Radio frequency front end module with integrated resonator and antenna
A radio-frequency front end module comprises a first substrate, a second substrate arranged opposing the first substrate, one or more resonators disposed on a surface of the first substrate, the first surface of the first substrate facing the second substrate, and one or more antennas that are each supported by the first substrate and the second substrate. A beamforming antenna is also provided, as is a wireless mobile device.
1 . A radio-frequency front end module comprising:
a first substrate;
a second substrate arranged opposing the first substrate, the second substrate comprising a high resistivity material and a layer of a high permittivity material disposed upon an external surface of the high resistivity material, the external surface of the high resistivity material of the second substrate being on a side of the second substrate facing away from the first substrate;
one or more resonators disposed on a first surface of the first substrate and within a cavity defined between the first substrate and the second substrate, the first surface of the first substrate facing the second substrate; and
one or more antennas disposed on the layer of high permittivity material of the second substrate.
2 . The radio-frequency front end module of claim 1 further comprising one or more additional antennas electrically connected to the one or more antennas and disposed on a layer of the high permittivity material that is disposed on an internal surface of the high resistivity material of the second substrate, the internal surface of the high resistivity material of the second substrate being on an opposite side of the second substrate from the external surface of the high resistivity material of the second substrate.
3 . The radio-frequency front end module of claim 1 wherein the first substrate lies within a first plane and the second substrate lies within a second plane, the second plane being parallel to the first plane.
4 . The radio-frequency front end module of claim 1 wherein the first substrate and the second substrate are hermetically sealed to form the cavity between the first substrate and the second substrate.
5 . The radio-frequency front end module of claim 1 wherein the one or more resonators are electrically connected to the one or more antennas.
6 . The radio-frequency front end module of claim 1 wherein the one or more resonators include one or more or bulk acoustic wave resonators and/or Lamb wave resonators.
7 . The radio-frequency front end module of claim 1 wherein the one or more antennas are patch antennas.
8 . The radio-frequency front end module of claim 1 wherein either or both of the first substrate or the high resistivity material of the second substrate comprises silicon.
9 . The radio-frequency front end module of claim 1 wherein all of the one or more antennas are disposed on the layer of the high permittivity material that is disposed on the high resistivity material of the second substrate.
10 . The radio-frequency front end module of claim 1 further comprising a layer of the high permittivity material disposed on an external surface of the first substrate, the external surface of the high resistivity material of the first substrate being on a side of the first substrate facing away from the second substrate, and one or more additional antennas disposed on the layer of the high permittivity material that is disposed on the external surface of the first substrate.
11 . The radio-frequency front end module of claim 1 wherein the high permittivity material comprises lithium niobate.
12 . The radio-frequency front end module of claim 1 wherein the high resistivity material comprises one of Si or GaAs.
13 . The radio-frequency front end module of claim 1 wherein the layer of high permittivity material has a thickness substantially less than a thickness of the second substrate.
14 . The radio-frequency front end module of claim 1 wherein the first substrate comprises the high resistivity material and a layer of the high permittivity material disposed on the high resistivity material.
15 . The radio-frequency front end module of claim 14 further comprising one or more additional antennas disposed on the layer of high permittivity material of the first substrate.
16 . The radio-frequency front end module of claim 14 wherein the layer of high permittivity material has a thickness substantially less than a thickness of the first substrate.
17 . A wireless mobile device comprising a radio-frequency front end module, the radio-frequency front end module having a first substrate, a second substrate arranged opposing the first substrate, the second substrate comprising a high resistivity material and a layer of a high permittivity material disposed upon an external surface of the high resistivity material, the external surface of the high resistivity material of the second substrate being on a side of the second substrate facing away from the first substrate, one or more resonators disposed on a surface of the first substrate and within a cavity defined between the first substrate and the second substrate, the surface of the first substrate facing the second substrate, and one or more antennas disposed on the layer of high permittivity material of the second substrate.
18 . A beamforming antenna module comprising an array of radio-frequency front end modules, each radio-frequency front end module having a first substrate, a second substrate arranged opposing the first substrate, the second substrate comprising a high resistivity material and a layer of a high permittivity material disposed upon an external surface of the high resistivity material, the external surface of the high resistivity material of the second substrate being on a side of the second substrate facing away from the first substrate, one or more resonators disposed on a surface of the first substrate and within a cavity defined between the first substrate and the second substrate, the surface of the first substrate facing the second substrate, and one or more antennas disposed on the layer of high permittivity material of the second substrate.