Light-emitting device
A light-emitting device includes: a substrate including a base and a side wall; a plurality of semiconductor laser elements arrayed in a first direction on an upper surface of the base; a sealing member fixed to the substrate, wherein the sealing member and the substrate define a sealed space in which the semiconductor laser element is located; and a lens array disposed above the sealing member, the lens array including a plurality of lens sections arrayed in the first direction. In the lens array, a maximum outer diameter of each lens sections is 1.25 times or more than an inter-vertex distance between adjacent ones of the lens sections in the first direction.
1. A light-emitting device comprising:
a substrate comprising a base and a side wall;
a plurality of semiconductor laser elements arrayed in a first direction on an upper surface of the base;
a sealing member fixed to the substrate, wherein the sealing member and the substrate define a sealed space in which the plurality of semiconductor laser elements is located; and
a lens array disposed above the sealing member, the lens array comprising a plurality of lens sections arrayed in the first direction; wherein:
in the lens array, a maximum outer diameter of each lens section is 1.25 times or more than an inter-vertex distance between adjacent ones of the lens sections in the first direction.
2. The light-emitting device according to claim 1 , wherein:
the substrate comprises a metal material and a ceramic material.
3. The light-emitting device according to claim 2 , wherein:
the metal material is copper and the ceramic material is AlN.
4. The light-emitting device according to claim 2 , wherein:
adjacent ones of the semiconductor laser elements are electrically connected to each other by wires via a relay member; and
the relay member comprises an insulating material, and electric wiring located on an upper surface of the insulating material.
5. The light-emitting device according to claim 1 , wherein:
adjacent ones of the semiconductor laser elements are electrically connected to each other by wires via a relay member;
the relay member comprises a metal material; and
the substrate comprises a ceramic material.
6. The light-emitting device according to claim 1 , further comprising: a plurality of wirings attached to the substrate.
7. The light-emitting device according to claim 1 , wherein:
the plurality of the laser elements comprises three or more laser elements;
the lens array comprises three or more lens sections lens arrayed in the first direction, including first and second lens sections located at opposite ends in the first direction, and a third lens section located between the first and second lens sections; and
a width of each of the first and second lens sections is greater than a width of the second lens section.
8. The light-emitting device according to claim 1 , wherein:
the lens array is fixed to the sealing member by adhesive; and
a space between the sealing member and the lens array is open to an area outside the light-emitting device.
9. The light-emitting device according to claim 1 , further comprising:
a plurality of mirrors, each opposing a light-emitting surface of a respective one of the semiconductor laser elements and the mirror are opposed to each other; wherein
in a plan view, each semiconductor laser element and each mirror are arranged inward of an outer edge of a corresponding one of the lens sections.
10. A light-emitting device comprising:
a substrate comprising a base and a side wall;
a plurality of semiconductor laser elements arrayed in a first direction on an upper surface of the base; and
a lens array fixed to the substrate and comprising a plurality of lens sections arrayed in the first direction, wherein the lens array and the substrate define a sealed space in which the plurality of semiconductor laser elements is disposed; wherein:
in the lens array, a maximum outer diameter of each lens section is 1.25 times or more than an inter-vertex distance between adjacent lens sections in the first direction.
11. The light-emitting device according to claim 10 , wherein:
the substrate comprises a metal material and a ceramic material.
12. The light-emitting device according to claim 11 , wherein:
the metal material is copper and the ceramic material is AlN.
13. The light-emitting device according to claim 11 , wherein:
adjacent ones of the semiconductor laser elements are electrically connected to each other by wires via a relay member; and
the relay member comprises an insulating material, and electric wiring located on an upper surface of the insulating material.
14. The light-emitting device according to claim 10 , wherein:
adjacent ones of the semiconductor laser elements are electrically connected to each other by wires via a relay member;
the relay member comprises a metal material; and
the substrate comprises a ceramic material.
15. The light-emitting device according to claim 10 , further comprising: a plurality of wirings attached to the substrate.
16. The light-emitting device according to claim 10 , wherein:
the plurality of the laser elements comprises three or more laser elements;
the lens array comprises three or more lens sections arrayed in the first direction, including first and second lens sections located at opposite ends in the first direction, and a third lens section located between the first and second lens sections; and
a width of each of the first and second lens sections is greater than a width of the second lens section.
17. The light-emitting device according to claim 10 , further comprising:
a plurality of mirrors, each opposing a light-emitting surface of a respective one of the semiconductor laser elements and the mirror are opposed to each other; wherein
in a plan view, each semiconductor laser element and each mirror are arranged inward of an outer edge of a corresponding one of the lens sections.