IP Library › Granted Patent US 11,997,883
Granted Patent B2
US 11,997,883 · App. 17/870,040 · Granted May 28, 2024

Organic light emitting diode display device

Inventor: Wei Yang (Beijing, CN)
Assignee: BOE TECHNOLOGY GROUP CO., LTD.
H10K59/1213H10K77/111H01L27/1218H01L27/1225H01L27/1251H01L27/1262H01L27/127H01L29/66757H01L29/66969H01L29/78675H01L29/7869H10K59/1201H10K2102/311
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Quick Facts
Patent No.
US 11,997,883
App. No.
17/870,040
Granted
May 28, 2024
Kind
B2
Abstract

An organic light emitting diode display device are provided. The organic light emitting diode display device includes: a substrate; a barrier layer, located on a side of the substrate; a first buffer layer, located on a side of the barrier layer; a first semiconductor layer, located on a side of the first buffer layer; a first gate insulating layer, located on a side of the first semiconductor layer; a first gate electrode, located on a side of the first gate insulating layer; a second buffer layer, located on a side of the first gate electrode; a second semiconductor layer, located on a side of the second buffer layer; a second gate insulating layer, located on a side of the second semiconductor layer; a second gate electrode, located on a side of the second gate insulating layer.

Claims (59)

1. An organic light emitting diode display device, comprising:

a substrate;

a barrier layer, located on a side of the substrate;

a first buffer layer, located on a side of the barrier layer away from the substrate;

a first semiconductor layer, located on a side of the first buffer layer away from the substrate;

a first gate insulating layer, located on a side of the first semiconductor layer away from the substrate;

a first gate electrode, located on a side of the first gate insulating layer away from the substrate;

a second buffer layer, located on a side of the first gate electrode away from the substrate;

a second semiconductor layer, located on a side of the second buffer layer away from the substrate;

a second gate insulating layer, located on a side of the second semiconductor layer away from the substrate;

a second gate electrode, located on a side of the second gate insulating layer away from the substrate,

wherein a material of the first semiconductor layer is different from that of the second semiconductor layer,

wherein a thickness of the second gate insulating layer in a direction perpendicular to the substrate is 1000-1500 angstroms,

the organic light emitting diode display device further comprises a first metal pattern, wherein the first metal pattern is located on a side of the second buffer layer away from the substrate and a side of the second gate insulating layer close to the substrate, an orthographic projection of the second gate electrode on the substrate overlaps with an orthographic projection of the first metal pattern on the substrate, and a distance between the first metal pattern and the second gate electrode is 1000-1500 angstroms.

2. The organic light emitting diode display device of claim 1 , further comprising:

a first electrode pattern, connected with the first semiconductor layer, and

a second electrode pattern, connected with the first electrode pattern,

wherein the first electrode pattern comprises a first source electrode and a first drain electrode, the second electrode pattern comprises a first auxiliary source electrode and a first auxiliary drain electrode, the first auxiliary source electrode is electrically connected with the first source electrode, and the first auxiliary drain electrode is electrically connected with the first drain electrode.

3. The organic light emitting diode display device of claim 1 , wherein the first metal pattern is located in a same layer as the second semiconductor layer.

4. The organic light emitting diode display device of claim 1 , further comprising an interlayer dielectric layer, located on a side of the second gate electrode away from the substrate.

5. The organic light emitting diode display device of claim 1 , wherein the distance between the first metal pattern and the second gate electrode is 1300-1400 angstroms.

6. The organic light emitting diode display device of claim 1 , wherein the material of the first semiconductor layer comprises polysilicon and the material of the second semiconductor pattern comprises metal oxide.

7. The organic light emitting diode display device of claim 6 , wherein the metal oxide comprises indium gallium zinc oxide (IGZO).

