Photoresist composition and method of forming photoresist pattern
View Patent ↗A method of forming a photoresist pattern includes forming a photoresist layer including a photoresist composition over a substrate. The photoresist composition includes metal particles and a thermally stable ligand attached to the metal particles. The thermally stable ligand includes branched or unbranched, cyclic or non-cyclic, C1-C7 alkyl groups or C1-C7 fluoroalkyl groups. The C1-C7 alkyl or C1-C7 fluoroalkyl groups include one or more of —CF 3 , —SH, —OH, ═O, —S—, —P—, —PO 2 , —C(═O)SH, —C(═O)OH, —C(═O)O—, —O—, —N—, —C(═O)NH, —SO 2 OH, —SO 2 SH, —SOH, or —SO 2 —. The photoresist layer is selectively exposed to actinic radiation, and the photoresist layer is developed to form a pattern in the photoresist layer. In an embodiment, the method includes heating the photoresist layer before selectively exposing the photoresist layer to actinic radiation.
1. A method of forming a photoresist pattern, comprising:
forming a photoresist layer comprising a photoresist composition over a substrate,
wherein the photoresist composition comprises:
metal particles; and
a thermally stable ligand attached to the metal particles;
wherein the thermally stable ligand includes C1-C7 alkyl groups or C1-C7 fluoroalkyl groups,
wherein the C1-C7 alkyl groups and C1-C7 fluoroalkyl groups are branched, unbranched, cyclic, or non-cyclic, and
wherein the C1-C7 alkyl or C1-C7 fluoroalkyl groups include one or more of —CF 3 , —SH, —S—, —P—, —PO 2 , —C(═O)SH, —C(═O)NH, —SO 2 OH, —SO 2 SH, —SOH, or —SO 2 —;
selectively exposing the photoresist layer to actinic radiation; and
developing the photoresist layer to form a pattern in the photoresist layer.
2. The method according to claim 1 , further comprising heating the photoresist layer before selectively exposing the photoresist layer to actinic radiation.
3. The method according to claim 2 , wherein the actinic radiation is an electron beam or extreme ultraviolet radiation.
4. The method according to claim 1 , further comprising heating the selectively exposed photoresist layer before developing the photoresist layer.
5. The method according to claim 1 , wherein the metal particles are nanoparticles.
6. The method according to claim 1 , wherein the metal particles include metal oxides.
7. The method according to claim 1 , wherein the metal particles include one or more of titanium, zinc, zirconium, nickel, cobalt, manganese, copper, iron, strontium, tungsten, vanadium, chromium, tin, hafnium, indium, cadmium, molybdenum, tantalum, niobium, aluminum, cesium, barium, lanthanum, cerium, silver, antimony, combinations thereof, or oxides thereof.
8. The method according to claim 1 , wherein the photoresist composition further comprises one or more solvents selected from propylene glycol methyl ether acetate (PGMEA), propylene glycol monomethyl ether (PGME), 1-ethoxy-2-propanol (PGEE), 7-butyrolactone (GBL), cyclohexanone (CHN), ethyl lactate (EL), methanol, ethanol, propanol, n-butanol, acetone, dimethylformamide (DMF), isopropanol (IPA), tetrahydrofuran (THF), methyl isobutyl carbinol (MIBC), n-butyl acetate (nBA), or 2-heptanone (MAK).
9. The method according to claim 1 , wherein the photoresist composition further comprises a second ligand attached to the metal particles, wherein the second ligand is a different material than the thermally stable ligand.
10. The method according to claim 9 , wherein the second ligand is a branched or unbranched, aliphatic or aromatic, substituted or unsubstituted carboxylic acid or sulfonic acid ligand, wherein when the second ligand is substituted with a substituent selected from one or more of a C1-C9 alkyl group, a C2-C9 alkenyl group, a C6-C9 phenyl group, or combinations thereof.
11. A method of manufacturing a semiconductor device, comprising:
forming a resist layer over a substrate;
forming a latent pattern in the resist layer;
forming a pattern in the resist layer by removing a portion of the resist layer; and
extending the pattern in the resist layer into the substrate,
wherein the resist layer comprises:
metal cores; and
a first ligand attached to the metal cores,
wherein the first ligand includes saturated C1-C7 organic groups,
wherein the saturated C1-C7 organic groups are branched, unbranched, cyclic, or non-cyclic, and
wherein the C1-C7 organic groups include H or F, and one or more of —CF 3 , —SH, —S—, —P—, —PO 2 , —C(═O)SH, —C(═O)NH, —SO 2 OH, —SO 2 SH, —SOH, and —SO 2 —.
12. The method according to claim 11 , wherein the extending the pattern into the substrate comprises etching the substrate.
13. The method according to claim 11 , further comprising heating the resist layer at a temperature of 70° C. to 160° C. after the forming a latent pattern and before the forming a pattern.
14. The method according to claim 11 , further comprising heating the resist layer at a temperature of 40° C. to 120° C. before the forming a latent pattern.
15. The method according to claim 11 , wherein the resist layer further comprises a second ligand attached to the metal cores, wherein the second ligand is formed of a different material than the first ligand.
16. A method of manufacturing a semiconductor device, comprising:
forming a resist layer comprising a resist composition over a substrate;
forming a pattern in the resist layer;
extending the pattern in the resist layer into the substrate,
wherein the resist composition comprises:
a solvent;
metal nanoparticles;
a first ligand attached to the metal nanoparticles,
wherein the first ligand includes C1-C7 alkyl groups or C1-C7 fluoroalkyl groups,
wherein the C1-C7 alkyl groups and C1-C7 fluoroalkyl groups are branched, unbranched, cyclic, or non-cyclic, and
wherein the C1-C7 alkyl groups or C1-C7 fluoroalkyl groups include one or more of —CF 3 , —SH, —S—, —P—, —PO 2 , —C(═O)SH, —C(═O)NH, —SO 2 OH, —SO 2 SH, —SOH, or —SO 2 —; and
a second ligand attached to the metal nanoparticles,
wherein the second ligand is a branched or unbranched, aliphatic or aromatic, substituted or unsubstituted carboxylic acid or sulfonic acid ligand, wherein when the second ligand is substituted with a substituent selected from one or more of a C1-C9 alkyl group, a C2-C9 alkenyl group, or a C6-C9 phenyl group, and
wherein the second ligand is a different material than the first ligand.
17. The method according to claim 16 , wherein the forming a pattern comprises:
selectively exposing the resist layer to extreme ultraviolet radiation or an electron beam; and
applying a developer to the selectively exposed resist layer to remove a portion of the resist layer.
18. The method according to claim 16 , further comprising heating the resist layer at a temperature of 70° C. to 160° C. after the selectively exposing the resist layer.
19. The method according to claim 18 , further comprising heating the resist layer at a temperature of 40° C. to 120° C. before the selectively exposing the resist layer.
20. The method according to claim 16 , wherein the metal nanoparticles include one or more of titanium, zinc, zirconium, nickel, cobalt, manganese, copper, iron, strontium, tungsten, vanadium, chromium, tin, hafnium, cadmium, molybdenum, tantalum, niobium, aluminum, cesium, barium, lanthanum, cerium, indium, silver, antimony, oxides thereof, or alloys thereof.