Substrate fixing device, electrostatic chuck, and method of manufacturing electrostatic chuck
There is provided a substrate fixing device. The substrate fixing device includes: a base plate; and an electrostatic chuck that is fixed to the base plate and configured to adsorb a subject by electrostatic force. The electrostatic chuck includes: an adsorptive layer configured to adsorb and retain the subject; and a heater layer that is provided between the adsorptive layer and the base plate and configured to heat the subject retrained by the adsorptive layer. A thickness of the heater layer is uniform over an entire area of the heater layer.
1. A substrate fixing device comprising:
a base plate; and
an electrostatic chuck that is fixed to the base plate and configured to adsorb a subject by electrostatic force,
wherein the electrostatic chuck comprises:
an adsorptive layer configured to adsorb and retain the subject; and
a heater layer that is provided between the adsorptive layer and the base plate and configured to heat the subject retrained by the adsorptive layer,
wherein the heater layer comprises:
a heater electrode configured to generate heat due to a voltage applied to the heater electrode, the heater electrode having a first surface located on a side of the base plate and a second surface located on an opposite side of the first surface and located on a side of the adsorptive layer, and
an insulating resin that covers at least the first surface of the heater electrode, and
wherein a thickness of the heater layer including the insulating resin is uniform over an entire area of the heater layer.
2. The substrate fixing device according to claim 1 , wherein the adsorptive layer comprises:
an electrode to which a voltage can be applied, and
a ceramic that covers the electrode.
3. The substrate fixing device according to claim 1 , wherein the insulating resin comprises:
a first face that faces the adsorptive layer, and
a second face that is opposite to the first face and that faces the base plate, and
the second face is formed as a flat face.
4. The substrate fixing device according to claim 1 , wherein the insulating resin contains a filler.
5. The substrate fixing device according to claim 1 , wherein:
the base plate comprises a refrigerant flow path through which a refrigerant passes.
6. The substrate fixing device according to claim 1 , further comprising:
an adhesive layer that is provided between the electrostatic chuck and the base plate to bond the electrostatic chuck and the base plate to each other.
7. The substrate fixing device according to claim 6 , further comprising:
a support member that protrudes from the base plate to support the electrostatic chuck,
wherein the adhesive layer is provided between the electrostatic chuck and the base plate so as to surround the support member.
8. The substrate fixing device according to claim 1 , wherein
a difference in thickness between a thickest portion and a thinnest portion of the heater layer is not more than 0.2% of an average thickness of the heater layer.
9. An electrostatic chuck comprising:
a heater layer; and
an adsorptive layer that is disposed on the heater layer and configured to adsorb and retain a subject by electrostatic force,
wherein the heater layer is configured to heat the subject retained by the adsorptive layer,
wherein the heater layer comprises:
a heater electrode configured to generate heat due to a voltage applied to the heater electrode, the heater electrode having a first surface located on a side of the base plate and a second surface located on an opposite side of the first surface and located on a side of the adsorptive layer, and
an insulating resin that covers at least the first surface of the heater electrode, and
wherein a thickness of the heater layer including the insulating resin is uniform over an entire area of the heater layer.