IP Library › Granted Patent US 11,933,808
Granted Patent B2
US 11,933,808 · App. 17/564,676 · Granted Mar 19, 2024

Buffer unit and method for storaging substrate type sensor for measuring of horizontality of a substrate support member provided on a temperature varying atmosphere

Inventors: Young Seop Choi (Cheonan-si, KR); Yong-Jun Seo (Hwaseong-si, KR); Sang Hyun Son (Busan, KR); Ji Young Lee (Cheonan-si, KR); Gyeong Ryul Kim (Seoul, KR); Sun Yong Park (Cheonan-si, KR)
Assignee: SEMES CO., LTD.
G01P1/023G01C9/00G01P15/18H02J7/02H02J50/10
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 11,933,808
App. No.
17/564,676
Granted
Mar 19, 2024
Kind
B2
Abstract

A buffer unit for temporarily storing a substrate includes a housing having a space for storing a substrate therein, one or more slots disposed within the housing for placing a substrate thereon, and a holding unit disposed at a bottom portion of the housing, having a flat and non-inclined top surface, and comprising a built-in wireless charging module. A substrate type sensor is stored at the holding unit.

Claims (36)

1. A buffer unit for temporarily storing a substrate, the buffer unit comprising:

a housing having a space for storing a substrate therein;

one or more slots disposed within the housing for placing the substrate thereon; and

a holding unit disposed at a bottom portion of the housing, having a flat and non-inclined top surface, and comprising a built-in wireless charging module,

wherein a substrate type sensor is supported by the flat and non-inclined top surface of the holding unit, and

wherein the holding unit further comprises a level sensor configured to measure a degree of inclination of the flat and non-inclined top surface of the holding unit.

2. A buffer unit for temporarily storing a substrate, the buffer unit comprising:

a housing having a space for storing a substrate therein;

one or more slots disposed within the housing for placing the substrate thereon; and

a holding unit disposed at a bottom portion of the housing, having a flat and non-inclined top surface, and comprising a built-in wireless charging module,

wherein a substrate type sensor is supported by the flat and non-inclined top surface of the holding unit,

wherein the buffer unit is disposed between an index module and a transfer apparatus of a treating module, and

wherein the treating module includes an apparatus for treating the substrate at a temperature higher than a room temperature.

3. A buffer unit for temporarily storing a substrate, the buffer unit comprising:

a housing having a space for s a substrate therein;

one or more slots disposed within the housing for placing the substrate thereon; and

a holding unit disposed at a bottom portion of the housing, having a flat and non-inclined top surface, and comprising a built-in wireless charging module,

wherein a substrate type sensor is supported by the flat and non-inclined top surface of the holding unit,

wherein the substrate type sensor comprises:

a substrate shaped-member;

a level measuring member provided at the substrate shaped-member;

a communication unit configured to receive a data from the level measuring member; and

a power unit configured to provide a power to the level measuring member and the communication unit, and

wherein the power unit is charged by the built-in wireless charging module.

4. The buffer unit of claim 3 ,

wherein the substrate type sensor is a sensor configured to measure a degree of a horizontality of a support member supporting the substrate under a temperature varying atmosphere, and

wherein the level measuring member is provided at the substrate shaped-member and comprises at least one sensor which is a 3-axis or more acceleration sensor or a 6-axis or more inertia measurement unit (IMU).

5. The buffer unit of claim 4 ,

wherein the at least one sensor comprises a plurality of sensors, and

wherein two opposite sensors of the plurality of sensors are arranged such that a center point of the substrate shaped-member is on a line defined by connecting the two opposite sensors.

6. The buffer unit of claim 4 ,

wherein the at least one sensor of the level measuring member generates an intrinsic error varying according to a temperature.

7. The buffer unit of claim 3 ,

wherein the substrate shaped-member has a substantially same physical size with a size of the substrate.

8. The buffer unit of claim 3 , further comprising:

a transmission unit transmits the data received by the communication unit to the outside.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 29, 2021
From: CHOI, YOUNG SEOP; SEO, YONG-JUN; SON, SANG HYUN; LEE, JI YOUNG; KIM, GYEONG RYUL; PARK, SUN YONG
To: SEMES CO., LTD.
Reel/Frame 058598/0774 →
Priority Claims (1)
KR 10-2020-0189441 · Dec 31, 2020 · national
Continuity (1)
Related Publication 20220206031A1 · Jun 30, 2022