Target structure and film forming apparatus
A target structure includes a target, a cooling jacket having a flow path through which a heat exchange medium flows, and a backing plate. The target is bonded to one surface of the cooling jacket. A remaining surface of the cooling jacket and the backing plate are bonded in a peripheral portion, and are not bonded in a non-bonding region inside the peripheral portion.
1. A target structure comprising:
a target including a sputtering surface and a flange, the flange being formed on an outer peripheral side of the target;
a cooling jacket including a first surface bonded to the target and a second surface opposite the first surface, the cooling jacket having a flow path through which a heat exchange medium flows;
a backing plate, and
a bonding layer bonding the second surface of the cooling jacket to the backing plate in a peripheral portion of the cooling jacket,
wherein the second surface of the cooling jacket and the backing plate are not bonded in a non-bonding region inside the peripheral portion, the non-bonding region extending between opposing ends of the bonding layer, and
the bonding layer is disposed only at a portion of the cooling jacket outside the sputtering surface of the target, and in a cross-sectional view taken along a direction perpendicular to the sputtering surface of the target, wherein a distance between the opposing ends of the bonding layer is equal to a width of the sputtering surface of the target such that the bonding layer overlaps the flange and the non-bonding region overlaps with the distance in the cross-sectional view; and
wherein a gap surrounded by the second surface of the cooling jacket, a front surface of the backing plate and an inner peripheral surface of the bonding layer is formed in the non-bonding region, and the flow path is surrounded only by an upper plate, a lower plate, and two partitions of the cooling jacket in the cross-section view.
2. The target structure according to claim 1 , wherein the peripheral portion is a region outside the sputtering surface of the target.
3. The target structure according to claim 2 , wherein the flow path of the cooling jacket is formed inside the peripheral portion.
4. The target structure according to claim 3 , wherein the cooling jacket is formed of a material having a thermal conductivity higher than that of the target.
5. The target structure according to claim 4 , wherein the cooling jacket is more easily deformed by an external force than the target.
6. The target structure according to claim 5 , wherein the backing plate is formed of a material having a rigidity higher than that of the cooling jacket.
7. The target structure according to claim 6 , wherein the target is bonded to the first surface of the cooling jacket over an entire back surface of the target.
8. The target structure according to claim 7 , further comprising:
a clamp member configured to clamp the target,
wherein the clamp member is clamped with a flange of the target extending to the peripheral portion.
9. The target structure according to claim 1 , wherein the flow path of the cooling jacket is formed inside the peripheral portion.
10. The target structure according to claim 1 , wherein the cooling jacket is formed of a material having a thermal conductivity higher than that of the target.
11. The target structure according to claim 1 , wherein the cooling jacket is more easily deformed by an external force than the target.
12. The target structure according to claim 1 , wherein the backing plate is formed of a material having a rigidity higher than that of the cooling jacket.
13. The target structure according to claim 1 , wherein the target is bonded to the first surface of the cooling jacket over an entire back surface of the target.
14. The target structure according to claim 1 , further comprising:
a clamp member configured to clamp the target,
wherein the clamp member is clamped with a flange of the target extending to the peripheral portion.
15. A film forming apparatus having the target structure according to claim 1 .
16. The film forming apparatus according to claim 15 , further comprising a processing container in which the target structure is disposed, wherein the non-bonding region is in an atmosphere of an inside of the processing container.
17. The target structure according to claim 1 , the non-bonding region is in an air atmosphere.
18. The target structure according to claim 1 , the non-bonding region is in a vacuum atmosphere.