Printing head and method for applying a correction for mounting deviation of light-emitting chips

1. A printing head for applying a correction for mounting deviation of light-emitting chips, the printing head comprising:

a substrate; and

a plurality of light-emitting chips, arranged on the substrate along an axis and staggered at intervals on two sides of the axis, wherein each light-emitting chip comprises a plurality of primary light-emitting elements linearly arranged in parallel to the axis, a first chip and a second chip in the light-emitting chips that are adjacent to each other each have an adjacent end, and the first chip further comprises at least one first spare light-emitting element located on the adjacent end and continuously and linearly arranged after the primary light-emitting elements; and

if the first chip and the second chip are both at a target mounting position, the at least one first spare light-emitting element of the first chip respectively faces to first N primary light-emitting elements of the second chip that are located on the adjacent end, each two of the light-emitting elements facing to each other form a group, each first spare light-emitting element is set to a light emission disabled state, and N is a quantity of the first spare light-emitting elements, wherein a transverse spacing exits between vertical projections, on the axis, of the first primary light-emitting elements of the first chip and the second chip that are located on the adjacent end, and if the transverse spacing falls within a mounting tolerance interval, each first spare light-emitting element of the first chip is set to a light emission disabled state.

2. The printing head for applying a correction for mounting deviation of light-emitting chips according to claim 1 , wherein the second chip further comprises at least one second spare light-emitting element located on the adjacent end and continuously and linearly arranged after the primary light-emitting elements, if the first chip and the second chip are both at the target mounting position, the at least one second spare light-emitting element of the second chip respectively faces to first M primary light-emitting elements of the first chip that are located on the adjacent end, each two of the light-emitting elements facing to each other form a group, each second spare light-emitting element is set to a light emission disabled state, and M is a quantity of the second spare light-emitting elements.

3. The printing head for applying a correction for mounting deviation of light-emitting chips according to claim 1 , wherein the mounting tolerance interval defines a low width sub-interval less than a standard sub-interval, and if the transverse spacing falls within the low width sub-interval, the first primary light-emitting element of the first chip or the second chip that is located on the adjacent end is set to a light emission shortened state.

4. The printing head for applying a correction for mounting deviation of light-emitting chips according to claim 1 , wherein the mounting tolerance interval defines a high width sub-interval greater than the standard sub-interval, and if the transverse spacing falls within the high width sub-interval, the first primary light-emitting element of the first chip or the second chip that is located on the adjacent end is set to a light emission prolonged state.

5. The printing head for applying a correction for mounting deviation of light-emitting chips according to claim 1 , wherein a transverse spacing exists between vertical projections, on the axis, of the first primary light-emitting elements of the first chip and the second chip that are located on the adjacent end, and if the transverse spacing is greater than a mounting tolerance interval, each first spare light-emitting element of the first chip that does not face to each primary light-emitting element of the second chip is set to a light emission enabled state.

6. The printing head for applying a correction for mounting deviation of light-emitting chips according to claim 5 , wherein if the transverse spacing is greater than the mounting tolerance interval, each first spare light-emitting element of the first chip that faces to the each primary light-emitting element of the second chip is set to a light emission disabled state.

7. The printing head for applying a correction for mounting deviation of light-emitting chips according to claim 6 , wherein the second chip further comprises at least one second spare light-emitting element located on the adjacent end and continuously and linearly arranged after the primary light-emitting elements, and if the transverse spacing is greater than the mounting tolerance interval, each second spare light-emitting element of the second chip is set to a light emission disabled state.

8. The printing head for applying a correction for mounting deviation of light-emitting chips according to claim 1 , wherein the second chip further comprises at least one second spare light-emitting element located on the adjacent end and continuously and linearly arranged after the primary light-emitting elements, a transverse spacing exists between vertical projections, on the axis, of the first primary light-emitting elements of the first chip and the second chip that are located on the adjacent end, if the transverse spacing is greater than a mounting tolerance interval, each first spare light-emitting element of the first chip is set to a light emission disabled state, each second spare light-emitting element of the second chip that faces to each primary light-emitting element of the first chip is set to a light emission disabled state, and each second spare light-emitting element of the second chip that does not face to the each primary light-emitting element of the first chip is set to a light emission enabled state.

9. The printing head for applying a correction for mounting deviation of light-emitting chips according to claim 1 , wherein a transverse spacing exists between vertical projections, on the axis, of the first primary light-emitting elements of the first chip and the second chip that are located on the adjacent end, if the transverse spacing is less than a mounting tolerance interval, each first spare light-emitting element of the first chip is set to a light emission disabled state, and the primary light-emitting element of the second chip that is located on the adjacent end and faces to the primary light-emitting element of the first chip is set to a light emission disabled state.

10. The printing head for applying a correction for mounting deviation of light-emitting chips according to claim 9 , wherein the second chip further comprises at least one second spare light-emitting element located on the adjacent end and continuously and linearly arranged after the primary light-emitting elements, and if the transverse spacing is less than the mounting tolerance interval, each second spare light-emitting element of the second chip is set to a light emission disabled state.

11. The printing head for applying a correction for mounting deviation of light-emitting chips according to claim 1 , wherein a transverse spacing exists between vertical projections, on the axis, of the first primary light-emitting elements of the first chip and the second chip that are located on the adjacent end, if the transverse spacing is less than a mounting tolerance interval, each first spare light-emitting element of the first chip is set to a light emission disabled state, and the primary light-emitting element of the first chip that is located on the adjacent end and faces to the primary light-emitting element of the second chip is set to a light emission disabled state.

