IP Library › Granted Patent US 11,984,300
Granted Patent B2
US 11,984,300 · App. 16/877,853 · Granted May 14, 2024

Plasma processing apparatus

Inventors: Takehiro Tanikawa (Miyagi, JP); Shuhei Yamabe (Miyagi, JP); Yohei Uchida (Miyagi, JP); Yasuharu Sasaki (Miyagi, JP)
Assignee: TOKYO ELECTRON LIMITED
H01J37/32623H01J37/32082H01J37/32532H01J2237/334
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Quick Facts
Patent No.
US 11,984,300
App. No.
16/877,853
Granted
May 14, 2024
Kind
B2
Abstract

A plasma processing apparatus includes a chamber; a wall member; an insulating member; and a ground member. The wall member is partially placed in an internal space of the chamber and exposed to a space at an outside of the chamber. The insulating member is provided on the wall member. The ground member is made of silicon, provided in the internal space and mounted on the insulating member. The wall member is configured to support the ground member in a non-contact state with the insulating member therebetween. The ground member is in contact with a spherical surface of the insulating member and mounted on the spherical surface.

Claims (20)

1. An apparatus for plasma processing comprising:

a chamber;

a wall member, partially placed in an internal space of the chamber, extending from the internal space toward an outside of the chamber to be exposed to a space at the outside of the chamber;

one or more insulating members provided on the wall member; and

a ground member which is made of silicon, provided in the internal space such that the ground member is not exposed to the space at the outside of the chamber and mounted on the one or more insulating members, the ground member as well as the wall member being set to have a ground potential,

wherein the wall member is configured to support the ground member in a non-contact state with the one or more insulating members therebetween,

each of the one or more insulating members has a spherical surface, and

the ground member is in contact with the spherical surface and mounted on the spherical surface,

wherein the one or more insulating members are multiple spherical bodies,

wherein the wall member is provided with multiple grooves opened upwards, and

each of the multiple spherical bodies is partially located in a corresponding groove among the multiple grooves,

wherein a respective bottom surface of each of the multiple grooves has a spherical concave surface and a flat surface surrounding the spherical concave surface, and

each of the multiple spherical bodies is partially inserted into the spherical concave surface in the corresponding groove.

2. The apparatus of claim 1 ,

wherein each of the multiple grooves is in a form of a gourd, and a width of an open end thereof is smaller than a diameter of each of the multiple spherical bodies, and

a center of each of the multiple spherical bodies is located within the corresponding groove among the multiple grooves.

3. The apparatus of claim 1 ,

wherein each of the one or more insulating members has thermal conductivity lower than thermal conductivity of the ground member and thermal conductivity of the wall member.

4. The apparatus of claim 3 ,

wherein each of the one or more insulating members is made of ceramics, quartz or stainless steel.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 19, 2020
From: TANIKAWA, TAKEHIRO; YAMABE, SHUHEI; UCHIDA, YOHEI; SASAKI, YASUHARU
To: TOKYO ELECTRON LIMITED
Reel/Frame 052701/0634 →
Priority Claims (1)
JP 2019-095099 · May 21, 2019 · national
Continuity (1)
Related Publication 20200373130A1 · Nov 26, 2020