Fully interconnected heterogeneous multi-layer reconstructed silicon device
Reconstructed 3DIC structures and methods of manufacture are described. In an embodiment, one or more dies in each package level of a 3DIC are both functional chips and/or stitching devices for two or more dies in an adjacent package level. Thus, each die can function as a communication bridge between two other dies/chiplets in addition to performing a separate chip core function.
1. A reconstructed three dimensional integrated circuit (3DIC) structure comprising:
a first package level including a first plurality of dies;
a second package level including a second plurality of dies bonded to the first package level with a plurality of microbumps; and
a communication path that travels up and down between the first package level and the second package level, wherein a first group of one or more dies in the first plurality of dies function as both functional dies and stitching devices for two or more of the second plurality of dies; and a second group of one or more dies in the second plurality of dies function as both functional dies and stitching devices for two or more of the first plurality of dies, wherein each of the one or more dies of the first group of one or more dies and each of the one or more dies of the second group of one or more dies includes a corresponding chip core function selected from the group consisting of computing, memory, analog/mixed signal I/O, a power amplifier (PA), radio frequency (RF), and physical layer (PHY).
2. The reconstructed 3DIC structure of claim 1 , wherein each die in the first group of dies and the second group of dies includes a corresponding communication bridge routing through which the communication path extends.
3. The reconstructed 3DIC structure of claim 2 , wherein a communication bridge routing includes one or more active devices selected from the group consisting of a repeater, a flop, a buffer, and a transistor.
4. The reconstructed 3DIC structure of claim 3 , further comprising a passive interposer chiplet in the first package level or the second package level, wherein the communication path travels through the passive interposer chiplet.
5. The reconstructed 3DIC structure of claim 3 , wherein the communication path further comprises a transceiver and a receiver.
6. The reconstructed 3DIC structure of claim 1 , wherein the second plurality of dies are bonded to a redistribution layer of the first package level with the plurality of microbumps.
7. The reconstructed 3DIC structure of claim 1 , wherein the first plurality of dies is embedded in a first polymer gap fill material.
8. The reconstructed 3DIC structure of claim 7 , wherein the second plurality of dies is embedded in a second polymer gap fill material.
9. The reconstructed 3DIC structure of claim 1 , wherein the first plurality of dies is embedded in a first silicon gap fill material.
10. The reconstructed 3DIC structure of claim 9 , wherein the second plurality of dies is embedded in a second silicon gap fill material.
11. The reconstructed 3DIC structure of claim 1 , further comprising a plurality of through silicon vias (TSVs) extending through the second plurality of dies.
12. The reconstructed 3DIC structure of claim 11 , further comprising:
a plurality of landing pads coupled with the plurality of TSVs; and
a plurality of solder bumps attached to the plurality of landing pads.
13. The reconstructed 3DIC structure of claim 11 , further comprising a first plurality of TSVs extending through the first plurality of dies.
14. The reconstructed 3DIC structure of claim 13 , further comprising a third plurality of dies bonded to the first plurality of dies.
15. The reconstructed 3DIC structure of claim 1 , wherein one of the first plurality of dies includes the RF chip core function.
16. The reconstructed 3DIC structure of claim 1 , wherein each of the one or more dies of the first group of one or more dies and each of the one or more dies of the second group of one or more dies includes different chip core functions.
17. The reconstructed 3DIC structure of claim 1 , wherein each of the one or more dies of the first group of one or more dies and each of the one or more dies of the second group of one or more dies includes same chip core functions.
18. The reconstructed 3DIC structure of claim 1 , wherein the first group of one or more dies in the first plurality of dies and the second group of one or more dies in the second plurality of dies each include one or more chiplets.
19. The reconstructed 3DIC structure of claim 1 , wherein the first group of one or more dies in the first plurality of dies functions as a communication bridge between two chiplets in the second group of one or more dies in the second plurality of dies.