Semiconductor device and manufacturing method thereof
A device includes a transistor, a backside via, and a pair of sidewall spacers. The transistor includes a gate structure, a channel layer surrounded by the gate structure, and a first source/drain structure and a second source/drain structure connected to the channel layer. The backside via is under and connected to the first source/drain structure and includes a first portion, a second portion between the first portion and the first source/drain structure, and a third portion tapering from the first portion to the second portion in a cross-sectional view. The pair of sidewall spacers are on opposite sidewalls of the second portion of the backside via but not on opposite sidewalls of the first portion of the backside via.
1. A device, comprising:
a transistor comprising:
a gate structure;
a channel layer surrounded by the gate structure; and
a first source/drain structure and a second source/drain structure connected to the channel layer;
a backside via under and connected to the first source/drain structure and comprising:
a first portion;
a second portion between the first portion and the first source/drain structure; and
a third portion tapering from the first portion to the second portion in a cross-sectional view; and
a pair of sidewall spacers on opposite sidewalls of the second portion of the backside via but not on opposite sidewalls of the first portion of the backside via.
2. The device of claim 1 , wherein the pair of sidewall spacers are not on opposite sidewalls of the third portion of the backside via.
3. The device of claim 1 , further comprising a metal alloy layer in contact with the second portion of the backside via and the first source/drain structure.
4. The device of claim 1 , further comprising an isolation material surrounding the backside via.
5. The device of claim 4 , wherein the isolation material is in contact with sidewalls and bottom surfaces of the pair of sidewall spacers.
6. The device of claim 4 , wherein the isolation material is in contact with the second source/drain structure.
7. The device of claim 1 , wherein the first source/drain structure comprises:
a top epitaxial structure; and
a bottom epitaxial structure between the top epitaxial structure and the backside via.
8. A device, comprising:
a channel layer;
a gate structure surrounding the channel layer;
a first source/drain structure and a second source/drain structure connected to the channel layer; and
a backside via connected to a backside of the first source/drain structure, wherein the backside via has opposite convex sidewalls in a first cross-sectional view and opposite concave sidewalls in a second cross-sectional view.
9. The device of claim 8 , further comprising a pair of sidewall spacers adjacent to the opposite convex sidewalls of the backside via.
10. The device of claim 9 , wherein the pair of sidewall spacers are spaced apart from the opposite concave sidewalls of the backside via.
11. The device of claim 9 , wherein a vertical thickness of the backside via is greater than a vertical thickness of each of the pair of sidewall spacers.
12. The device of claim 8 , further comprising shallow trench isolation (STI) regions adjacent to the opposite concave sidewalls of the backside via.
13. The device of claim 8 , wherein a maximum width of the backside via in the first cross-sectional view is greater than a maximum width of the first source/drain structure in the first cross-sectional view.
14. The device of claim 8 , wherein a maximum width of the backside via in the second cross-sectional view is less than a maximum width of the first source/drain structure in the second cross-sectional view.
15. A method, comprising:
forming a dummy gate over a substrate;
forming a sacrificial epitaxial plug in the substrate;
depositing a source/drain epitaxial structure over the sacrificial epitaxial plug and on a side of the dummy gate;
replacing the dummy gate with a gate structure;
removing the substrate such that the sacrificial epitaxial plug protrudes from a backside of the source/drain epitaxial structure;
forming a sacrificial epitaxial structure to cover the sacrificial epitaxial plug;
depositing an isolation material to surround the sacrificial epitaxial plug and the sacrificial epitaxial structure; and
replacing the sacrificial epitaxial plug and the sacrificial epitaxial structure with a backside via.
16. The method of claim 15 , further comprising forming shallow trench isolation (STI) regions in the substrate prior to forming the dummy gate over the substrate.
17. The method of claim 16 , wherein after removing the substrate, the sacrificial epitaxial plug is between the STI regions.
18. The method of claim 16 , wherein the sacrificial epitaxial structure is formed between the STI regions.
19. The method of claim 15 , further comprising forming sidewall spacers on opposite sidewalls of the sacrificial epitaxial plug after removing the substrate and prior to forming the sacrificial epitaxial structure.
20. The method of claim 15 , wherein depositing the isolation material is such that the isolation material is spaced apart from the sacrificial epitaxial plug.