Circuit board enclosure with composite liner for inhibiting electrostatic discharge
A computing device for inhibiting electrostatic discharge (ESD) in a computing system, the computing device including a mainboard with computing circuitry for the computing system, a tray in which the mainboard is affixed, and a composite liner for absorbing high-frequency energy and electromagnetic interference from the ESD. The composite liner includes a high-frequency energy absorption layer and an insulation layer coupled to a first surface of the high-frequency energy absorption layer. The high-frequency energy absorption layer includes a high-frequency energy absorption material, and the insulation layer includes an electrical-insulating material. A circuit board enclosure includes the composite liner and a panel with the composite liner at least partially lining an internal receiving surface of the panel. A circuit board is positioned inside the circuit board enclosure with the composite liner interposed between the circuit board and the panel to protect the electronic component from ESD.
1. A computing device for inhibiting electrostatic discharge (ESD) in a computing system, the computing device comprising:
a mainboard with computing circuitry for the computing system;
a tray in which the mainboard is affixed, the tray having an internal receiving surface; and
a composite liner for absorbing high-frequency energy and electromagnetic interference from the ESD, the composite liner being positioned in the tray between the mainboard and the internal receiving surface, the composite liner including
a high-frequency energy absorption layer including a high-frequency energy absorption material, the high-frequency energy absorption layer having a first surface; and
a first insulation layer including a first electrical-insulating material, the first insulation layer being coupled to the first surface of the high-frequency energy absorption layer.
2. The computing device of claim 1 , wherein the high-frequency energy absorption material includes a silicone gel containing magnetic particles of metal oxide and thermoconductive filler.
3. The computing device of claim 1 , wherein the composite liner further includes a second insulation layer including a second electrical-insulating material, the second insulation layer being coupled to a second surface of the high-frequency energy absorption layer opposite the first surface of the high-frequency energy absorption layer.
4. The computing device of claim 3 , wherein the first electrical-insulating material includes at least one of biaxially-oriented polyethylene terephthalate (Mylar), a polymide material, and a polyester material.
5. The computing device of claim 1 , wherein the first insulation layer is adhesively coupled to the first surface of the high-frequency energy absorption layer.
6. The computing device of claim 1 , wherein the first insulation layer covers substantially all of the internal receiving surface of the tray.
7. The computing device of claim 6 , wherein the high-frequency energy absorption layer covers a region of the tray corresponding to location of an electronic component of the mainboard.
8. The computing device of claim 1 , wherein the high-frequency energy absorption layer absorbs high-frequency energy from ESD entering through an aperture in the tray.
9. A circuit board enclosure for inhibiting ESD in a computing system, the circuit board enclosure comprising:
a tray adapted for receiving a mainboard with computing circuitry for the computing system, the tray having an internal receiving surface; and
a composite liner for absorbing high-frequency energy and electromagnetic interference from the ESD, the composite liner at least partially covering the internal receiving surface of the tray, the composite liner including
a high-frequency energy absorption layer including a high-frequency energy absorption material, the high-frequency energy absorption layer having a first surface; and
a first insulation layer including a first electrical-insulating material, the first insulation layer being coupled to the first surface of the high-frequency energy absorption layer.
10. The circuit board enclosure of claim 9 , wherein the high-frequency energy absorption material includes a silicone gel containing magnetic particles of metal oxide and thermoconductive filler.
11. The circuit board enclosure of claim 9 , wherein the composite liner further includes a second insulation layer including a second electrical-insulating material, the second insulation layer being coupled to a second side of the high-frequency energy absorption layer, the second side being opposite the first side of the high-frequency energy absorption layer.
12. The circuit board enclosure of claim 9 , wherein the first electrical-insulating material include at least one of biaxially-oriented polyethylene terephthalate (Mylar), a polymide material, and a polyester material.
13. The circuit board enclosure of claim 9 , wherein the first insulation layer is adhesively coupled to the first side of the high-frequency energy absorption layer.
14. The circuit board enclosure of claim 9 , wherein the first insulation layer covers substantially all of the internal receiving surface of the tray.
15. The circuit board enclosure of claim 9 , wherein the high-frequency energy absorption layer covers a region of the tray corresponding to a predetermined location for placing an electronic component of the mainboard.
16. A composite liner for inhibiting ESD in a computing system, the composite liner comprising:
a high-frequency energy absorption layer including a high-frequency energy absorption material, the high-frequency energy absorption layer having a first surface and a second surface opposite the first surface;
a first insulation layer including a first electrical-insulating material, the first insulation layer being coupled to the first surface of the high-frequency energy absorption layer; and
a second insulation layer including a second electrical-insulating material, the second insulation layer being coupled to the second surface of the high-frequency energy absorption layer.
17. The electronic system of claim 16 , wherein the high-frequency energy absorption material includes a silicone gel containing magnetic particles of metal oxide and thermoconductive filler.
18. The composite liner of claim 16 , wherein the first electrical-insulating material and the second electrical-insulating material each include at least one of biaxially-oriented polyethylene terephthalate (Mylar), a polymide material, and a polyester material.
19. The composite liner of claim 16 further comprising:
a first bonding layer bonding the first side of the high-frequency energy absorption layer with the first insulation layer; and
a second bonding layer bonding the second side of the high-frequency energy absorption layer with the second insulation layer.
20. The composite liner of claim 16 , wherein at least one of the first electrical-insulating material and the second electrical-insulating material has flame-retardant property.