IP Library › Granted Patent US 12,003,025
Granted Patent B2
US 12,003,025 · App. 17/154,854 · Granted Jun 4, 2024

Selectively shielded radio frequency modules

Inventors: Hoang Mong Nguyen (Fountain Valley, CA); Anthony James LoBianco (Irvine, CA); Gregory Edward Babcock (Ottawa, CA); Darren Roger Frenette (Pakenham, CA); George Khoury (Ottawa, CA)
Assignee: Skyworks Solutions, Inc.
H01Q1/526H01L21/027H01L21/268H01L21/2855H01L21/28568H01L21/32051H01L21/78H01L23/498H01L23/552H01L23/66H01L24/48H01Q1/2283H01Q1/2291H01Q1/38H01Q9/42H01L2223/6611H01L2223/6644H01L2223/6655H01L2223/6677H01L2224/48091H01L2924/01022H01L2924/01029H01L2924/1421H01L2924/1815H01L2924/19107H01L2924/3025
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 12,003,025
App. No.
17/154,854
Granted
Jun 4, 2024
Kind
B2
Abstract

Aspects of this disclosure relate to methods of selectively shielded radio frequency modules. A radio frequency module can be provided with a radio frequency component and an antenna. A shielding layer can be formed over a portion of the radio frequency module such that the radio frequency component is shielded by the shielding layer and the antenna is unshielded by the shielding layer.

Claims (27)

1. A radio frequency module comprising:

an antenna on a substrate, the antenna configured to wirelessly transmit a radio frequency signal;

a radio frequency component on the substrate; and

a radio frequency shielding structure including a shielding layer and a wire bond, the shielding layer positioned over the radio frequency component, the wire bond positioned between the radio frequency component and the antenna, and the wire bond extending farther vertically from the substrate than all parts of the antenna.

2. The radio frequency module of claim 1 wherein the radio frequency shielding structure includes wire bond walls around the radio frequency component, one of the wire bond walls including the wire bond.

3. The radio frequency module of claim 1 wherein the radio frequency shielding structure includes a conformal layer extending substantially perpendicular to a surface of the substrate on which the radio frequency component is positioned.

4. The radio frequency module of claim 1 wherein the antenna is printed on the substrate.

5. The radio frequency module of claim 1 wherein the substrate is a laminate substrate that includes at least one routing layer.

6. The radio frequency module of claim 1 further comprising a protective layer over the shielding layer.

7. The radio frequency module of claim 1 wherein the antenna is configured to receive a wireless local area network signal.

8. The radio frequency module of claim 1 wherein the antenna is configured to receive a wireless personal area network signal.

9. The radio frequency module of claim 1 wherein the radio frequency component includes a front end integrated circuit.

10. The radio frequency module of claim 1 wherein the radio frequency component includes a semiconductor-on-insulator die that includes a low noise amplifier.

11. The radio frequency module of claim 1 wherein the antenna is on at least two sides of perimeter of the radio frequency component.

12. The radio frequency module of claim 1 wherein the antenna is on at least three sides of perimeter of the radio frequency component.

13. The radio frequency module of claim 1 wherein the antenna is on four sides of perimeter of the radio frequency component.

14. A system board assembly comprising:

a packaged radio frequency module including a radio frequency component on a substrate, an antenna on the substrate and configured to wirelessly transmit a radio frequency signal, and a radio frequency shielding structure including a wire bond positioned between the radio frequency component and the antenna, and the wire bond extending farther vertically from the substrate than all parts of the antenna; and

a system board on which the packaged radio frequency module is positioned, the system board including a ground contact electrically connected to the radio frequency shielding structure.

15. The system board assembly of claim 14 further comprising an electronic component on the system board, the radio frequency shielding structure configured to provide radio frequency shielding between the radio frequency component and the electronic component.

16. The system board assembly of claim 14 wherein the radio frequency shielding structure includes vias in the substrate.

17. A wireless communication device comprising:

a packaged radio frequency module including a radio frequency component on a substrate, an antenna on the substrate and configured to wirelessly transmit a radio frequency signal, and a radio frequency shielding structure including a wire bond positioned between the radio frequency component and the antenna, the wire bond extending farther vertically from the substrate than all parts of the antenna; and

a transceiver in communication with the radio frequency component.

18. The wireless communication device of claim 17 wherein the wireless communication device is configured to transmit a wireless personal area network signal from the antenna.

19. The wireless communication device of claim 17 wherein the wireless communication device is configured to transmit a wireless local area network signal from the antenna.

20. The wireless communication device of claim 17 wherein the wireless communication device is an Internet of Things device.

Continuity (5)
Continuation 16398799 · Apr 30, 2019
Continuation 15490349 · Apr 18, 2017
Provisional Application 62324768 · Apr 19, 2016
Provisional Application 62324750 · Apr 19, 2016
Related Publication 20210143542A1 · May 13, 2021
Cited By (1)
US 12,445,159