IP Library Granted Patent US 11,948,822
Granted Patent B2
US 11,948,822 · App. 17/652,334 · Granted Apr 2, 2024

Substrate transfer device and substrate processing system

Inventors: Dongwei Li (Nirasaki, JP); Takehiro Shindo (Nirasaki, JP)
Assignee: Tokyo Electron Limited
H01L21/67742H01L21/67745H01L21/68707H01L21/67201
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Quick Facts
Patent No.
US 11,948,822
App. No.
17/652,334
Granted
Apr 2, 2024
Kind
B2
Abstract

A substrate transfer device includes: a planar motor provided in a transfer chamber and including an array of coils, a transfer unit configured to move above the planar motor, and a controller configured to control supply of a current to the array of the coils, wherein the transfer unit includes a first base including an array of first magnets and configured to move above the planar motor, a second base including an array of second magnets and configured to move above the planar motor, the second base being arranged coaxially with the first base, and at least one arm configured to be extended or contracted by rotating the second base relative to the first base.

Claims (37)

1. A substrate transfer device comprising:

a planar motor provided in a transfer chamber and including an array of coils;

a transfer unit configured to move above the planar motor; and

a controller configured to control supply of a current to the array of the coils,

wherein the transfer unit includes:

a first base including an array of first magnets and configured to move above the planar motor;

a second base including an array of second magnets and configured to move above the planar motor, the second base being arranged coaxially with the first base; and

at least one arm configured to be extended or contracted by rotating the second base relative to the first base.

2. The substrate transfer device of claim 1 , wherein the transfer unit includes:

a base mount connected to the first base;

a drive arm connected to the second base and configured to be rotatable relative to the base mount; and

the at least one arm configured to be further extended or contracted with an operation of the drive arm.

3. The substrate transfer device of claim 2 , wherein the at least one arm of the transfer unit includes a pair of arms, and

one arm of the pair of arms is extended and the other arm of the pair of arms is contracted with the operation of the drive arm.

4. The substrate transfer device of claim 3 , wherein the at least one arm includes a pick configured to hold a substrate, and

the controller is further configured to control floating amounts of the first base and the second base to raise and lower the pick.

5. The substrate transfer device of claim 4 , wherein the controller is further configured to control, when moving the transfer unit, the floating amounts of the first base and the second base to cause the first base and the second base to be tilted so as to tilt the pick.

6. The substrate transfer device of claim 1 , wherein the at least one arm includes a pick configured to hold a substrate, and

the controller is further configured to control floating amounts of the first base and the second base to raise and lower the pick.

7. A substrate processing system comprising:

a plurality of chambers;

a transfer chamber connecting the plurality of chambers; and

the substrate transfer device provided with a planar motor provided in the transfer chamber and including an array of coils; a transfer unit configured to move above the planar motor; and a controller configured to control supply of a current to the array of the coils, wherein the transfer unit includes: a first base including an array of first magnets and configured to move above the planar motor; a second base including an array of second magnets and configured to move above the planar motor, the second base being arranged coaxially with the first base; and at least one arm configured to be extended or contracted by rotating the second base relative to the first base.

8. The substrate processing system of claim 7 , wherein the transfer chamber is a vacuum transfer chamber in a vacuum atmosphere.

9. The substrate processing system of claim 8 , wherein the planar motor is arranged in a space in an air atmosphere through a wall surface of the vacuum transfer chamber.

10. The substrate processing system of claim 9 , wherein the planar motor includes:

a first planar motor arranged on a floor portion of the transfer chamber; and

a second planar motor arranged on a ceiling portion of the transfer chamber, and

wherein the transfer unit includes:

a first transfer unit configured to move above the first planar motor; and

a second transfer unit configured to move above the second planar motor.

11. The substrate processing system of claim 7 , wherein the planar motor includes:

a first planar motor arranged on a floor portion of the transfer chamber; and

a second planar motor arranged on a ceiling portion of the transfer chamber, and

wherein the transfer unit includes:

a first transfer unit configured to move above the first planar motor; and

a second transfer unit configured to move above the second planar motor.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 24, 2022
From: LI, DONGWEI; SHINDO, TAKEHIRO
To: TOKYO ELECTRON LIMITED
Reel/Frame 059090/0544 →
Priority Claims (1)
JP 2021-032793 · Mar 2, 2021 · national
Continuity (1)
Related Publication 20220285191A1 · Sep 8, 2022
Cited By (1)
US 12,552,622