Laser processing device
This laser processing device is provided with a laser radiating unit which forms a processed groove extending in a scanning direction on a workpiece, by subjecting the workpiece to laser processing while scanning the surface of the workpiece, and a nozzle portion which has a plurality of ejection holes arranged side by side in the scanning direction, and which ejects a gas toward the processed groove from each of the ejection holes. With this laser processing device, since a plume is eliminated by ejecting gas into the processed groove by means of the nozzle portion, the formation of a heat affected layer by the plume can be suppressed to an even greater extent.
1. A laser processing device comprising:
a laser irradiation unit that forms a processing groove extending in a scanning direction on a workpiece by performing laser processing on the workpiece while scanning a surface of the workpiece; and
a nozzle unit that has a plurality of ejection holes aligned in the scanning direction to eject gas as an ejection flow toward the processing groove from each of the ejection holes, wherein
the nozzle unit has a plurality of suction holes,
the plurality of suction holes are provided along the scanning direction,
each of the plurality of suction holes is provided between each pair of adjacent ejection holes and which suctions a scavenging flow formed by reversing the ejection flows on a bottom surface of the processing groove,
a space is formed inside the nozzle unit, and
each of the plurality of ejection holes communicates with the space.
2. The laser processing device according to claim 1 ,
wherein the scanning direction of each of the ejection holes is a longitudinal direction, and an interval between the ejection holes adjacent to each other is larger than a dimension of the ejection hole in the longitudinal direction.
3. The laser processing device according to claim 1 ,
wherein the laser irradiation unit is configured to irradiate the workpiece with laser light from vertically above, and
the nozzle unit is configured to eject the gas to form an angle of 45° or larger and 85° or smaller with respect to the workpiece, when viewed in the scanning direction.
4. The laser processing device according to claim 1 ,
wherein the laser irradiation unit is configured to irradiate the workpiece with laser light from vertically above, and
the nozzle units are provided on both sides in a horizontal direction orthogonal to the scanning direction while the laser irradiation unit is interposed therebetween.
5. The laser processing device according to claim 1 , further comprising:
a suction nozzle unit provided separately from the nozzle unit and having a plurality of second suction holes for suctioning the scavenging flow.