IP Library › Granted Patent US 12,029,021
Granted Patent B2
US 12,029,021 · App. 17/701,419 · Granted Jul 2, 2024

Static random-access memory (SRAM) bit cell with channel depopulation

Inventors: Peng Zheng (Portland, OR); Varun Mishra (Hillsboro, OR); Tahir Ghani (Portland, OR)
Assignee: Intel Corporation
H10B10/12H01L21/26513H01L21/30604H01L21/823821H01L21/823828H01L27/0922H01L27/0924H01L29/0673H01L29/0847H01L29/1037H01L29/167H01L29/36H01L29/66545
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Quick Facts
Patent No.
US 12,029,021
App. No.
17/701,419
Granted
Jul 2, 2024
Kind
B2
Abstract

Embodiments disclosed herein include transistor devices with depopulated channels. In an embodiment, the transistor device comprises a source region, a drain region, and a vertical stack of semiconductor channels between the source region and the drain region. In an embodiment, the vertical stack of semiconductor channels comprises first semiconductor channels, and a second semiconductor channel over the first semiconductor channels. In an embodiment, first concentrations of a dopant in the first semiconductor channels are less than a second concentration of the dopant in the second semiconductor channel.

Claims (39)

1. An integrated circuit structure, comprising:

a first transistor, wherein the first transistor comprises:

a first stack of semiconductor channels, wherein a first number of active channels are in the first stack; and

a second transistor, wherein the second transistor comprises:

a second stack of semiconductor channels, wherein the second stack comprises a second number of active channels and a depopulated channel, and wherein the second number of active channels in the second stack is smaller than the first number of active channels.

2. The integrated circuit structure of claim 1 , wherein

the depopulated channel comprises a concentration of dopants that inactivates the depopulated channel.

3. The integrated circuit structure of claim 1 , wherein a total number of channels in the second stack is equal to the first number of active channels in the first stack.

4. The integrated circuit structure of claim 1 , wherein the depopulated channel comprises a dopant concentration of approximately 1e19 cm-3 or greater of a dopant of a first conductivity type that is opposite of a second conductivity type of the second transistor.

5. The integrated circuit structure of claim 1 , wherein the depopulated channel is above the plurality of active channels.

6. The integrated circuit structure of claim 1 , wherein a topmost active channel of the second transistor is aligned with a topmost active channel of the first transistor, and wherein the depopulated channel of the second transistor is adjacent to a bottommost active channel of the first transistor.

7. The integrated circuit structure of claim 1 , wherein the first transistor and the second transistor are nanoribbon or nanowire transistors.

8. A computing device, comprising:

a board;

an electronic package coupled to the board; and

a die electrically coupled to the electronic package, wherein the die comprises:

a first transistor, wherein the first transistor comprises:

a first stack of semiconductor channels, wherein a first number of active channels are in the first stack; and

a second transistor, wherein the second transistor comprises:

a second stack of semiconductor channels, wherein the second stack comprises a second number of active channels and a depopulated channel, and wherein the second number of active channels in the second stack is smaller than the first number of active channels.

9. The computing device of claim 8 , wherein the depopulated channel comprises a concentration of dopants that inactivates the depopulated channel, and wherein a total number of channels in the second stack is equal to the first number of active channels in the first stack.

10. The computing device of claim 8 , wherein a topmost active channel of the second transistor is aligned with a topmost active channel of the first transistor, and wherein the depopulated channel of the second transistor is adjacent to a bottommost active channel of the first transistor.

11. The computing device of claim 8 , further comprising:

a memory coupled to the board.

12. The computing device of claim 8 , further comprising:

a communication chip coupled to the board.

13. An integrated circuit structure, comprising:

a first transistor, wherein the first transistor comprises:

a first stack of semiconductor channels, wherein a first number of active channels are in the first stack; and

a second transistor, wherein the second transistor comprises:

a second stack of semiconductor channels, wherein a second number of active channels in the second stack is smaller than the first number of active channels, wherein a topmost active channel of the second transistor is aligned with a topmost active channel of the first transistor, and wherein a depopulated region of the second transistor is adjacent to a bottommost active channel of the first transistor.

14. A computing device, comprising:

a board;

an electronic package coupled to the board; and

a die electrically coupled to the electronic package, wherein the die comprises:

a first transistor, wherein the first transistor comprises:

a first stack of semiconductor channels, wherein a first number of active channels are in the first stack; and

a second transistor, wherein the second transistor comprises:

a second stack of semiconductor channels, wherein a second number of active channels in the second stack is smaller than the first number of active channels, wherein a topmost active channel of the second transistor is aligned with a topmost active channel of the first transistor, and wherein a depopulated region of the second transistor is adjacent to a bottommost active channel of the first transistor.

Continuity (2)
Division 16827570 · Mar 23, 2020
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