Recess frame structure for reduction of spurious signals in a bulk acoustic wave resonator

1. A method of forming a film bulk acoustic wave resonator, the method comprising:

depositing a bottom electrode on an upper surface of a layer of dielectric material disposed over a cavity defined between the layer of dielectric material and a substrate in a central region of the film bulk acoustic wave resonator defining a main active domain in which a main acoustic wave is generated during operation of the film bulk acoustic wave resonator, and in recessed frame regions disposed laterally on opposite sides of the central region;

depositing a seed layer of piezoelectric material on an upper surface of the bottom electrode;

etching one or more openings through the seed layer of piezoelectric material, the etching of the one or more openings including over-etching of the seed layer in an amount sufficient to damage portions of the upper surface of the bottom electrode exposed by etching of the one or more openings, etching the one or more openings through the seed layer of piezoelectric material creating a greater degree of surface defects on the upper surface of the bottom electrode in the recessed frame regions than on the upper surface of the bottom electrode in the central region; and

depositing a bulk film of the piezoelectric material on an upper surface of the seed layer, on a portion of the upper surface of bottom electrode including the damaged portions, and on a portion of the upper surface of the layer of dielectric material.

2. The method of claim 1 wherein over-etching of the seed layer causes sufficient damage to the upper surface of the bottom electrode to cause regions of the bulk film of the piezoelectric material deposited over the one or more openings to exhibit a higher concentration of defects than regions of the bulk film of the piezoelectric material deposited over portions of the seed layer not including the one or more openings.

3. The method of claim 1 further comprising depositing a layer of conductive material on an upper surface of the bulk film of the piezoelectric material to form a top electrode.

4. The method of claim 3 wherein depositing the layer of conductive material includes depositing the layer of conductive material with a first thickness in a central region disposed between areas directly above the one or more openings in the seed layer and depositing the conductive material with a second thickness greater than the first thickness in areas on opposite sides of the areas directly above the one or more openings in the seed layer from the central region.

5. The method of claim 3 further comprising conformally depositing a second layer of dielectric material on an upper surface of the layer of conductive material.

6. The method of claim 3 wherein depositing the layer of conductive material includes depositing the layer of conductive material with a vertical distance between the top electrode and the bottom electrode in the central region being greater than the vertical distance between the top electrode and the bottom electrode in the recessed frame regions.

7. The method of claim 1 further comprising forming raised frame regions disposed laterally on opposite sides of the recessed frame regions from the central region, the bulk film of the piezoelectric material extending laterally through the raised frame regions.

8. The method of claim 7 wherein the one or more openings are etched in the recessed frame regions.

9. The method of claim 8 wherein the one or more openings are not etched in the raised frame regions.

10. The method of claim 8 further comprising depositing the bulk film of the piezoelectric material in the raised frame regions with a lower concentration of defects than a concentration of defects in the bulk film of the piezoelectric material deposited in the recessed frame regions.

11. The method of claim 8 further comprising depositing the bulk film of the piezoelectric material in the recessed frame regions with a greater concentration of defects than a concentration of defects in the bulk film of the piezoelectric material disposed in the central region.

12. The method of claim 8 wherein the one or more openings are etched in the recessed frame regions and in the raised frame regions.

13. The method of claim 12 further comprising depositing the bulk film of the piezoelectric material in the raised frame regions with a greater concentration of defects than a concentration of defects in the bulk film of the piezoelectric material disposed in the central region.

14. The method of claim 12 further comprising depositing the bulk film of the piezoelectric material in the raised frame regions in contact with the lower electrode.

15. The method of claim 12 wherein etching the one or more openings through the seed layer of piezoelectric material includes creating a greater degree of surface defects on the surface of the bottom electrode in the raised frame regions than on the surface of the bottom electrode in the central region.

16. The method of claim 1 further comprising depositing the bulk film of the piezoelectric material in the recessed frame regions in contact with the lower electrode.

17. The method of claim 1 further comprising forming a radio frequency filter including the film bulk acoustic wave resonator.

