IP Library Granted Patent US 12,087,552
Granted Patent B2
US 12,087,552 · App. 17/299,721 · Granted Sep 10, 2024

Plasma processing apparatus and plasma processing method

Inventor: Masaki Hirayama (Tokyo, JP)
Assignees: TOKYO ELECTRON LIMITED; TOHOKU UNIVERSITY
H01J37/3244H01J37/32082
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Quick Facts
Patent No.
US 12,087,552
App. No.
17/299,721
Granted
Sep 10, 2024
Kind
B2
Abstract

A plasma processing apparatus according to an exemplary embodiment includes a processing container, a stage, an upper electrode, a shower plate, and a waveguide, wherein the stage is provided inside the processing container, the shower plate is provided above the stage with a space in the processing container interposed between the shower plate and the stage, the upper electrode is provided above the shower plate, the waveguide includes an end portion and guides radio-frequency waves in a VHF band or a UHF band therethrough, the end portion is disposed to face the space, and emits the radio-frequency waves to the space, the shower plate includes a plurality of pillars and is made of a dielectric material, gaps are provided inside the shower plate, and the plurality of pillars are disposed in the gaps, respectively.

Claims (15)

1. A plasma processing apparatus comprising:

a processing container, a stage, an upper electrode, a shower plate, and a waveguide,

wherein the stage is provided inside the processing container,

the shower plate is provided above the stage with a space in the processing container interposed between the shower plate and the stage,

the upper electrode is provided above the shower plate,

the waveguide includes an end portion and guides radio-frequency waves in a VHF band or a UHF band therethrough,

the end portion is disposed to face the space, and emits the radio-frequency waves to the space,

the shower plate includes a plurality of pillars and is made of a dielectric material,

gaps are provided inside the shower plate,

the plurality of pillars are disposed in the gaps, respectively, and

the shower plate has a distribution of diameters and densities of the plurality of pillars in which at least one selected from the group of the diameters and densities of the plurality of pillars is decreased in a direction extending from an end portion toward a central portion of the shower plate.

2. A plasma processing method of performing a plasma processing on a workpiece using a plasma processing apparatus provided with a processing container, a stage, an upper electrode, a shower plate, and a waveguide,

wherein the stage is provided inside the processing container, the shower plate is provided above the stage with a space in the processing container interposed between the shower plate and the stage, the upper electrode is provided above the shower plate, the waveguide includes an end portion and guides radio-frequency waves in a VHF band or a UHF band therethrough, the end portion is disposed to face the space, and emits the radio-frequency waves to the space, the shower plate includes a plurality of pillars and is made of a dielectric material, and the shower plate has a distribution of diameters and densities of the plurality of pillars in which at least one selected from the group of the diameters and densities of the plurality of pillars is decreased in a direction extending from an end portion toward a central portion of the shower plate,

the plasma processing method comprising:

performing the plasma processing in a state in which the plurality of pillars are disposed in respective gaps provided in the shower plate.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 10, 2021
From: HIRAYAMA, MASAKI
To: TOKYO ELECTRON LIMITED; TOHOKU UNIVERSITY
Reel/Frame 056501/0820 →
Priority Claims (1)
JP 2018-229228 · Dec 6, 2018 · national
Continuity (1)
Related Publication 20220165538A1 · May 26, 2022
Cited By (3)
US 12,437,972 US 12,488,964 US 12,620,563