Bulk acoustic wave component with circuit element including conductive material buried in dielectric
Aspects of this disclosure relate to a bulk acoustic wave component that includes a bulk acoustic wave resonator, a capacitor, and a circuit element electrically connected to the bulk acoustic wave resonator. The capacitor includes an electrode buried in dielectric material. The circuit element includes conductive material in the dielectric layer. Related filters, multiplexers, radio frequency modules, radio frequency systems, wireless communication devices, and methods are disclosed.
1 . A bulk acoustic wave component comprising:
a bulk acoustic wave resonator including an acoustic reflector, a first electrode, a second electrode, and piezoelectric layer over the acoustic reflector and between the first electrode and the second electrode;
a circuit element electrically connected to the bulk acoustic wave resonator, the circuit element including conductive material buried in a dielectric layer; and
a capacitor including an electrode buried in the dielectric layer.
2 . The bulk acoustic wave component of claim 1 wherein the dielectric layer extends under the acoustic reflector.
3 . The bulk acoustic wave component of claim 1 wherein the capacitor is coupled to the bulk acoustic wave resonator.
4 . The bulk acoustic wave component of claim 1 wherein the capacitor is positioned laterally relative to the acoustic reflector.
5 . The bulk acoustic wave component of claim 1 wherein the capacitor is a metal-insulator-metal capacitor consisting of the electrode, a second electrode, and material of the dielectric layer positioned between the electrode and the second electrode.
6 . The bulk acoustic wave component of claim 1 wherein the electrode of the capacitor is thicker than the first electrode of the bulk acoustic wave resonator.
7 . The bulk acoustic wave component of claim 1 wherein the circuit element is an inductor.
8 . The bulk acoustic wave component of claim 1 wherein the circuit element is a tuning stub.
9 . The bulk acoustic wave component of claim 1 wherein the circuit element is a fuse element.
10 . The bulk acoustic wave component of claim 1 further comprising a terminal located outside of a footprint of the bulk acoustic wave resonator, the circuit element electrically connected to the terminal.
11 . The bulk acoustic wave component of claim 1 wherein the acoustic reflector is an air cavity.
12 . The bulk acoustic wave component of claim 1 wherein the bulk acoustic wave resonator, the capacitor, and the circuit element are included in a band pass filter arranged to filter a radio frequency signal.
13 . The bulk acoustic wave component of claim 1 wherein the capacitor is in parallel with the bulk acoustic wave resonator.
14 . The bulk acoustic wave component of claim 1 wherein the capacitor is in series with the bulk acoustic wave resonator.
15 . An acoustic wave filter for filtering a radio frequency signal, the acoustic wave filter comprising:
a bulk acoustic wave resonator;
a circuit element electrically connected to the bulk acoustic wave resonator, the circuit element including conductive material buried in a dielectric layer;
a metal-insulator-metal capacitor including an electrode buried in the dielectric layer; and
a plurality of additional bulk acoustic wave resonators connected to the bulk acoustic wave resonator.
16 . The acoustic wave filter of claim 15 wherein the circuit element is an inductor.
17 . The acoustic wave filter of claim 15 wherein the circuit element is a tuning stub.
18 . The acoustic wave filter of claim 15 wherein the circuit element is a fuse element.
19 . The acoustic wave filter of claim 15 wherein the metal-insulator-metal capacitor is connected in parallel with the bulk acoustic wave resonator.
20 . A packaged radio frequency module comprising:
a filter including a bulk acoustic wave resonator, a circuit element electrically connected to the bulk acoustic wave resonator and including conductive material buried in a dielectric layer, and a metal-insulator-metal capacitor including an electrode buried in the dielectric layer;
a power amplifier operatively coupled to the filter; and
a packaging structure enclosing the filter and the power amplifier.