Etch profile control of gate contact opening
The present disclosure includes an ion implantation step that creates doped regions in gate dielectric caps. The doped regions have a different material composition and hence a different etch selectivity than un-doped regions in the gate dielectric caps. The doped regions thus allow for slowing down a subsequent etching process of forming gate contact openings.
1. A device, comprising:
a gate structure over a substrate;
source/drain regions at opposite sides of the gate structure;
source/drain contacts over the source/drain regions, respectively;
a gate dielectric cap over the gate structure and having opposite sidewalls interfacing the source/drain contacts, wherein the gate dielectric cap has a doped region extending from a top surface into the gate dielectric cap;
a contact etch stop layer over the source/drain contacts and the gate dielectric cap, wherein the doped region of the gate dielectric cap is thinner than the contact etch stop layer when measured in a vertical direction perpendicular to the substrate;
an interlayer dielectric (ILD) layer over the contact etch stop layer; and
a gate contact extending through the ILD layer, the contact etch stop layer, and the doped region of the gate dielectric cap to electrically connect with the gate structure.
2. The device of claim 1 , wherein the doped region of the gate dielectric cap includes oxygen.
3. The device of claim 1 , wherein the doped region of the gate dielectric cap has an oxygen concentration gradient.
4. The device of claim 1 , wherein the doped region of the gate dielectric cap has an oxygen-to-nitrogen atomic ratio gradient.
5. The device of claim 1 , wherein the doped region of the gate dielectric cap includes oxygen-doped silicon nitride.
6. The device of claim 1 , wherein the gate dielectric cap has an un-doped region below the doped region.
7. The device of claim 6 , wherein the doped region of the gate dielectric cap has a higher oxygen concentration than the un-doped region of the gate dielectric cap.
8. The device of claim 6 , wherein the doped region of the gate dielectric cap is thinner than the un-doped region of the gate dielectric cap.
9. The device of claim 1 , wherein the doped region is in contact with the source/drain contacts.
10. A device, comprising:
a source region and a drain region over a substrate;
a channel region between the source region and the drain region;
a gate structure over the channel region;
a dielectric cap over the gate structure, the dielectric cap having a doped region and an un-doped region below the doped region, wherein the doped region of the dielectric cap has an oxygen concentration gradient; and
a source contact and a drain contact respectively over the source region and the drain region, wherein the source contact is in contact with a first side of the doped region and a first side of the un-doped region, and the drain contact is in contact with a second side of the doped region and a second side of the un-doped region.
11. The device of claim 10 , further comprising:
a metal cap between the gate structure and the dielectric cap.
12. The device of claim 11 , wherein the metal cap includes fluorine-free tungsten.
13. The device of claim 11 , wherein the metal cap has a cross-sectional profile different from a cross-sectional profile of a metal layer of the gate structure.
14. The device of claim 10 , further comprising:
gate spacers on opposite sides of the gate structure, wherein the gate structure has a top surface lower than top surfaces of the gate spacers.
15. The device of claim 14 , wherein the doped region of the dielectric cap overlaps the gate spacers.
16. The device of claim 10 , wherein the doped region of the dielectric cap has a higher oxygen concentration than the un-doped region of the dielectric cap.
17. A device, comprising:
a gate structure over a substrate;
a source region and a drain region at opposite sides of the gate structure;
a source contact over the source region;
a drain contact over the drain region; and
a dielectric structure between the source contact and the drain contact, wherein the dielectric structure has an oxygen concentration gradient from a top surface of the dielectric structure to a position below the top surface of the dielectric structure.
18. The device of claim 17 , wherein an oxygen concentration of the dielectric structure decreases as a distance from a top surface of the dielectric structure increases.
19. The device of claim 17 , further comprising:
a gate contact extending through the dielectric structure.
20. The device of claim 17 , further comprising:
gate spacers on opposite sides of the gate structure, wherein the gate spacers are in contact with the source contact and the drain contact, respectively.