Multi-layer line structure and method for manufacturing thereof
A multi-layer line structure including a substrate, a lower layer Cu line located on the substrate, an upper layer Cu line located on an insulating layer including an inorganic film located on the lower layer Cu line and an organic resin film located on the inorganic film, and a via connection part located in a via connection hole running in an up-down direction through the insulating layer in an area where the lower layer Cu line and the upper layer Cu line overlap each other is provided. The via connection part includes a barrier conductive layer located on a part of the lower layer Cu line exposed to a bottom part of the via connection hole and on an inner wall of the via connection hole.
1. A multi-layer line structure comprising:
a first line layer;
a first insulating layer located on the first line layer, the first insulating layer including an inorganic layer and a first organic resin film, the inorganic layer covering and being in contact with a side surface of the first line layer and at least a part of the top surface of the first line layer, and the first organic resin film being located on the inorganic layer;
a second line layer located on the first organic resin film;
a second organic resin film located on the second line layer, the second organic resin film covering and being in contact with a side surface of the second line layer and at least a part of the top surface of the second line layer;
a third line layer located on the second organic resin film; and
a third organic resin film located on the third line layer, the third organic resin film covering and being in contact with a side surface of the third line layer and at least a part of the top surface of the third line layer.
2. The multi-layer line structure according to claim 1 , wherein the inorganic layer includes a first inorganic film located on the first line layer and a second inorganic film located on the first inorganic film.
3. The multi-layer line structure according to claim 1 , further comprising a via connection part located in a via connection hole running in an up-down direction through the second organic resin film in an area where the second line layer and the third line layer overlap each other.
4. The multi-layer line structure according to claim 1 , further comprising:
a fourth line layer located under the first line layer; and
a fourth organic resin film located between the fourth line layer and the first line layer, the fourth organic resin film covering and being in contact with a side surface of the fourth line layer and at least a part of the top surface of the fourth line layer.
5. The multi-layer line structure according to claim 1 , further comprising:
a fourth line layer located on the third organic resin film; and
a fourth organic resin film located on the fourth line layer, the fourth organic resin film covering and being in contact with a side surface of the fourth line layer and at least a part of the top surface of the fourth line layer.
6. A multi-layer line structure comprising:
a first line layer;
a first insulating layer located on the first line layer, the first insulating layer including a first inorganic layer and a first organic resin film, the first inorganic layer covering and being in contact with a side surface of the first line layer and at least a part of the top surface of the first line layer, and the first organic resin film being located on the first inorganic layer;
a second line layer located on the first organic resin film;
a second insulating layer located on the second line layer, the second insulating layer including a second inorganic layer and a second organic resin film, the second inorganic layer covering and being in contact with a side surface of the second line layer and at least a part of the top surface of the second line layer, and the second organic resin film being located on the second inorganic layer;
a third line layer located on the second organic resin film; and
a third organic resin film located on the third line layer, the third organic resin film covering and being in contact with a side surface of the third line layer and at least a part of the top surface of the third line layer.
7. The multi-layer line structure according to claim 6 , wherein
the first inorganic layer includes a first inorganic film located on the first line layer and a second inorganic film located on the first inorganic film, and
the second inorganic layer includes a third inorganic film located on the second line layer and a fourth inorganic film located on the third inorganic film.
8. The multi-layer line structure according to claim 6 , further comprising a via connection part located in a via connection hole running in an up-down direction through the second insulating layer in an area where the second line layer and the third line layer overlap each other.
9. The multi-layer line structure according to claim 6 , further comprising:
a fourth line layer located under the first line layer; and
a fourth organic resin film located between the fourth line layer and the first line layer, the fourth organic resin film covering and being in contact with a side surface of the fourth line layer and at least a part of the top surface of the fourth line layer.
10. The multi-layer line structure according to claim 6 , further comprising:
a fourth line layer located on the third organic resin film; and
a fourth organic resin film located on the fourth line layer, the fourth organic resin film covering and being in contact with a side surface of the fourth line layer and at least a part of the top surface of the fourth line layer.
11. A multi-layer line structure comprising:
a first line layer;
a first organic resin film located on the first line layer, the first organic resin film covering and being in contact with a side surface of the first line layer and at least a part of the top surface of the first line layer;
a second line layer located on the first organic resin film;
a first insulating layer located on the second line layer, the first insulating layer including a first inorganic layer and a second organic resin film, the first inorganic layer covering and being in contact with a side surface of the second line layer and at least a part of the top surface of the second line layer, and the second organic resin film being located on the first inorganic layer;
a third line layer located on the second organic resin film; and
a second insulating layer located on the third line layer, the second insulating layer including a second inorganic layer and a third organic resin film, the second inorganic layer covering and being in contact with a side surface of the third line layer and at least a part of the top surface of the third line layer, and the third organic resin film being located on the second inorganic layer.
