Resistance measuring structures of stacked devices
Resistance measuring structures for a stacked integrated circuit device are provided. The resistance measuring structures may include a first Complementary Field Effect Transistor (CFET) stack, a second CFET stack, and a conductive connection. The first CFET may include a first upper transistor that includes a first upper drain region and a first lower transistor that is between the substrate and the first upper transistor and includes a first lower drain region. The second CFET may include a second upper transistor that includes a second upper drain region and a second lower transistor that is between the substrate and the second upper transistor and includes a second lower drain region. The conductive connection may electrically connect the first upper drain region and the second upper drain region.
1. A resistance measuring structure comprising:
a first Complementary Field Effect Transistor (CFET) stack on a substrate, the first CFET stack comprising:
a first upper transistor comprising a first upper drain region; and
a first lower transistor between the substrate and the first upper transistor, the first lower transistor comprising a first lower drain region;
a second CFET stack on the substrate, the second CFET stack comprising:
a second upper transistor comprising a second upper drain region; and
a second lower transistor between the substrate and the second upper transistor, the second lower transistor comprising a second lower drain region; and
a conductive connection that contacts the first upper drain region and the second upper drain region,
wherein the conductive connection contacts the first lower drain region and the second lower drain region.
2. The resistance measuring structure of claim 1 , wherein the first upper drain region and the second upper drain region are spaced apart from each other in a first horizontal direction that is parallel to an upper surface of the substrate, and
the first upper transistor further comprises a first upper source region, and the first upper drain region and the first upper source region are spaced apart from each other in a second horizontal direction that is parallel to the upper surface of the substrate and traverses the first horizontal direction.
3. The resistance measuring structure of claim 1 , wherein the first upper transistor further comprises a first upper source region, and the first lower transistor further comprises a first lower source region,
the conductive connection is configured to be electrically connected to a current source and is further configured to be electrically connected to a first probe of a voltage meter, and
the first upper source region or the first lower source region is configured to be electrically connected to a second probe of the voltage meter.
4. The resistance measuring structure of claim 1 , wherein the first upper transistor further comprises a first upper source region, and
the conductive connection is configured to be electrically connected to a current source and is further configured to be electrically connected to a first probe of a voltage meter, and the first upper source region is configured to be electrically connected to a second probe of the voltage meter.
5. The resistance measuring structure of claim 1 , wherein the conductive connection is a first conductive connection, and the second upper transistor further comprises a second upper source region, and
the resistance measuring structure further comprises a second conductive connection that contacts the second upper source region.
6. The resistance measuring structure of claim 1 , wherein the conductive connection contacts the first upper drain region, the second upper drain region and the substrate.
7. The resistance measuring structure of claim 6 , wherein the conductive connection is a first conductive connection, and the resistance measuring structure further comprises a second conductive connection that is in the substrate and is electrically connected to the first conductive connection.
8. The resistance measuring structure of claim 7 , wherein the first conductive connection is configured to be electrically connected to a current source and is further configured to be electrically connected to a first probe of a voltage meter, and the second conductive connection is configured to be electrically connected to a second probe of the voltage meter.
9. A resistance measuring structure comprising:
a first Complementary Field Effect Transistor (CFET) stack on a substrate, the first CFET stack comprising:
a first upper transistor comprising a first upper drain region; and
a first lower transistor between the substrate and the first upper transistor, the first lower transistor comprising a first lower drain region;
a second CFET stack on the substrate, the second CFET stack comprising:
a second upper transistor comprising a second upper drain region; and
a second lower transistor between the substrate and the second upper transistor, the second lower transistor comprising a second lower drain region,
wherein the first upper drain region, the first lower drain region, the second upper drain region, and the second lower drain region are electrically connected to each other.
10. The resistance measuring structure of claim 1 , wherein the conductive connection is configured to be electrically connected to a current source and is further configured to be electrically connected to a first probe of a voltage meter.
11. The resistance measuring structure of claim 9 , wherein the first upper drain region and the second upper drain region are spaced apart from each other in a first horizontal direction that is parallel to an upper surface of the substrate, and
the first upper transistor further comprises a first upper source region, and the first upper drain region and the first upper source region are spaced apart from each other in a second horizontal direction that is parallel to the upper surface of the substrate and traverses the first horizontal direction.
12. The resistance measuring structure of claim 9 , wherein the first upper drain region, the first lower drain region, the second upper drain region, and the second lower transistor are electrically connected to each other through a conductive connection.
13. The resistance measuring structure of claim 12 , wherein the first upper transistor further comprises a first upper source region, and the first lower transistor further comprises a first lower source region,
the conductive connection is configured to be electrically connected to a current source and is further configured to be electrically connected to a first probe of a voltage meter, and
the first upper source region or the first lower source region is configured to be electrically connected to a second probe of the voltage meter.
14. The resistance measuring structure of claim 9 , wherein the first upper drain region overlaps the first lower drain region in a vertical direction that is perpendicular to an upper surface of the substrate, and the second upper drain region overlaps the second lower drain region in the vertical direction.
15. A resistance measuring structure comprising:
a first Complementary Field Effect Transistor (CFET) stack on a substrate, the first CFET stack comprising:
a first upper transistor comprising a first upper drain region; and
a first lower transistor between the substrate and the first upper transistor, the first lower transistor comprising a first lower drain region;
a second CFET stack on the substrate, the second CFET stack comprising:
a second upper transistor comprising a second upper drain region; and
a second lower transistor between the substrate and the second upper transistor, the second lower transistor comprising a second lower drain region; and
a first conductive connection that contacts the substrate, the first upper drain region, the first lower drain region, the second upper drain region, and the second lower drain region.
16. The resistance measuring structure of claim 15 further comprising a second conductive connection that is in the substrate and is electrically connected to first conductive connection.
17. The resistance measuring structure of claim 16 , wherein the first conductive connection is configured to be electrically connected to a current source and is further configured to be electrically connected to a first probe of a voltage meter, and the second conductive connection is configured to be electrically connected to a second probe of the voltage meter.
18. The resistance measuring structure of claim 15 , wherein the first upper drain region overlaps the first lower drain region in a vertical direction that is perpendicular to an upper surface of the substrate, and the second upper drain region overlaps the second lower drain region in the vertical direction.