Fiber-to-fiber platform for multi-layer ferroelectric on insulator waveguide devices
A fiber-to-fiber system for multi-layer ferroelectric on insulator waveguide devices is described. The system comprises a fiber-to-chip coupler that couples light from a standard optical fiber to multi-layer ferroelectric on insulator waveguides. The multi-layer ferroelectric on insulator waveguides are integrated with electrodes to implement an optical device, an electro-optical device, or a non-linear optical device, such as an electro-optical modulator, with microwave and optical waveguide crossings compatible with packaging. A second fiber-to-chip coupler outputs the light from the multi-layer ferroelectric on insulator device to a standard optical fiber.
1. A method comprising:
forming a first insulating layer on a handle wafer;
implanting a donor wafer with ions to form a damage layer beneath the surface;
bonding the donor wafer and the handle wafer;
annealing the bonded wafers to exfoliate a first film along the ion implant damage layer;
forming a second insulating layer on the first film;
implanting a donor wafer with ions to form a damage layer beneath the surface;
bonding the donor wafer to the second insulating layer on the first film; and annealing the bonded wafers to exfoliate a second film along the ion implant damage layer,
wherein a non-ferroelectric thin film material is formed on the first or second insulating layers by deposition, in lieu of exfoliation, resulting in one ferroelectric thin film and one non-ferroelectric thin film, and
wherein ferroelectric and non-ferroelectric thin films are patterned into optical waveguides.
2. The method of claim 1 , wherein the donor wafer is a ferroelectric wafer, such as a lithium niobate wafer.
3. The method of claim 1 , further comprising patterning the thin film of the ferroelectric to form optical waveguides.
4. The method of claim 1 , further comprising pattering electrodes and/or microwave waveguides in proximity to the first and/or second films.
5. The method of claim 1 , wherein at least one of the handle wafer or the donor wafer are die.
6. The method of claim 1 , wherein the bow of the handle is matched to the bow of the donor.
7. The method of claim 1 , wherein the process is repeated to form multilayer optical waveguides where the number of waveguide layers is greater than two.