12. The multi-layer line structure according to claim 11 , wherein
the first inorganic layer includes a first inorganic film located on the second line layer and a second inorganic film located on the first inorganic film, and
the second inorganic layer includes a third inorganic film located on the third line layer and a fourth inorganic film located on the third inorganic film.
13. The multi-layer line structure according to claim 11 , further comprising a via connection part located in a via connection hole running in an up-down direction through the first insulating layer in an area where the second line layer and the third line layer overlap each other.
14. The multi-layer line structure according to claim 11 , further comprising:
a fourth line layer located under the first line layer; and
a fourth organic resin film located between the fourth line layer and the first line layer, the fourth organic resin film covering and being in contact with a side surface of the fourth line layer and at least a part of the top surface of the fourth line layer.
15. The multi-layer line structure according to claim 11 , further comprising:
a fourth line layer located on the third organic resin film; and
a fourth organic resin film located on the fourth line layer, the fourth organic resin film covering and being in contact with a side surface of the fourth line layer and at least a part of the top surface of the fourth line layer.
16. A multi-layer line structure comprising:
a first line layer;
a first insulating layer located on the first line layer, the first insulating layer including a first inorganic layer and a first organic resin film, the first inorganic layer covering and being in contact with a side surface of the first line layer and at least a part of the top surface of the first line layer, and the first organic resin film being located on the first inorganic layer;
a second line layer located on the first organic resin film;
a second organic resin film located on the second line layer, the second organic resin film covering and being in contact with a side surface of the second line layer and at least a part of the top surface of the second line layer;
a third line layer located on the second organic resin film; and
a second insulating layer located on the third line layer, the second insulating layer including a second inorganic layer and a third organic resin film, the second inorganic layer covering and being in contact with a side surface of the third line layer and at least a part of the top surface of the third line layer, and the third organic resin film being located on the second inorganic layer.
17. The multi-layer line structure according to claim 16 , wherein
the first inorganic layer includes a first inorganic film located on the first line layer and a second inorganic film located on the first inorganic film, and
the second inorganic layer includes a third inorganic film located on the third line layer and a fourth inorganic film located on the third inorganic film.
18. The multi-layer line structure according to claim 16 , further comprising a via connection part located in a via connection hole running in an up-down direction through the second organic resin film in an area where the second line layer and the third line layer overlap each other.
19. The multi-layer line structure according to claim 16 , further comprising:
a fourth line layer located under the first line layer; and
a fourth organic resin film located between the fourth line layer and the first line layer, the fourth organic resin film covering and being in contact with a side surface of the fourth line layer and at least a part of the top surface of the fourth line layer.
20. The multi-layer line structure according to claim 16 , further comprising:
a fourth line layer located on the third organic resin film; and
a fourth organic resin film located on the fourth line layer, the fourth organic resin film covering and being in contact with a side surface of the fourth line layer and at least a part of the top surface of the fourth line layer.
21. A method for manufacturing a multi-layer line structure, comprising:
coating an organic resin material above a substrate to form a first insulating layer;
forming a barrier metal layer on the first insulating layer;
forming a metal layer on the barrier metal layer;
forming a resist pattern on the metal layer, the resist pattern exposing a part of the metal layer;
forming first lines on an exposed part of the metal layer;
removing the resist pattern on the metal layer;
etching the metal layer except for the part overlapping the first lines by ion milling; and
after etching the metal layer, exposing a surface of each of the first lines to NH 3 plasma,
wherein the width of each of the first lines is be equal to or less than 5 μm, and
the metal layer is formed of copper.
22. The method for manufacturing a multi-layer line structure according to claim 21 , further comprising forming an inorganic insulating layer on the first lines so as to cover a top surface and a side surface of each of the first lines, wherein the thickness of the inorganic insulating layer between the first lines adjacent to each other is thinner than the thickness of the first lines.
23. The method for manufacturing a multi-layer line structure according to claim 22 , wherein forming the inorganic insulating layer includes forming a first inorganic film on the first lines so as to cover the top surface and the side surface of each of the first lines and forming a second inorganic film on the first inorganic film so as to wholly cover the first inorganic film.
24. The method for manufacturing a multi-layer line structure according to claim 21 , further comprising forming an organic resin film on the first lines so as to cover a top surface and a side surface of each of the first lines.
25. The method for manufacturing a multi-layer line structure according to claim 21 , further comprising:
forming an inorganic insulating layer on the first lines so as to cover a top surface and a side surface of each of the first lines; and
forming an organic resin film on the inorganic insulating layer so as to wholly cover the inorganic insulating layer,
wherein the thickness of the inorganic insulating layer between the first lines adjacent to each other is thinner than the thickness of the first lines.