Solid state drive apparatus including electrostatic prevention structure
A solid state drive apparatus includes a case including a base and side walls extending upward along a circumference of the base, an electrostatic prevention structure of a metal pillar spaced apart from the side walls and protruding from at least a partial surface of the base and an electrostatic absorbing member on at least a partial surface of the metal pillar, a package substrate module mounted on the electrostatic prevention structure in the case, and a cover covering the case and the package substrate module.
1. A solid state drive apparatus comprising,
a case including a base and side walls, the side walls extending perpendicular to the base along a circumference of the base;
an electrostatic prevention structure separated from the side walls by a distance, the electrostatic prevention structure including a metal pillar and an electrostatic absorbing member, the metal pillar including a plurality of sub-pillars having holes therein, and the electrostatic absorbing member being on the metal pillar and the holes;
a package substrate module on a plurality of substrate mounting units in the side walls in the case and on the electrostatic prevention structure; and
a cover covering the case and the package substrate module.
2. The solid state drive apparatus of claim 1 , the plurality of sub-pillars are shaped with the holes having different sizes therein, the holes being partitioned off by a partition member.
3. The solid state drive apparatus of claim 1 , wherein the holes in the sub-pillars are communication holes.
4. The solid state drive apparatus of claim 1 , wherein the package substrate module comprises:
a package base substrate; and
a semiconductor chip on at least a surface between an upper surface and a lower surface of the package base substrate, the semiconductor chip being on one of the plurality of sub-pillars.
5. The solid state drive apparatus of claim 1 , wherein the sub-pillars are integrated with the case including the base and the side walls.
6. A solid state drive apparatus comprising,
a case including a base and side walls, the side walls extending perpendicular to the base along a circumference of the base;
an electrostatic prevention structure separated from the side walls by a distance, the electrostatic prevention structure including a metal pillar and an electrostatic absorbing member, the metal pillar including a plurality of sub-pillars and a sub-connection pillar, the sub-connection pillar connecting a portion of side walls of the sub-pillars, holes in at least one of the sub-pillars and the sub-connection pillar, and the electrostatic absorbing member being on the metal pillar and the holes;
a package substrate module on a plurality of substrate mounting units in the side walls in the case and on the electrostatic prevention structure; and
a cover covering the case and the package substrate module.
7. The solid state drive apparatus of claim 6 , wherein at least one sub-pillar of the plurality of sub-pillars and the sub-connection pillar have a shape forming the holes exposing the base, the holes having different sizes and being partition by a partition member.
8. The solid state drive apparatus of claim 7 , wherein at least one sub-pillar of the plurality of sub-pillars and the sub-connection pillar have a shape such that the holes form a connection hole exposing the base.
9. The solid state drive apparatus of claim 7 , wherein the plurality of sub-pillars and the sub-connection pillar are integrated with the case.
10. The solid state drive apparatus of claim 7 , wherein the electrostatic absorbing member is on circumferences of the plurality of sub-pillars and the sub-connection pillar such that the electrostatic absorbing member is separated from the side walls by a distance.
11. The solid state drive apparatus of claim 7 , wherein the package substrate module comprises:
a semiconductor chip on at least one surface between an upper surface and a lower surface of a package base substrate, the semiconductor chip being on one of the plurality of sub-pillars or the sub-connection pillar.