Unified micro system with memory IC and logic IC
View Patent ↗An unified IC system includes a base memory chip, a plurality of stacked memory chips, and a logic chip. The base memory chip includes a memory region and a bridge area, the memory region includes a plurality of memory cells, and the bridge area includes a plurality of memory input/output (I/O) pads and a plurality of third transistors. The plurality of stacked memory chips is positioned above the base memory chip. The logic chip includes a logic bridge area and a plurality of second transistors, the logic bridge includes a plurality of logic I/O pads, wherein the plurality of memory I/O pads are electrically coupled to the plurality of logic I/O pads, and a voltage level of an I/O signal of the third transistor is the same or substantially the same as a voltage level of an I/O signal of the second transistor.
1. An IC system, comprising:
a package;
a plurality of base memory chips enclosed in the package, each base memory chip comprising a memory region and a bridge area, the memory region of each base memory chip comprising a plurality of memory cells and each memory cell comprising a first transistor, and the bridge area of each base memory chip comprising a plurality of memory input/output (I/O) pads and a plurality of third transistors; and
a logic chip physically separated from the plurality of base memory chip and enclosed in the package, the logic chip comprising a logic bridge area and a plurality of second transistors, the logic bridge area comprising a plurality of logic I/O pads;
wherein the plurality of base memory chips and the logic chip are configured above a substrate, each base memory chip is horizontally spaced apart from the logic chip, and the plurality of memory I/O pads of each base memory chip are electrically coupled to the plurality of logic I/O pads;
wherein a voltage level of a signal to or from the third transistor is the same or substantially the same as a voltage level of a signal to or from the second transistor.
2. The unified IC system of claim 1 , wherein the plurality of base memory chips surround the logic chip.
3. The IC system of claim 1 , wherein the plurality of base memory chips include four base memory chips, and each base memory chips is adjacent to one side of the logic chip.
4. The IC system of claim 1 , wherein the memory I/O pads does not include an electrostatic discharge (ESD) protection circuit.
5. The IC system of claim 1 , wherein a 3D structure of the third transistor is the same or substantially the same as a 3D structure of the second transistor.
6. The IC system of claim 5 , wherein the 3D structure of the second transistor comprising:
a first concave formed in the logic chip and a first isolating layer configured in the first concave and above a bottom wall of the first concave;
a second concave formed in the logic chip and a second isolating layer configured in the second concave and above a bottom wall of the second concave;
a first conductive region positioned on the top of the first isolating layer;
a second conductive region positioned on the top of the second isolating layer;
a gate between the first conductive region and the second conductive region; and
a channel region under the gate and electrically coupled to the first conductive region and the second conductive region.
7. The IC system of claim 6 , wherein the first conductive region includes a lower part within the first concave and is coupled to the channel region.
8. The IC system of claim 7 , wherein the first conductive region further includes an upper part above the lower part, and a doping concentration of the upper part is different from a doping concentration of the lower part.
9. The IC system of claim 6 , wherein the first conductive region is formed by selective growth.
10. The IC system of claim 5 , wherein the 3D structure of the third transistor comprising:
a first concave formed in the base memory chip and a first isolating layer configured in the first concave and above a bottom wall of the first concave;
a second concave formed in the base memory chip and a second isolating layer configured in the second concave and above a bottom wall of the second concave;
a first conductive region positioned on the top of the first isolating layer;
a second conductive region positioned on the top of the second isolating layer;
a gate between the first conductive region and the second conductive region; and
a channel region under the gate and electrically coupled to the first conductive region and the second conductive region.
11. An IC system, comprising:
a chip with a surface; and
a transistor in the chip, the transistor comprising:
a first concave under the surface of the chip and a first isolating layer configured in the first concave and above a bottom wall of the first concave;
a second concave under the surface of the chip and a second isolating layer configured in the second concave and above a bottom wall of the second concave;
a first conductive region positioned on the top of the first isolating layer;
a second conductive region positioned on the top of the second isolating layer;
a gate between the first conductive region and the second conductive region; and
a channel region under the gate and electrically coupled to the first conductive region and the second conductive region.
12. The IC system of claim 11 , wherein the first conductive region includes a lower part within the first concave and is coupled to the channel region.
13. The IC system of claim 12 , wherein the first conductive region further includes an upper part above the lower part, and a doping concentration of the upper part is different from a doping concentration of the lower part.
14. The IC system of claim 11 , further comprising a spacer, wherein the spacer covers a sidewall of the gate, and an edge of the first conductive region is aligned or substantially aligned with an edge of the spacer.
15. The IC system of claim 11 , wherein the first conductive region is formed by selective growth.