Substrate processing apparatus
A substrate processing apparatus includes a chamber having a plasma processing space, a sidewall of the chamber having an opening for transferring a substrate into the plasma processing space; and a shutter disposed at an inner side than the sidewall and configured to open or close the opening, the shutter having a flow path for a temperature-controlled fluid.
1. A substrate processing apparatus, comprising:
a chamber having an internal space, the chamber having an opening for transferring a substrate from and to the internal space; and
a shutter configured to open and close the opening in the internal space, the shutter having a flow path for a temperature-controlled fluid, the flow path having:
an inlet,
a first supply path and a second supply path being branched from the inlet, the first and second supply paths extending upwards from the inlet while going back and forth in a horizontal direction,
a first return path being connected with the first supply path and extending downwards from the first supply path while going back and forth in a horizontal direction,
a first outlet being connected with the first return path,
a second return path being connected with the second supply path and extending downwards from the second supply path while going back and forth in a horizontal direction, and
a second outlet being connected with the second return path.
2. The substrate processing apparatus of claim 1 ,
wherein the first return path extends along the first supply path, the second return path extends along the second supply path.
3. The substrate processing apparatus of claim 1 ,
wherein the shutter comprises:
a body having a first face; and
a cover member covering the first face,
wherein the first face and the cover member define the flow path.
4. The substrate processing apparatus of claim 3 ,
wherein the flow path is defined by a groove formed on at least one of the first face or the cover member.
5. The substrate processing apparatus of claim 1 , further comprising:
a fluid supply configured to supply the temperature-controlled fluid into the flow path;
a heater configured to heat the shutter; and
a control device,
wherein the control device controls the heater to control a temperature of the shutter.
6. The substrate processing apparatus of claim 5 , further comprising:
an annular protection member defining the internal space,
wherein the control device is configured to control the temperature of the shutter to reduce a temperature difference between the annular protection member and the shutter.
7. The substrate processing apparatus of claim 1 ,
wherein the shutter is fabricated by using a 3D printer technology or an additive manufacturing technology.