Power module with press-fit contacts
A method of forming a semiconductor device includes providing a substrate that comprises a metal region, forming an encapsulant body of electrically insulating material on an upper surface of the metal region, forming an opening in the encapsulant body, and inserting a press-fit connector into the opening, wherein after inserting the press-fit connector into the opening, the press-fit connector is securely retained to the substrate and an interfacing end of the press-fit connector is electrically accessible.
1. A method of forming a semiconductor device, the method comprising:
providing a substrate that comprises a metal region;
forming an encapsulant body of electrically insulating material on an upper surface of the metal region;
forming an opening in the encapsulant body; and
inserting a press-fit connector into the opening;
wherein after inserting the press-fit connector into the opening, the press-fit connector is securely retained to the substrate and an interfacing end of the press-fit connector is electrically accessible,
wherein the encapsulant body is formed by a molding process whereby liquified mold material is formed on the substrate and subsequently hardened, wherein forming the opening comprises arranging a fixed pin over the substrate prior to the molding process, and wherein the fixed pin prevents the liquified mold material from forming at a location corresponding to the opening.
2. The method of claim 1 , further comprising forming a recess in the upper surface of the metal region, wherein the opening is formed directly over the recess, and wherein the opening is larger than the recess such that the recess is completely exposed by the opening.
3. The method of claim 2 , wherein the recess has a first diameter at the upper surface of the metal region, and wherein a diameter of the opening at a lower surface of the encapsulant body that interfaces with the upper surface of the metal region is greater than the first diameter.
4. The method of claim 2 , wherein the opening is tapered such that diameter of the opening gradually increases moving away from the lower surface of the encapsulant body.
5. The method of claim 4 , wherein the recess is formed before forming the encapsulant body.
6. The method of claim 4 , wherein the recess is formed after forming the encapsulant body.
7. The method of claim 2 , wherein the recess extends completely through the metal region, and wherein the recess is formed by drilling the upper surface of the metal region and by drilling a rear surface of the metal region that is opposite from the upper surface of the metal region.
8. The method of claim 2 , wherein inserting the press-fit connector into the opening comprises inserting the press-fit connector into the recess, and wherein the press-fit connector is securely retained to the substrate by compressive force applied by the substrate to a base portion of the press-fit connector.
9. The method of claim 8 , wherein the base portion of the press-fit connector has a higher material hardness than the metal region.
10. The method of claim 1 , further comprising arranging a receptacle in the opening and attaching the receptacle to the substrate, wherein inserting the press-fit connector into the opening comprises inserting the press-fit connector into the receptacle, and wherein after inserting the press-fit connector into the opening the press-fit connector is securely retained to the substrate via the receptacle.
11. The method of claim 1 , wherein the substrate is an entirely metal structure.
12. The method of claim 1 , wherein the substrate is a power electronics substrate that comprises an electrically insulating substrate and a structured metallization layer disposed thereon, and wherein the metal region is a portion of the structured metallization layer.
13. A semiconductor device, comprising:
a substrate that comprises a metal region;
an encapsulant body of electrically insulating material on an upper surface of the metal region;
an opening in the encapsulant body;
a press-fit connector arranged in the opening and securely retained to the substrate such that an interfacing end of the press-fit connector is electrically accessible; and
a recess in the upper surface of the metal region, and wherein the opening is directly over the opening and is larger than the recess such that the recess is completely exposed by the opening.
14. The semiconductor device of claim 13 , wherein the press-fit connector is securely retained to the substrate by compressive force applied by the substrate to a base portion of the press-fit connector.
15. The semiconductor device of claim 14 , wherein the press-fit connector comprises K88 copper alloy, and wherein the metal region comprises a metal with a lower material hardness than K88 copper alloy.
16. The semiconductor device of claim 13 , further comprising one or more power semiconductor devices mounted on the substrate and encapsulated by the molded body, and wherein the press-fit connector provides a point of electrical contact to a terminal of the one or more power semiconductor devices via the metal region.
17. The semiconductor device of claim 16 , wherein the semiconductor device is a power semiconductor module that comprises a power converter circuit.
18. The semiconductor device of claim 17 , wherein the substrate is arranged between two printed circuit boards, and wherein the semiconductor device comprises one of the press-fit connectors extending into each of the two printed circuit boards.