Laser processing apparatus and laser processing method
A laser processing apparatus includes: a scan moving unit which moves one or both of a workpiece and a laser beam; a laser beam irradiation unit which irradiates the workpiece with the laser beam; and a gas discharge unit which discharges at least a first gas to an irradiation area irradiated with the laser beam in the workpiece. The gas discharge unit has a rectifying surface at a position facing the workpiece during laser beam irradiation. The rectifying surface is provided with a first gas discharge port through which the first gas is discharged; and one or both of a second gas discharge port and a gas front-back suction port. The second gas discharge port discharges a second gas to the workpiece during laser beam irradiation on both outer sides of the first gas discharge port at least in the scanning direction.
1. A laser processing apparatus that irradiates a workpiece with a laser beam while relatively scanning the laser beam, the laser processing apparatus comprising:
a laser light source that irradiates the workpiece with the laser beam; and
a rectifying surface provided at a position facing the workpiece during laser beam irradiation,
wherein at least one of the workpiece and the laser beam is movable along a scanning direction,
wherein the rectifying surface is provided with:
a first gas discharge port through which a first gas is discharged to an irradiation area irradiated with the laser beam in the workpiece during the laser beam irradiation;
a second gas discharge port through which a second gas is discharged to the workpiece during the laser beam irradiation; and
a gas front-back suction port,
wherein the second gas discharge port and the gas front-back suction port are both provided on at least one of respective outer sides of the first gas discharge port in the scanning direction,
wherein the second gas discharge port and the gas front-back suction port are located adjacent to each other such that the gas front-back suction port is located between the second gas discharge port to which it is adjacent and the first gas discharge port,
wherein the rectifying surface is further provided with a third gas discharge port through which a third gas is discharged to the workpiece during the laser beam irradiation, and
wherein a long axis of the third gas discharge port extends along the scanning direction, and the third gas discharge port is provided on at least one of respective outer sides of the irradiation area in a width direction perpendicular to the scanning direction so as to be lateral to the irradiated area along the width direction.
2. The laser processing apparatus according to claim 1 , wherein the first gas discharge port is one through which the first gas is discharged in a range covering the irradiation area.
3. The laser processing apparatus according to claim 1 , wherein each of the second gas discharge port and the gas front-back suction port has a shape that is longer than a shape of the irradiation area along a width direction perpendicular to the scanning direction, and that extends beyond both outer edges of the irradiation area along the width direction.
4. The laser processing apparatus according to claim 1 , wherein the third gas discharge port has a shape that is longer than a shape of the irradiation area along the scanning direction, and that extends beyond both outer edges of the irradiation area along the scanning direction.
5. The laser processing apparatus according to claim 1 , wherein the second gas discharge port has a discharge angle directed downwardly outward at an angle different from a discharge angle of the first gas discharge port.
6. The laser processing apparatus according to claim 5 , wherein the discharge angle of the second gas discharge port is at least 45 degrees.
7. The laser processing apparatus according to claim 1 , wherein the rectifying surface is spaced apart from the workpiece by a distance of at most 10 mm during the relative movement between the workpiece and the laser beam.
8. The laser processing apparatus according to claim 1 , wherein the rectifying surface extends at least 10 mm more than a length of the laser beam on the irradiation surface in the scanning direction as measured starting from the first gas discharge port.
9. The laser processing apparatus according to claim 1 , wherein the second gas discharge port is located at a distance of at least 1 mm in the scanning direction from the first gas discharge port.
10. The laser processing apparatus according to claim 1 , wherein the laser beam has a line beam shape on the irradiation surface with respect to the workpiece.
11. The laser processing apparatus according to claim 1 , wherein the workpiece is a non-single-crystal semiconductor, and the laser processing apparatus crystallizes the non-single-crystal semiconductor.
12. The laser processing apparatus according to claim 1 , wherein the second gas and the third gas are neutralized and supplied to the second gas discharge port and the third gas discharge port, respectively.
13. The laser processing apparatus according to claim 1 , wherein the gas discharged from the rectifying surface is an inert gas.
14. The laser processing apparatus according to claim 2 , wherein each of the second gas discharge port and the gas front-back suction port has a shape that is longer than a shape of the irradiation area along a width direction perpendicular to the scanning direction, and that extends beyond both outer edges of the irradiation area along the width direction.
15. The laser processing apparatus according to claim 2 , wherein the third gas discharge port is provided on both of the respective outer sides of the irradiation area along the width direction.