Compression device
A compression device for applying controllable compression to a portion of the anatomy of a user, includes a body, at least one memory wire embedded in the body and configured to contract in length upon application of a current so as to reduce an effective length of the body and apply a compressive force to the portion of the anatomy of the user, and a controller configured to selectively apply current to the memory wires to contract the memory wires and reduce the effective length of the body. The controller includes a circuit board supported by the body and a microcontroller mounted to the circuit board, the microcontroller programmed to actuate the memory wires according to a compression protocol stored in a memory associated with the microcontroller. Each memory wire has a first end fixedly connected to the circuit board and a second end fixed relative to the body.
1. A compression device for applying controllable compression to a leg and a foot of a user, comprising:
a first sock having a leg portion and a foot portion, the first sock comprising:
a plurality of first memory wires extending around the leg portion of the first sock; and
a plurality of second memory wires extending around the foot portion of the first sock;
a second sock configured to be arranged inside the first sock, the second sock including a plurality of compression pads affixed to the second sock, each of said plurality of compression pads assigned to and aligned with only one corresponding memory wire of the plurality of first memory wires and the plurality of second memory; and
a controller configured to selectively apply current to the plurality of first memory wires and the plurality of second memory wires to contract plurality of first memory wires and the plurality of second memory wires and thereby apply pressure to the leg and foot of the user, wherein the controller includes a circuit board and a microcontroller mounted to the circuit board, the microcontroller programmed to actuate the plurality of first memory wires and the plurality of second memory wires according to a compression protocol stored in a memory associated with the microcontroller.
2. The compression device of claim 1 , wherein the leg portion includes an open end region, and the circuit board and microcontroller are supported at the open end region of the first sock.
3. The compression device of claim 1 , wherein each of the plurality of compression pads is a thermally conducting pad.
4. The compression device of claim 1 , wherein each of the plurality of compression pads is a thermally insulating pad.