18. The method of claim 17 further comprising forming an electronics module including the radio frequency filter.

19. The method of claim 18 further comprising forming an electronic device including the electronics module.

20. A method of forming a film bulk acoustic wave resonator, the method comprising:

depositing a bottom electrode on an upper surface of a layer of dielectric material disposed over a cavity defined between the layer of dielectric material and a substrate in a central region of the film bulk acoustic wave resonator defining a main active domain in which a main acoustic wave is generated during operation of the film bulk acoustic wave resonator, and in recessed frame regions disposed laterally on opposite sides of the central region;

depositing a seed layer of piezoelectric material on an upper surface of the bottom electrode;

etching one or more openings through the seed layer of piezoelectric material, the etching of the one or more openings including over-etching of the seed layer in an amount sufficient to damage portions of the upper surface of the bottom electrode exposed by etching of the one or more openings;

depositing a bulk film of the piezoelectric material on an upper surface of the seed layer, on a portion of the upper surface of bottom electrode including the damaged portions, and on a portion of the upper surface of the layer of dielectric material; and

depositing a layer of conductive material on an upper surface of the bulk film of the piezoelectric material to form a top electrode including depositing the layer of conductive material with a first thickness in a central region disposed between areas directly above the one or more openings in the seed layer and depositing the conductive material with a second thickness greater than the first thickness in areas on opposite sides of the areas directly above the one or more openings in the seed layer from the central region.

21. A method of forming a film bulk acoustic wave resonator, the method comprising:

depositing a bottom electrode on an upper surface of a layer of dielectric material disposed over a cavity defined between the layer of dielectric material and a substrate in a central region of the film bulk acoustic wave resonator defining a main active domain in which a main acoustic wave is generated during operation of the film bulk acoustic wave resonator, and in recessed frame regions disposed laterally on opposite sides of the central region;

depositing a seed layer of piezoelectric material on an upper surface of the bottom electrode;

etching one or more openings through the seed layer of piezoelectric material, the etching of the one or more openings including over-etching of the seed layer in an amount sufficient to damage portions of the upper surface of the bottom electrode exposed by etching of the one or more openings;

depositing a bulk film of the piezoelectric material on an upper surface of the seed layer, on a portion of the upper surface of bottom electrode including the damaged portions, and on a portion of the upper surface of the layer of dielectric material; and

depositing a layer of conductive material on an upper surface of the bulk film of the piezoelectric material to form a top electrode including depositing the layer of conductive material with a vertical distance between the top electrode and the bottom electrode in the central region being greater than the vertical distance between the top electrode and the bottom electrode in the recessed frame regions.

22. A method of forming a film bulk acoustic wave resonator, the method comprising:

depositing a bottom electrode on an upper surface of a layer of dielectric material disposed over a cavity defined between the layer of dielectric material and a substrate in a central region of the film bulk acoustic wave resonator defining a main active domain in which a main acoustic wave is generated during operation of the film bulk acoustic wave resonator, and in recessed frame regions disposed laterally on opposite sides of the central region;

depositing a seed layer of piezoelectric material on an upper surface of the bottom electrode;

etching one or more openings through the seed layer of piezoelectric material in the recessed frame regions, the etching of the one or more openings including over-etching of the seed layer in an amount sufficient to damage portions of the upper surface of the bottom electrode exposed by etching of the one or more openings;

depositing a bulk film of the piezoelectric material on an upper surface of the seed layer, on a portion of the upper surface of bottom electrode including the damaged portions, and on a portion of the upper surface of the layer of dielectric material, the bulk film of the piezoelectric material being deposited in the recessed frame regions with a greater concentration of defects than a concentration of defects in the bulk film of the piezoelectric material disposed in the central region; and

forming raised frame regions disposed laterally on opposite sides of the recessed frame regions from the central region, the bulk film of the piezoelectric material extending laterally through the raised frame regions.

23. A method of forming a film bulk acoustic wave resonator, the method comprising:

depositing a bottom electrode on an upper surface of a layer of dielectric material disposed over a cavity defined between the layer of dielectric material and a substrate in a central region of the film bulk acoustic wave resonator defining a main active domain in which a main acoustic wave is generated during operation of the film bulk acoustic wave resonator, and in recessed frame regions disposed laterally on opposite sides of the central region;

depositing a seed layer of piezoelectric material on an upper surface of the bottom electrode;

etching one or more openings through the seed layer of piezoelectric material, the etching of the one or more openings including over-etching of the seed layer in an amount sufficient to damage portions of the upper surface of the bottom electrode exposed by etching of the one or more openings;

depositing a bulk film of the piezoelectric material on an upper surface of the seed layer, on a portion of the upper surface of bottom electrode including the damaged portions, and on a portion of the upper surface of the layer of dielectric material, the bulk film of the piezoelectric material being deposited in the recessed frame regions with a greater concentration of defects than a concentration of defects in the bulk film of the piezoelectric material disposed in the central region; and

forming raised frame regions disposed laterally on opposite sides of the recessed frame regions from the central region, the bulk film of the piezoelectric material extending laterally through the raised frame regions, the one or more openings being etched in the recessed frame regions and in the raised frame regions.