Resistance measuring structures of stacked devices
Resistance measuring structures for a stacked integrated circuit device are provided. The resistance measuring structures may include a first Complementary Field Effect Transistor (CFET) stack, a second CFET stack, and a conductive connection. The first CFET may include a first upper transistor that includes a first upper drain region and a first lower transistor that is between the substrate and the first upper transistor and includes a first lower drain region. The second CFET may include a second upper transistor that includes a second upper drain region and a second lower transistor that is between the substrate and the second upper transistor and includes a second lower drain region. The conductive connection may electrically connect the first upper drain region and the second upper drain region.
1. A resistance measuring structure comprising:
a first Complementary Field Effect Transistor (CFET) stack on a substrate, the first CFET stack comprising:
a first upper transistor comprising a first upper drain region; and
a first lower transistor between the substrate and the first upper transistor, the first lower transistor comprising a first lower drain region;
a second CFET stack on the substrate, the second CFET stack comprising:
a second upper transistor comprising a second upper drain region; and
a second lower transistor between the substrate and the second upper transistor, the second lower transistor comprising a second lower drain region; and
a conductive connection that contacts the first upper drain region and the second upper drain region, wherein the conductive connection is configured to be electrically connected to a current source and is further configured to be electrically connected to a first probe of a voltage meter.
2. The resistance measuring structure of claim 1 , wherein the first upper and lower transistors comprise a first gate structure extending therebetween, and the second upper and lower transistors comprise a second gate structure extending therebetween.
3. The resistance measuring structure of claim 1 , wherein the first upper drain region and the second upper drain region are spaced apart from each other in a first horizontal direction that is parallel to an upper surface of the substrate, and
the first upper transistor further comprises a first upper source region, and the first upper drain region and the first upper source region are spaced apart from each other in a second horizontal direction that is parallel to the upper surface of the substrate and intersects the first horizontal direction.
4. The resistance measuring structure of claim 1 , wherein the first upper transistor further comprises a first upper source region, and the first lower transistor further comprises a first lower source region, and
the first upper source region or the first lower source region is configured to be electrically connected to a second probe of the voltage meter.
5. The resistance measuring structure of claim 1 , wherein a lower end of the conductive connection is spaced apart from upper ends of the first lower drain region and the second lower drain region in a vertical direction that is perpendicular to an upper surface of the substrate.
6. The resistance measuring structure of claim 5 , wherein the first upper transistor further comprises a first upper source region, and
the first upper source region is configured to be electrically connected to a second probe of the voltage meter.
7. The resistance measuring structure of claim 5 , wherein the conductive connection is a first conductive connection, and the second upper transistor further comprises a second upper source region,
the resistance measuring structure further comprises a second conductive connection that contacts the second upper source region, and
the first conductive connection and the second conductive connection have an equal thickness in the vertical direction.
8. The resistance measuring structure of claim 1 , wherein the conductive connection contacts the first upper drain region, the second upper drain region, and the substrate.
9. The resistance measuring structure of claim 8 , wherein the conductive connection is a first conductive connection, and the resistance measuring structure further comprises a second conductive connection that is in the substrate and is electrically connected to the first conductive connection.
10. The resistance measuring structure of claim 9 , wherein the second conductive connection is configured to be electrically connected to a second probe of the voltage meter.
11. An integrated circuit device comprising:
a first Complementary Field Effect Transistor (CFET) stack on a substrate, the first CFET stack comprising:
a first upper transistor comprising a first upper source region and a first upper drain region;
a first lower transistor between the substrate and the first upper transistor, the first lower transistor comprising a first lower source region and a first lower drain region; and
a first gate structure extending between the first upper source and drain regions, and extending between the first lower source and drain regions;
a second CFET stack on the substrate, the second CFET stack comprising:
a second upper transistor comprising a second upper source region and a second upper drain region; and
a second lower transistor between the substrate and the second upper transistor, the second lower transistor comprising a second lower source region and a second lower drain region; and
a second gate structure extending between the second upper source and drain regions, and extending between the second lower source and drain regions; and
a conductive connection that contacts the first upper drain region and the second upper drain region.
12. The integrated circuit device of claim 11 , wherein the first upper drain region and the second upper drain region are spaced apart from each other in a first horizontal direction that is parallel to an upper surface of the substrate, and
the first upper drain region and the first upper source region are spaced apart from each other in a second horizontal direction that is parallel to the upper surface of the substrate and intersects the first horizontal direction.
13. The integrated circuit device of claim 11 , wherein the conductive connection is configured to be electrically connected to a current source and is further configured to be electrically connected to a first probe of a voltage meter.
14. The integrated circuit device of claim 13 , wherein the first upper source region or the first lower source region is configured to be electrically connected to a second probe of the voltage meter.
15. The integrated circuit device of claim 13 , wherein a lower end of the conductive connection is spaced apart from upper ends of the first lower drain region and the second lower drain region in a vertical direction that is perpendicular to an upper surface of the substrate.
16. The integrated circuit device of claim 15 , wherein the first upper source region is configured to be electrically connected to a second probe of the voltage meter.
17. A resistance measuring structure comprising:
a first Complementary Field Effect Transistor (CFET) stack on a substrate, the first CFET stack comprising:
a first upper transistor comprising a first upper drain region; and
a first lower transistor between the substrate and the first upper transistor, the first lower transistor comprising a first lower drain region;
a second CFET stack on the substrate, the second CFET stack comprising:
a second upper transistor comprising a second upper drain region; and
a second lower transistor between the substrate and the second upper transistor, the second lower transistor comprising a second lower drain region;
a first conductive connection that contacts the first upper drain region and the second upper drain region; and
a second conductive connection that is in the substrate and is electrically connected to the first conductive connection.
18. The resistance measuring structure of claim 17 , wherein the first conductive connection contacts the first upper drain region, the second upper drain region and the substrate.
19. The resistance measuring structure of claim 18 , wherein the first conductive connection is configured to be electrically connected to a current source and is further configured to be electrically connected to a first probe of a voltage meter.
20. The resistance measuring structure of claim 19 , wherein the second conductive connection is configured to be electrically connected to a second probe of the voltage meter.