12. A method for applying a correction for mounting deviation of light-emitting chips, applicable to a printing head, wherein the printing head comprises a substrate and a plurality of light-emitting chips mounted on the substrate, the light-emitting chips are arranged along an axis and staggered at intervals on two sides of the axis, each light-emitting chip comprises a plurality of primary light-emitting elements linearly arranged in parallel to the axis, a first chip and a second chip in the light-emitting chips that are adjacent to each other each have an adjacent end, the first chip further comprises at least one first spare light-emitting element located on the adjacent end and continuously and linearly arranged after the primary light-emitting elements, if the first chip and the second chip are both at a target mounting position, the at least one first spare light-emitting element of the first chip respectively faces to first N primary light-emitting elements of the second chip that are located on the adjacent end, N is a quantity of the first spare light-emitting elements, each two of the light-emitting elements facing to each other form a group, and the method for applying a correction for mounting deviation of light-emitting chips comprises:

measuring a transverse spacing between vertical projections, on the axis, of first primary light-emitting elements of the first chip and the second chip that are located on the adjacent end;

determining whether the transverse spacing falls within a mounting tolerance interval; and

if the transverse spacing falls within the mounting tolerance interval, setting each first spare light-emitting element of the first chip to a light emission disabled state.

13. The method for applying a correction for mounting deviation of light-emitting chips according to claim 12 , wherein the second chip further comprises at least one second spare light-emitting element located on the adjacent end and continuously and linearly arranged after the primary light-emitting elements, if the first chip and the second chip are both at the target mounting position, the at least one second spare light-emitting element of the second chip respectively faces to first M primary light-emitting elements of the first chip that are located on the adjacent end, M is a quantity of the second spare light-emitting elements, each two of the light-emitting elements facing to each other form a group, and the method for applying a correction for mounting deviation of light-emitting chips further comprises: if the transverse spacing falls within the mounting tolerance interval, setting each second spare light-emitting element of the second chip to a light emission disabled state.

14. The method for applying a correction for mounting deviation of light-emitting chips according to claim 12 , wherein the mounting tolerance interval defines a low width sub-interval less than a standard sub-interval, and the method for applying a correction for mounting deviation of light-emitting chips further comprises:

determining whether the transverse spacing falls within the low width sub-interval; and

if the transverse spacing falls within the low width sub-interval, shortening a light-emitting duration of the first primary light-emitting element of the first chip or the second chip that is located on the adjacent end.

15. The method for applying a correction for mounting deviation of light-emitting chips according to claim 12 , wherein the mounting tolerance interval defines a high width sub-interval greater than a standard sub-interval, and the method for applying a correction for mounting deviation of light-emitting chips further comprises:

determining whether the transverse spacing falls within the high width sub-interval; and

if the transverse spacing falls within the high width sub-interval, prolonging a light-emitting duration of the first primary light-emitting element of the first chip or the second chip that is located on the adjacent end.

16. The method for applying a correction for mounting deviation of light-emitting chips according to claim 12 , the method further comprising:

if the transverse spacing is greater than the mounting tolerance interval, setting, to a light emission enabled state, each first spare light-emitting element of the first chip that does not face to each primary light-emitting element of the second chip.

17. The method for applying a correction for mounting deviation of light-emitting chips according to claim 16 , the method further comprising:

if the transverse spacing is greater than the mounting tolerance interval, setting, to a light emission disabled state, each first spare light-emitting element of the first chip that faces to the each primary light-emitting element of the second chip.

18. The method for applying a correction for mounting deviation of light-emitting chips according to claim 17 , wherein the second chip further comprises at least one second spare light-emitting element located on the adjacent end and continuously and linearly arranged after the primary light-emitting elements, and the method for applying a correction for mounting deviation of light-emitting chips further comprises: if the transverse spacing is greater than the mounting tolerance interval, setting each second spare light-emitting element of the second chip to a light emission disabled state.

19. The method for applying a correction for mounting deviation of light-emitting chips according to claim 12 , wherein the second chip further comprises at least one second spare light-emitting element located on the adjacent end and continuously and linearly arranged after the primary light-emitting elements, and the method for applying a correction for mounting deviation of light-emitting chips further comprises: if the transverse spacing is greater than the mounting tolerance interval, setting each first spare light-emitting element of the first chip to a light emission disabled state, setting, to a light emission disabled state, each second spare light-emitting element of the second chip that faces to each primary light-emitting element of the first chip, and setting, to a light emission enabled state, each second spare light-emitting element of the second chip that does not face to the each primary light-emitting element of the first chip.

20. The method for applying a correction for mounting deviation of light-emitting chips according to claim 12 , the method further comprising:

if the transverse spacing is less than the mounting tolerance interval, setting each first spare light-emitting element of the first chip to a light emission disabled state, and setting, to a light emission disabled state, each primary light-emitting element of the second chip that is located on the adjacent end and faces to the each primary light-emitting element of the first chip.

21. The method for applying a correction for mounting deviation of light-emitting chips according to claim 20 , wherein the second chip further comprises at least one second spare light-emitting element located on the adjacent end and continuously and linearly arranged after the primary light-emitting elements, and if the transverse spacing is less than the mounting tolerance interval, each second spare light-emitting element of the second chip is set to a light emission disabled state.

22. The method for applying a correction for mounting deviation of light-emitting chips according to claim 12 , wherein the second chip further comprises at least one second spare light-emitting element located on the adjacent end and continuously and linearly arranged after the primary light-emitting elements, and the method for applying a correction for mounting deviation of light-emitting chips further comprises: if the transverse spacing is less than the mounting tolerance interval, setting each first spare light-emitting element of the first chip to a light emission disabled state, and setting, to a light emission disabled state, each primary light-emitting element of the first chip that is located on the adjacent end and faces to each primary light-emitting element of the second chip.