Coil device

1. A coil device comprising:

a first conductor including ( 1 ) a first body having a U-shape as viewed from a first direction and ( 2 ) first mounting parts continuous to ends of the first body and configured to be connected to a mounting substrate;

a second conductor including ( 1 ) a second body having the U-shape as viewed from the first direction and disposed inside the first body so as to face an inner surface of the first body and ( 2 ) second mounting parts continuous to ends of the second body and configured to be connected to the mounting substrate; and

a core for internally arranging the first body and the second body,

wherein an insulating layer is formed at least between the inner surface of the first body and an outer surface of the second body,

the first mounting parts at least partially extend apart from each other as viewed from the first direction,

the second mounting parts at least partially extend so as to approach each other as viewed from the first direction, and

outer surfaces of the first mounting parts and the second mounting parts are configured to be disposed parallel to the mounting substrate.

2. The coil device according to claim 1 , wherein

the second conductor is made of a flat wire, and

the insulating layer is made of an insulating film formed on a surface of the second conductor.

3. The coil device according to claim 2 , wherein the first conductor and the second conductor are adhered via a fusion layer formed by fusing the insulating layer formed on the surface of the second conductor.

4. The coil device according to claim 1 , wherein the first conductor and the second conductor are adhered via a fusion layer formed by fusing the insulating layer formed on a surface of the second conductor.

5. The coil device according to claim 1 , wherein the insulating layer is formed between the core and the first conductor or the second conductor.

6. The coil device according to claim 1 , wherein the first conductor is made of a conductive plate with a plating layer formed on a surface of the conductive plate.

7. The coil device according to claim 1 , wherein

the second conductor includes a mount facing surface capable of facing the mounting substrate,

the mount facing surface consists of a joinable surface not including the insulating layer and a non-joinable surface including the insulating layer, and

the non-joinable surface is located closer to the first conductor than the joinable surface.

8. The coil device according to claim 7 , wherein the joinable surface includes a standing part standing from the mounting substrate.

9. The coil device according to claim 1 , wherein

an outer bending part bending outward is provided at an end of the first conductor,

an inner bending part bending inward is provided at an end of the second conductor, and

a radius of curvature of an inner surface of the outer bending part is larger than that of an outer surface of the inner bending part.

10. The coil device according to claim 1 , wherein a cross-sectional area of the first conductor perpendicular to its extending direction is larger than that of the second conductor perpendicular to its extending direction.

11. The coil device according to claim 1 , wherein a bottom surface of the core is disposed away from the mounting substrate.

12. The coil device according to claim 1 , wherein an insulating coating layer is provided at least on a bottom surface of the core.

13. The coil device according to claim 1 , wherein the first mounting parts and the second mounting parts are insulated by a resin spacer.

14. The coil device according to claim 1 , wherein the core has a first core and a second core combined with the first core,

a gap is formed between the first core and the second core, and

an outer surface of the first body is provided with a notch extending along the gap at a position corresponding to the gap.