Methods related to switch body connections to achieve soft breakdown

1. A method of implementing a radio-frequency switching device comprising:

providing an assembly of source, gate, and drain implemented on an active region;

providing a first body contact implemented at a first end of the assembly; and

providing a second body contact implemented at a second end of the assembly, the second end distal from the first end along a width of the radio-frequency switching device, the first body contact and the second body contact coupled to a diode, the first body contact coupled to a first end of the diode and the second body contact coupled to a second end of the diode, the first body contact and the second body contact being physically separate body contacts at the first end and the second end of the assembly.

2. The method of claim 1 wherein the diode is a P-N junction diode.

3. The method of claim 1 wherein the diode is a PMOS field-effect transistor.

4. A method of implementing a radio-frequency module comprising:

providing a packaging substrate configured to receive a plurality of devices; and

providing a die mounted on the packaging substrate, the die including a radio-frequency switching device having an assembly of source, gate, and drain implemented on an active region, the radio-frequency switching device further including a first body contact implemented at a first end of the assembly and a second body contact implemented at a second end of the assembly, the second end distal from the first end along a width of the radio-frequency switching device, the first body contact and the second body contact coupled to a diode, the first body contact coupled to a first end of the diode and the second body contact coupled to a second end of the diode, the first body contact and the second body contact being physically separate body contacts at the first end and the second end of the assembly.

5. The method of claim 4 wherein the radio-frequency module is a switch module.

6. The method of claim 4 wherein the die is a silicon-on-insulator (SOI) die.

7. The method of claim 4 wherein the diode is a P-N junction diode.

8. The method of claim 4 wherein the diode is a PMOS field-effect transistor.

9. A method of implementing a wireless device comprising:

providing a transceiver configured to process radio-frequency signals;

providing a radio-frequency module in communication with the transceiver, the radio-frequency module including a radio-frequency switching device including an assembly of source, gate, and drain implemented on an active region, the radio-frequency switching device further including a first body contact implemented at a first end of the assembly and a second body contact implemented at a second end of the assembly, the second end distal from the first end along a width of the radio-frequency switching device, the first body contact and the second body contact coupled to a diode, the first body contact coupled to a first end of the diode and the second body contact coupled to a second end of the diode, the first body contact and the second body contact being physically separate body contacts at the first end and the second end of the assembly; and

providing an antenna in communication with the radio-frequency module, the antenna configured to facilitate transmitting and/or receiving of the radio-frequency signals.

10. The method of claim 9 wherein the radio-frequency module is a switch module.

11. The method of claim 9 wherein the diode is a P-N junction diode.

12. The method of claim 9 wherein the diode is a PMOS field-effect transistor.