Device and method for joining substrates

1. A method for bonding a first substrate to a second substrate at respective contact surfaces of the first and second substrates, said method comprising:

mounting the first substrate on a first mounting surface of a first substrate holder and mounting the second substrate on a second mounting surface of a second substrate holder, wherein the first and second substrate holders are arranged in a chamber;

contacting the respective contact surfaces of the first and second substrates at a bond initiation surface;

bonding the first substrate to the second substrate from a bond initiation surface to the centre of the first and second substrates; and

increasing a chamber pressure in the chamber:

(i) after the contacting of the respective contact surfaces of the first and second substrates at the bond initiation surface; and/or

(ii) during said bonding of the first substrate to the second substrate.

2. The method according to claim 1 , wherein the bond initiation surface is circular.

3. The method according to claim 1 , wherein the bond initiation surface is arranged at the circumferential edge of at least one of the respective contact surfaces of the first and second substrates.

4. The method according claim 1 , wherein:

prior to the contacting of the respective contact surfaces of the first and second substrates at the bond initiation surface, a concave deformation of the first substrate takes place with respect to the second substrate.

5. The method according to claim 4 , wherein the concave deformation of the first substrate takes place with respect to the second substrate by mounting the first substrate on a correspondingly concavely curved first mounting surface.

6. The method according to claim 1 , wherein the bond initiation surface is constructed to run in an annular manner.

7. The method according to claim 6 , wherein the bond initiation surface runs in a circular manner.

8. A method for bonding a first substrate to a second substrate at respective contact surfaces of the first and second substrates, said method comprising:

mounting the first substrate on a first mounting surface of a first substrate holder and mounting the second substrate on a second mounting surface of a second substrate holder, wherein the first and second substrate holders are arranged in a chamber:

contacting the respective contact surfaces of the first and second substrates at a bond initiation surface; and

bonding the first substrate to the second substrate from a bond initiation surface to the centre of the first and second substrates,

wherein the bond initiation surface is constructed to run in an annular manner, and

wherein the bond initiation surface runs concentrically to the centre of the first and second substrates.

9. The method according to claim 1 , wherein the bond initiation surface has a closed circumference.

10. The method according to claim 1 , wherein the first substrate and/or the second substrate are fixed at a rear on the first mounting surface and/or the second mounting surface.

11. The method according to claim 10 , wherein the first substrate and/or the second substrate are fixed at a rear on the first mounting surface and/or the second mounting surfaces, exclusively in a region of side edges of the first and second contact surfaces.

12. A device for bonding a first substrate to a second substrate at respective contact surfaces of the first and second substrates, said device comprising:

a first mounting surface of a first substrate holder for mounting the first substrate;

a second mounting surface of a second substrate holder for mounting the second substrate;

a chamber, in which the first and second substrate holders are arranged;

means for contacting the respective contact surfaces of the first and second substrates at a bond initiation surface;

means for bonding the first substrate to the second substrate from the bond initiation surface to the centre of the first and second substrates; and

means for increasing a chamber pressure in the chamber:

(i) after the contacting of the respective contact surfaces of the first and second substrates at the bond initiation surface; and/or

(ii) during said bonding of the first substrate to the second substrate.