Semiconductor device comprising oxide semiconductor film
There have been cases where transistors formed using oxide semiconductors are inferior in reliability to transistors formed using amorphous silicon. Thus, in the present invention, a semiconductor device including a highly reliable transistor formed using an oxide semiconductor is manufactured. An oxide semiconductor film is deposited by a sputtering method, using a sputtering target including an oxide semiconductor having crystallinity, and in which the direction of the c-axis of a crystal is parallel to a normal vector of the top surface of the oxide semiconductor. The target is formed by mixing raw materials so that its composition ratio can obtain a crystal structure.
1. A semiconductor device comprising:
a transistor;
an oxide semiconductor film comprising a channel of the transistor;
a gate electrode of the transistor overlapping with the oxide semiconductor film with a gate insulating film of the transistor provided therebetween;
an insulating film over the gate electrode; and
a wiring over the insulating film,
wherein the wiring is electrically connected to the oxide semiconductor film via a first opening provided in the insulating film and the gate insulating film,
wherein the oxide semiconductor film comprises a second opening overlapping with the first opening,
wherein the oxide semiconductor film is in contact with the wiring in the second opening,
wherein a conductive film is provided below the oxide semiconductor film, and
wherein the conductive film comprises a first region overlapping with the oxide semiconductor film, a second region not overlapping with the oxide semiconductor film, and a third region overlapping with the wiring.
2. A semiconductor device comprising:
a transistor;
an oxide semiconductor film comprising a channel of the transistor;
a gate electrode of the transistor overlapping with the oxide semiconductor film with a gate insulating film of the transistor provided therebetween;
an insulating film over the gate electrode; and
a wiring over the insulating film,
wherein the wiring is electrically connected to the oxide semiconductor film via a first opening provided in the insulating film and the gate insulating film,
wherein the oxide semiconductor film comprises a second opening overlapping with the first opening,
wherein the oxide semiconductor film is in contact with the wiring in the second opening, and
wherein the wiring has a region overlapping with a conductive film provided below the oxide semiconductor film.
3. A semiconductor device comprising:
a transistor;
a first insulating film;
an oxide semiconductor film comprising a channel of the transistor over and in contact with the first insulating film;
a gate electrode of the transistor overlapping with the oxide semiconductor film with a gate insulating film of the transistor provided therebetween;
a second insulating film over the gate electrode; and
a wiring over the second insulating film,
wherein the wiring is electrically connected to the oxide semiconductor film via a first opening provided in the second insulating film and the gate insulating film,
wherein the oxide semiconductor film comprises a second opening overlapping with the first opening,
wherein the oxide semiconductor film is in contact with the wiring in the second opening,
wherein the wiring has a region overlapping with a conductive film provided below the oxide semiconductor film, and
wherein the conductive film is in contact with the first insulating film.
4. The semiconductor device according to claim 1 , wherein the oxide semiconductor film comprises indium.
5. The semiconductor device according to claim 2 , wherein the oxide semiconductor film comprises indium.
6. The semiconductor device according to claim 3 , wherein the oxide semiconductor film comprises indium.