Systems and methods for thermally regulating sensor operation

1. A thermal regulation system comprising:

an inertial measurement unit (IMU);

one or more temperature adjusting devices in thermal communication with the IMU, and configured to adjust a temperature of the IMU from an initial temperature to a predetermined temperature;

and

a shared substrate configured to bear a weight of the IMU and the one or more temperature adjusting devices, the shared substrate including a metallic board, and the IMU and the one or more temperature adjusting devices being disposed on a same surface of the shared substrate.

2. The system of claim 1 , wherein:

the shared substrate includes a printed circuit board (PCB); and

the IMU and the one or more temperature adjusting devices are in electrical communication with one or more electrical contacts of the PCB.

3. The system of claim 1 , wherein a measurement provided by the IMU is adjusted based on a known bias error of the IMU at the predetermined temperature, to reduce error.

4. The system of claim 1 , wherein:

the IMU is one of a plurality of IMUs, and the plurality of IMUs are configured to collect different measurements to be combined by sensor fusion, to obtain a combined measurement.

5. The system of claim 1 , wherein the one or more temperature adjusting devices include a plurality of temperature adjusting devices uniformly distributed around the IMU in a three-dimensional or a two-dimensional space.

6. The system of claim 1 , further comprising:

a filler provided in a space between the IMU and at least one temperature adjusting device of the one or more temperature adjusting devices, wherein the filler has a thermal conductivity that is at least two times of a thermal conductivity of air.

7. The system of claim 6 , wherein the filler isolates the IMU from debris.

8. The system of claim 1 , further comprising:

a filler provided in a space between the IMU and at least one temperature adjusting device of the one or more temperature adjusting devices, wherein:

the filler encapsulates the IMU or the at least one temperature adjusting device; and/or

the filler is configured to facilitate heat transfer between the IMU and the at least one temperature adjusting device; and/or

the filler is made of a material including silicone.

9. The thermal regulation system of claim 1 , wherein the metallic board included in the shared substrate is configured to bear the weight of the IMU and the one or more temperature adjusting devices.

10. The thermal regulation system of claim 1 , further comprising:

a filler provided in a space between the IMU and at least one temperature adjusting device of the one or more temperature adjusting devices, wherein the filler encapsulates the IMU and the at least one temperature adjusting device.

11. A method of regulating a temperature of an inertial measurement unit (IMU), comprising:

sensing an initial temperature of the IMU with a temperature sensor;

providing a thermal stimulus from one or more temperature adjusting devices to adjust a temperature of the IMU from the initial temperature to a predetermined temperature, wherein a shared substrate is configured to bear a weight of the IMU and the one or more temperature adjusting devices, the shared substrate includes a metallic board, and the IMU and the one or more temperature adjusting devices are disposed on a same surface of the shared substrate; and

adjusting a measurement provided by the IMU based on a known bias error of the IMU at the predetermined temperature, to reduce error.

12. The method of claim 11 , wherein at least one of the one or more temperature adjusting devices is a heater.

13. The method of claim 11 , wherein a filler is provided in a space between the IMU and at least one temperature adjusting device of the one or more temperature adjusting devices, and the filler has a thermal conductivity that is at least two times of a thermal conductivity of air.

14. The method of claim 11 , wherein:

the shared substrate includes a printed circuit board (PCB); and

the IMU and the one or more temperature adjusting devices are in electrical communication with one or more electrical contacts of the PCB.

15. A movable object comprising:

an inertial measurement unit (IMU);

one or more temperature adjusting devices in thermal communication with the IMU, and configured to adjust a temperature of the IMU from an initial temperature to a predetermined temperature;

and

a shared substrate configured to bear a weight of the IMU and the one or more temperature adjusting devices, and the IMU and the one or more temperature adjusting devices being disposed on a same surface of the shared substrate.

16. The movable object of claim 15 , wherein:

the shared substrate includes a printed circuit board (PCB); and

the IMU and the one or more temperature adjusting devices are in electrical communication with one or more electrical contacts of the PCB.

17. The movable object of claim 15 , wherein a measurement provided by the IMU is adjusted based on a known bias error of the IMU at the predetermined temperature, to reduce error.

18. The movable object of claim 15 , wherein:

the IMU is one of a plurality of IMUs, and the plurality of IMUs are configured to collect different measurements to be combined by sensor fusion, to obtain a combined measurement.

19. The movable object of claim 15 , wherein the one or more temperature adjusting devices include a plurality of temperature adjusting devices uniformly distributed around the IMU in a three-dimensional or a two-dimensional space.

20. The movable object of claim 15 , further comprising:

a filler provided in a space between the IMU and at least one temperature adjusting device of the one or more temperature adjusting devices, wherein the filler has a thermal conductivity that is at least two times of a thermal conductivity of air.