Double-side-cooling power module
A power module, having a bottom substrate, a device substrate arranged on the bottom substrate and an inductor assembly arranged on the device substrate. The device substrate having a first power device chip and a second power device chip embedded within the device substrate. Each power device chip has a first surface and a second surface. The first surface of each power device chip is covered by a top heat layer, and the second surface of each power device chip has a plurality of pins or pads exposed on the second surface of the device substrate, and connected to the bottom substrate.
1 . A power module, comprising:
a device substrate having a first surface and a second surface opposite to the first surface; and
an inductor assembly arranged on the device substrate,
wherein the device substrate comprises:
at least one power device chip embedded within the device substrate; and
at least one pair of connecting pillars embedded within the device substrate, wherein the at least one pair of connecting pillars comprises a first connecting pillar and a second connecting pillar arranged at opposite sides of the at least one power device chip; wherein
the at least one power device chip has a first surface covered by a top heat layer exposed on the first surface of the device substrate, and a second surface comprising a plurality of pins exposed on the second surface of the device substrate, and wherein the first surface and the second surface of the at least one power device chip are opposite,
and wherein the inductor assembly comprises:
a magnetic core having a first surface and a second surface opposite to the first surface of the magnetic core; and
at least one winding passing through the magnetic core, wherein the at least one winding has a first portion, a second portion and a middle portion connecting the first portion and the second portion, wherein the first portion and the second portion of the at least one winding are vertical to the first surface of the magnetic core, and the middle portion of the at least one winding is parallel to the first surface of the magnetic core, and wherein the first portion and the second portion of the at least one winding respectively has an end connected out of the second surface of the magnetic core.
2 . The power module of claim 1 , further comprising a bottom substrate having a first surface attached to the second surface of the device substrate and a second surface having a plurality of pads, wherein the first surface and the second surface of the bottom substrate are opposite, and wherein some of the plurality of pins of the at least one power device chip are electrically connected to some of the plurality of pads on the second surface of the bottom substrate respectively.
3 . The power module of claim 2 , wherein the at least one power device chip comprises:
an input pin;
a switching pin;
a ground pin;
a driving pin;
a first switch having a first terminal coupled to the input pin, a second terminal coupled to the switching pin, and a control terminal configured to receive a first driving signal;
a second switch having a first terminal coupled to the switching pin, a second terminal coupled to the ground pin, and a control terminal configured to receive a second driving signal; and
a driver coupled to the driving pin to receive a phase control signal, and to provide the first driving signal and the second driving signal based on the phase control signal;
wherein the plurality of pads on the second surface of the bottom substrate are zoned into an input pad area, a ground pad area, a signal pad area, a first output voltage pad area and a second output voltage pad area, and wherein each one of the input pad area, the ground pad area, the signal pad area, the first output voltage pad area and the second output voltage pad area comprises at least one pad;
the input pin of the at least one power device chip is electrically connected to the at least one pad of the input pad area on the second surface of the bottom substrate;
the ground pin of the at least one power device chip is electrically connected to the at least one pad of the ground pad area on the second surface of the bottom substrate; and
the driving pin of the at least one power device chip is electrically connected to the at least one pad of the signal pad area on the second surface of the bottom substrate.
4 . The power module of claim 2 , wherein:
the first connecting pillar has a first end connected to one end of the at least one winding and a second end connected out of the second surface of the device substrate to the bottom substrate; and
the second connecting pillar has a first end connected to the other end of the at least one winding and a second end connected out of the second surface of the device substrate to the bottom substrate.
5 . The power module of claim 1 , wherein the inductor assembly comprises at least one heat sink layer partially wrapping the magnetic core, and wherein the at least one heat sink layer has a portion disposed on the second surface of the magnetic core, and is attached to the top heat layer covering the at least one power device chip.
6 . The power module of claim 1 , wherein the inductor assembly comprises at least one heat sink layer partially wrapping the magnetic core, and wherein the at least one heat sink layer has a portion disposed on the second surface of the magnetic core, and is connected to the top heat layer covering the at least one power device chip via a heat conductive contact.
7 . The power module of claim 1 , wherein the inductor assembly comprises at least one heat sink layer having a “C” shape partially wrapping the magnetic core, and wherein the at least one heat sink layer has a first portion partially covering the first surface of the magnetic core, a second portion partially covering the second surface of the magnetic core and meanwhile attached to the top heat layer covering the at least one power device chip, and a third portion partially covering a third surface of the magnetic core, and wherein the third surface of the magnetic core is vertical to the first surface and the second surface of the magnetic core, and is parallel to the middle portion of the at least one winding.