8. An organic light emitting diode display device, comprising:

a substrate;

a barrier layer, located on a side of the substrate;

a first buffer layer, located on a side of the barrier layer away from the substrate;

a first semiconductor layer, located on a side of the first buffer layer away from the substrate;

a first gate insulating layer, located on a side of the first semiconductor layer away from the substrate;

a first gate electrode, located on a side of the first gate insulating layer away from the substrate;

a second buffer layer, located on a side of the first gate electrode away from the substrate;

a second semiconductor layer, located on a side of the second buffer layer away from the substrate;

a second gate insulating layer, located on a side of the second semiconductor layer away from the substrate;

a second gate electrode, located on a side of the second gate insulating layer away from the substrate,

wherein a material of the first semiconductor layer is different from that of the second semiconductor layer, and the first gate electrode directly contacts with the first gate insulating layer,

a thickness of the second gate insulating layer in a direction perpendicular to the substrate is 1000-1500 angstroms,

the organic light emitting diode display device further comprises a first metal pattern, wherein the first metal pattern is located on a side of the second buffer layer away from the substrate and a side of the second gate insulating layer close to the substrate, an orthographic projection of the second gate electrode on the substrate overlaps with an orthographic projection of the first metal pattern on the substrate, and a distance between the first metal pattern and the second gate electrode is 1000-1500 angstroms.

9. The organic light emitting diode display device of claim 8 , wherein the first semiconductor layer directly contacts with the first buffer layer, and the second semiconductor layer directly contacts with the second buffer layer.

10. The organic light emitting diode display device of claim 8 , wherein the first metal pattern is located in a same layer as the second semiconductor layer.

11. An organic light emitting diode display device, comprising:

a substrate;

a barrier layer, located on a side of the substrate;

a first buffer layer, located on a side of the barrier layer away from the substrate;

a first semiconductor layer, located on a side of the first buffer layer away from the substrate;

a first gate insulating layer, located on a side of the first semiconductor layer away from the substrate;

a first gate electrode, located on a side of the first gate insulating layer away from the substrate;

a second buffer layer, located on a side of the first gate electrode away from the substrate;

a second semiconductor layer, located on a side of the second buffer layer away from the substrate;

a second gate insulating layer, located on a side of the second semiconductor layer away from the substrate;

a second gate electrode, located on a side of the second gate insulating layer away from the substrate,

wherein a material of the first semiconductor layer is different from that of the second semiconductor layer, the organic light emitting diode display device has a display area and a peripheral area, a bending region is provided on a side of the second gate electrode away from the substrate, a metal trace is provided in the bending region, and the metal trace is configured to connect a trace of the display area to the peripheral area,

a thickness of the second gate insulating layer in a direction perpendicular to the substrate is 1000-1500 angstroms,

the organic light emitting diode display device further comprises a first metal pattern, wherein the first metal pattern is located on a side of the second buffer layer away from the substrate and a side of the second gate insulating layer close to the substrate, an orthographic projection of the second gate electrode on the substrate overlaps with an orthographic projection of the first metal pattern on the substrate, and a distance between the first metal pattern and the second gate electrode is 1000-1500 angstroms.

12. The organic light emitting diode display device of claim 11 , further comprising:

a first electrode pattern, connected with the first semiconductor layer, and

a second electrode pattern, connected with the first electrode pattern,

wherein the first electrode pattern comprises a first source electrode and a first drain electrode, the second electrode pattern comprises a first auxiliary source electrode and a first auxiliary drain electrode, the first auxiliary source electrode is electrically connected with the first source electrode, and the first auxiliary drain electrode is electrically connected with the first drain electrode.

13. The organic light emitting diode display device of claim 12 , further comprising a second auxiliary source electrode and a second auxiliary drain electrode, wherein the second auxiliary source electrode and the second auxiliary drain electrode are electrically connected to the first auxiliary source electrode and the first auxiliary drain electrode, respectively.

14. The organic light emitting diode display device of claim 13 , wherein the second auxiliary source electrode, the second auxiliary drain electrode and the metal trace are located in a same trace and comprise a same material.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 21, 2022
From: YANG, WEI
To: BOE TECHNOLOGY GROUP CO., LTD.
Reel/Frame 060578/0962 →
Priority Claims (1)
CN 201810336384.2 · Apr 11, 2018 · national
Continuity (2)
Continuation 16471911
Related Publication 20220359636A1 · Nov 10, 2022
Cited By (1)
US 12,538,577