Release film and method of manufacturing release film
To provide a release film not to contaminate a mold or a molded article. The present invention provides a release film comprising, an oligomer bleeding prevention layer formed of an acrylic resin or a siloxane resin and laminated on a first face of a base layer that is formed of a polyethylene terephthalate resin; a surface layer formed of a fluororesin and laminated on the oligomer bleeding prevention layer; and a surface layer formed of a fluororesin and laminated on a second face of the base layer, or an oligomer bleeding prevention layer formed of an acrylic resin or a siloxane resin and laminated on a second face of the base layer, and a surface layer formed of a fluororesin and laminated on the oligomer bleeding prevention layer that is laminated on the second face.
1. A release film for use in sealing a semiconductor with a resin comprising:
an oligomer bleeding prevention layer formed of an acrylic resin or a siloxane resin and laminated on a first face of a base layer that is formed of a polyethylene terephthalate resin;
a surface layer formed of a fluororesin and laminated on the oligomer bleeding prevention layer; and
a surface layer formed of a fluororesin and laminated on a second face of the base layer, or
an oligomer bleeding prevention layer formed of an acrylic resin or a siloxane resin and laminated on a second face of the base layer, and a surface layer formed of a fluororesin and laminated on the oligomer bleeding prevention layer that is laminated on the second face,
wherein the fluororesin that forms the surface layers is a cured product of a fluororesin composition containing a reactive functional group-containing fluoropolymer and a curing agent, the reactive functional group-containing fluoropolymer is a hydroxy group-containing tetrafluoroethylene polymer, and the curing agent is an isocyanate curing agent,
the fluororesin that forms the surface layer on at least one face of the base layer comprises particles having an average particle size of 1 μm to 10 μm determined by laser diffraction particle size analysis,
the content of the curing agent in the fluororesin composition is 15 parts by mass to 50 parts by mass relative to 100 parts by mass of the reactive functional group-containing fluoropolymer, and
the content of the particles in the fluororesin composition is 10 parts by mass to 30 parts by mass relative to 100 parts by mass of the reactive functional group-containing fluoropolymer.
2. The release film according to claim 1 , wherein the oligomer bleeding prevention layer on the first face is formed of an acrylic resin.
3. The release film according to claim 1 , wherein
the release film has a tensile breaking strength of 40 MPa to 200 MPa as determined at 175° C. in accordance with JIS K7127, and
the release film has a tensile elongation at break of 200% to 500% as determined at 175° C. in accordance with JIS K7127.
4. The release film according to claim 1 , wherein the release film has an oxygen gas permeability of 5,000 to 50,000 cc/m 2 ·0.24 hr·atm as determined at 175° C. in accordance with JIS K7126-1.
5. The release film according to claim 1 , wherein the base layer has a tensile breaking strength of 40 MPa to 200 MPa as determined at 175° C. in accordance with JIS K7127.
6. The release film according to claim 1 , wherein the base layer has a tensile elongation at break of 200% to 500% as determined at 175° C. in accordance with JIS K7127.
7. The release film according to claim 1 , used for transfer molding or compression molding.
8. The release film according to claim 1 , used for molding two or more times.
9. A method of manufacturing a release film for use in sealing a semiconductor with a resin, the method comprising:
a first applying step of applying an acrylic resin composition or a siloxane resin composition onto one face of a base layer formed of a polyethylene terephthalate resin;
a first curing step of curing the resin composition applied in the first applying step to give an oligomer bleeding prevention layer;
after the first curing step, a second applying step of applying a fluororesin composition onto the oligomer bleeding prevention layer and an other face of the base layer; and
after the second applying step, a second curing step of curing the fluororesin composition to give surface layers,
wherein a fluororesin that forms the surface layers in the second applying step is a cured product of the fluororesin composition, the fluororesin composition contains a reactive functional group-containing fluoropolymer and a curing agent, the reactive functional group-containing fluoropolymer is a hydroxy group-containing tetrafluoroethylene polymer, and the curing agent is an isocyanate curing agent,
the fluororesin that forms at least one of the surface layers comprises particles having an average particle size of 1 μm to 10 μm determined by laser diffraction particle size analysis,
the content of the curing agent in the fluororesin composition is 15 parts by mass to 50 parts by mass relative to 100 parts by mass of the reactive functional group-containing fluoropolymer, and
the content of the particles in the fluororesin composition is 10 parts by mass to 30 parts by mass relative to 100 parts by mass of the reactive functional group-containing fluoropolymer.
10. A method of manufacturing a release film for use in sealing a semiconductor with a resin, the method comprising:
a first applying step of applying an acrylic resin composition or a siloxane resin composition onto both faces of a base layer formed of a polyethylene terephthalate resin;
a first curing step of curing the resin composition applied in the first applying step to give two oligomer bleeding prevention layers;
after the first curing step, a second applying step of applying a fluororesin composition onto the two oligomer bleeding prevention layers; and
after the second applying step, a second curing step of curing the fluororesin composition to give surface layers,
wherein a fluororesin that forms the surface layers in the second applying step is a cured product of the fluororesin composition, the fluororesin composition contains a reactive functional group-containing fluoropolymer and a curing agent, the reactive functional group-containing fluoropolymer is a hydroxy group-containing tetrafluoroethylene polymer, and the curing agent is an isocyanate curing agent,
the fluororesin that forms at least one of the surface layers comprises particles having an average particle size of 1 μm to 10 μm determined by laser diffraction particle size analysis,
the content of the curing agent in the fluororesin composition is 15 parts by mass to 50 parts by mass relative to 100 parts by mass of the reactive functional group-containing fluoropolymer, and
the content of the particles in the fluororesin composition is 10 parts by mass to 30 parts by mass relative to 100 parts by mass of the reactive functional group-containing fluoropolymer.