Method for detecting temperature of thermal chamber
The present application provides a method for detecting temperature of thermal chamber comprising: conducting a thermal treatment at a predicted temperature to a selected silicon wafer within a thermal chamber, wherein the predicted temperature comprises plural temperature points set in order; obtaining a haze value corresponding to the predicted temperature; obtaining a linear relationship I between the temperature and the haze; polishing and washing the silicon wafer; conducting a thermal treatment at a predicted temperature to the polished silicon wafer within the thermal chamber; obtaining a linear relationship II between the temperature and the haze; calculating a difference of the haze at same temperature point between the two thermal treatments, and obtaining an actual temperature difference of the thermal chamber based on the difference of the haze. The present application increases efficiency and accuracy of temperature detection of the thermal chamber, reduce fluctuations caused by silicon wafer thickness and resistivity, increase utilization of silicon wafer, and reduce cost.
1. A method for detecting temperature of a thermal chamber comprising:
Step S1: conducting a thermal treatment at a predicted temperature to a selected silicon wafer within a first thermal chamber, wherein the predicted temperature comprises plural temperature points set in order; obtaining haze values corresponding to the predicted temperature points; obtaining a linear relationship I between the temperature of the first thermal chamber and the haze of the wafer;
Step S2: polishing and washing the wafer;
Step S3: repeating the Step S1 to conduct the thermal treatment to the polished wafer within a second thermal chamber; obtaining a linear relationship II between the temperature of the second thermal chamber and the haze of the polished wafer; and
Step S4: calculating a difference of the haze at the same temperature point between the Steps S1 and S3, and obtaining an actual temperature difference of the different thermal chambers based on the difference of the haze.
2. The method of claim 1 , wherein, in the Step 4, the difference of the haze divided by a linear coefficient makes the actual temperature difference of the different thermal chambers, wherein the linear coefficient is selected from that of the linear relationship I or the linear relationship II, provided that the coefficient of determination of the selected linear relationship more closes to 1.
3. The method of claim 1 , wherein the predicted temperature comprises 1100° C.-1200° C.
4. The method of claim 1 , wherein the plural temperature points set in order have an interval of 20° C.
5. The method of claim 1 , wherein the haze of the wafer is detected by a particle measuring apparatus.
6. The method of claim 1 , wherein the polishing comprises mechanical polishing or chemical polishing.
7. The method of claim 1 , wherein the polishing removes a thickness of 0.1-0.5 μm from the wafer surface.