Circuit board assembly and electronic device
A circuit board assembly is applied to the field of electronic communications technologies to resolve a prior-art heat dissipation problem of a circuit board. The circuit board assembly combines, on a second circuit board, low-speed signals transmitted between a plurality of I/O modules and an IC chip, and then transmits the combined low-speed signals to the IC chip by using a low-speed cable. A low-speed signal sent by the IC chip to the plurality of I/O modules is extended to a plurality of low-speed signals on the second circuit board, and then the plurality of low-speed signals are separately sent to the plurality of I/O modules. This may be applied to a scenario in which a relatively large quantity of electronic components need to be disposed on a circuit board.
1. A circuit board assembly, comprising a first circuit board, a second circuit board, one or more low-speed cables, a plurality of high-speed cables, an integrated circuit (IC) chip, a chip heat sink, a plurality of high-speed connectors, a plurality of input/output (I/O) modules, and a monitoring module, wherein the IC chip, and the high-speed connectors are installed on the first circuit board, the plurality of I/O modules and the monitoring module are installed on the second circuit board, the IC chip is connected to the monitoring module by using the low-speed cable, and the monitoring module is connected to the plurality of I/O modules by using an intra-board cable;
the monitoring module is configured to: extend one low-speed signal received from the low-speed cable into a plurality of low-speed signals, and correspondingly send the plurality of low-speed signals to the plurality of I/O modules; and is configured to: combine the plurality of low-speed signals from the plurality of I/O modules, and then send the combined low-speed signals to the IC chip by using the low-speed cable;
each I/O module is connected to a corresponding high-speed connector of the first circuit board by using one or more high-speed cables, the corresponging high-speed connector is connected to the IC chip by using an intra-board cable of the first circuit board, the chip heat sink is attached to a surface of the IC chip, the corresponging high-speed connector of the first circuit board is disposed on a rear side of the first circuit board, the rear side of the first circuit board is a side opposite to a side on which the IC chip is located;
a plane parallel to a front side of the first circuit board is used as a first reference plane, a plane parallel to a rear side of the first circuit board is used as a second reference plane, or a plane perpendicular to a thickness direction of the first circuit board is used as a third reference plane; and a projection of the corresponging high-speed connector on at least one of the reference planes partially or completely falls within a projection of the chip heat sink on at least one of the reference planes.
2. The circuit board assembly of claim 1 , wherein the circuit board assembly further comprises a low-speed connector, the low-speed connector is installed on the first circuit board, and the low-speed connector is connected to the IC chip by using another intra-board cable of the first circuit board.
3. The circuit board assembly of claim 1 , wherein the one low-speed signal includes a reset signal, a low power mode setting signal, an enabling signal, an optical module in-position signal, an optical module error reporting signal, and/or an interrupt signal of an optical module.
4. The circuit board assembly of claim 1 , wherein the one low-speed signal includes management service data.
5. The circuit board assembly of claim 1 , wherein a cable-side connector is disposed at an end of each high-speed cable, and the cable-side connectors cooperate with respective ones of the high-speed connectors.
6. An electronic device, comprising a housing, a heat dissipation apparatus, and a plurality of circuit board assemblies, wherein the circuit board assemblies are installed inside the housing, and the heat dissipation apparatus is configured to dissipate heat for the circuit board assemblies;
wherein each circuit board assembly comprises a first circuit board, a second circuit board, one or more low-speed cables, a plurality of high-speed cables, an integrated circuit (IC) chip, a chip heat sink, a plurality of high-speed connectors, a plurality of input/output (I/O) modules, and a monitoring module, wherein the IC chip, and the high-speed connectors are installed on the first circuit board, the plurality of I/O modules and the monitoring module are installed on the second circuit board, the IC chip is connected to the monitoring module by using the low-speed cable, and the monitoring module is connected to the plurality of I/O modules by using an intra-board cable;
the monitoring module is configured to: extend one low-speed signal received from the low-speed cable into a plurality of low-speed signals, and correspondingly send the plurality of low-speed signals to the plurality of I/O modules; and is configured to: combine the plurality of low-speed signals from the plurality of I/O modules, and then send the combined low-speed signals to the IC chip by using the low-speed cable;
each I/O module is connected to a corresponding high-speed connector of the first circuit board by using one or more high-speed cables, the corresponging high-speed connector is connected to the IC chip by using an intra-board cable of the first circuit board, the chip heat sink is attached to a surface of the IC chip, the corresponging high-speed connector of the first circuit board is disposed on a rear side of the first circuit board, the rear side of the first circuit board is a side opposite to a side on which the IC chip is located;
a plane parallel to a front side of the first circuit board is used as a first reference plane, a plane parallel to a rear side of the first circuit board is used as a second reference plane, or a plane perpendicular to a thickness direction of the first circuit board is used as a third reference plane; and a projection of the corresponging high-speed connector on at least one of the reference planes partially or completely falls within a projection of the chip heat sink on at least one of the reference planes.
7. The electronic device of claim 6 , wherein the circuit board assembly further comprises a low-speed connector, the low-speed connector is installed on the first circuit board, and the low-speed connector is connected to the IC chip by using another intra-board cable of the first circuit board.
8. The electronic device of claim 6 , wherein the one low-speed signal includes a reset signal, a low power mode setting signal, an enabling signal, an optical module in-position signal, an optical module error reporting signal, and/or an interrupt signal of an optical module.
9. The electronic device of claim 6 , wherein the one low-speed signal includes management service data.
10. The electronic device of claim 6 , wherein a cable-side connector is disposed at an end of each high-speed cable, and the cable-side connectors cooperate with respective ones of the high-speed connectors.