IP Library Granted Patent US 11,898,081
Granted Patent B2
US 11,898,081 · App. 17/095,159 · Granted Feb 13, 2024

Ruthenium-etching solution, method for manufacturing ruthenium-etching solution, method for processing object to be processed, and method for manufacturing ruthenium-containing wiring

Inventors: Takuya Ohhashi (Kawasaki, JP); Yukihisa Wada (Kawasaki, JP)
Assignee: TOKYO OHKA KOGYO CO., LTD.
C09K13/04C09K13/00C23F1/00C23F1/14C23F1/40H01L21/30604H01L21/32134H01L21/4892
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 11,898,081
App. No.
17/095,159
Granted
Feb 13, 2024
Kind
B2
Abstract

A ruthenium-etching solution for carrying out an etching process on ruthenium. The etching solution includes orthoperiodic acid and ammonia, in which a pH is 8 or higher and 10 or lower. A method for manufacturing the ruthenium-etching solution, a method for processing an object to be processed including carrying out an etching process on an object to be processed including ruthenium using the ruthenium-etching solution, and a method for manufacturing a ruthenium-containing wiring.

Claims (18)

1. A ruthenium-etching solution for carrying out an etching process on ruthenium, the ruthenium-etching solution comprising:

orthoperiodic acid; and

ammonia as the sole pH adjuster,

wherein a pH is more than 8 and 9.5 or lower,

the content of orthoperiodic acid is 0.5 to 3% by mass, and

a number of particles larger than 100 nm contained in the etching solution is 20 particles/ml or less, and

the ruthenium etching solution comprises no slurry and no abrasive,

wherein the ruthenium-etching solution is manufactured by a method consisting of:

dissolving orthoperiodic acid in water to obtain an orthoperiodic acid solution,

mixing the orthoperiodic acid solution with aqueous ammonia to adjust the pH of the mixed solution to more than 8 and 9.5 or lower, and

filtering the mixed solution with a filter.

2. The ruthenium-etching solution according to claim 1 , wherein the etching process is not a chemical mechanical polishing (CMP) process.

3. The ruthenium-etching solution according to claim 1 , wherein the etching process is a process for applying a substrate including an area formed of an insulate film and an area formed of ruthenium in a surface layer, thereby selectively etching the area formed of ruthenium.

4. A method for manufacturing the ruthenium-etching solution according to claim 1 , the method comprising, in the following order:

preparing a mixed solution by mixing a solution including orthoperiodic acid with aqueous ammonia, and adjusting a pH of the mixed solution to more than 8 and 9.5 or lower; and

filtering the mixed solution with a filter.

5. A method for processing an object to be processed, the method comprising carrying out an etching process on an object to be processed including ruthenium, using the ruthenium-etching solution according to claim 1 .

6. A method for manufacturing a ruthenium-containing wiring, the method comprising applying the ruthenium-etching solution according to claim 1 to a substrate including an area formed of an insulating film and an area formed of ruthenium in a surface layer, thereby selectively etching the area formed of ruthenium.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 1, 2020
From: OHHASHI, TAKUYA; WADA, YUKIHISA
To: TOKYO OHKA KOGYO CO., LTD.
Reel/Frame 054503/0897 →
Priority Claims (2)
JP 2019-210515 · Nov 21, 2019 · national
JP 2020-170554 · Oct 8, 2020 · national
Continuity (1)
Related Publication 20210155851A1 · May 27, 2021