising:
a molded panel including a first surface, the molded panel having three-dimensional features formed therein, the three-dimensional features corresponding to a fluid communication channel, the three-dimensional features formed by removal of a three-dimensional feature formation material deposited in the molded panel;
a fluid ejection die molded in the first surface of the molded panel, the fluid ejection die comprising a plurality of nozzles to eject printing material, the fluid ejection die having fluid feed holes in fluid communication with the plurality of nozzles, and the fluid feed holes in fluid communication with the fluid communication channel;
a conductive trace electrically connected to the fluid ejection die, the conductive trace comprising a first portion passing through the molded panel; and
a connection point electrically connected to a controller, the connection point disposed on the first surface of the molded panel.
9. The apparatus of claim 8 , wherein the apparatus comprises a plurality of fluid ejection dies molded in the molded panel.
10. The apparatus of claim 9 , wherein the molded panel has a fluid communication channel for each fluid ejection die of the plurality.
11. The apparatus of claim 8 , wherein the plurality of fluid ejection dies are arranged generally end-to-end along a width of the molded panel.
12. An apparatus comprising:
a molded panel comprising an epoxy mold compound and a first surface, the molded panel having three-dimensional features formed therein, the three-dimensional features formed by removal of a three-dimensional feature formation material deposited in the molded panel;
a plurality of fluid ejection dies molded in the first surface of the molded panel, the plurality of fluid ejection dies comprising a plurality of nozzles to eject printing material, the plurality of fluid ejection dies having fluid feed holes in fluid communication with the plurality of nozzles; and
a connection point electrically connected to a controller, the connection point disposed on the first surface of the molded panel.
13. The apparatus of claim 12 , wherein the plurality of fluid ejection dies are integrated circuit dies.
14. The apparatus of claim 13 , wherein at least one integrated circuit die comprises at least one of a chemical sensor, a fluidic pump, a fluidic processing integrated circuit, a fluidic reaction integrated circuit, a fluid ejection die, or any combination thereof.
15. The apparatus of claim 13 , further comprising at least one conductive trace electrically connected to at least one of the integrated circuit dies and disposed in the molded panel.